JPH01245059A - 賦形可能な高誘電性熱硬化性組成物 - Google Patents
賦形可能な高誘電性熱硬化性組成物Info
- Publication number
- JPH01245059A JPH01245059A JP7288688A JP7288688A JPH01245059A JP H01245059 A JPH01245059 A JP H01245059A JP 7288688 A JP7288688 A JP 7288688A JP 7288688 A JP7288688 A JP 7288688A JP H01245059 A JPH01245059 A JP H01245059A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- highly dielectric
- thermosetting composition
- composition
- dielectric constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 37
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 30
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 24
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 239000000178 monomer Substances 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 5
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 2
- 239000011224 oxide ceramic Substances 0.000 claims description 2
- 238000010298 pulverizing process Methods 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 abstract description 9
- 239000003990 capacitor Substances 0.000 abstract description 9
- 239000002904 solvent Substances 0.000 abstract description 6
- 239000003999 initiator Substances 0.000 abstract description 4
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 abstract description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 abstract 1
- 239000011342 resin composition Substances 0.000 description 14
- 239000003985 ceramic capacitor Substances 0.000 description 7
- -1 poly(2,6-dimethyl-1,4-phenylene oxide) Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000012456 homogeneous solution Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- YKTNISGZEGZHIS-UHFFFAOYSA-N 2-$l^{1}-oxidanyloxy-2-methylpropane Chemical group CC(C)(C)O[O] YKTNISGZEGZHIS-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920013623 Solprene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229960001701 chloroform Drugs 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002852 poly(2,6-dimethyl-1,4-phenylene oxide) polymer Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 101150075675 tatC gene Proteins 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Inorganic Insulating Materials (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288688A JPH01245059A (ja) | 1988-03-27 | 1988-03-27 | 賦形可能な高誘電性熱硬化性組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7288688A JPH01245059A (ja) | 1988-03-27 | 1988-03-27 | 賦形可能な高誘電性熱硬化性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01245059A true JPH01245059A (ja) | 1989-09-29 |
| JPH05415B2 JPH05415B2 (enExample) | 1993-01-05 |
Family
ID=13502269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7288688A Granted JPH01245059A (ja) | 1988-03-27 | 1988-03-27 | 賦形可能な高誘電性熱硬化性組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01245059A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2608616A1 (fr) * | 1986-12-23 | 1988-06-24 | Matsushita Electric Works Ltd | Composition de resine poly(oxyphenylene), procede de fabrication de cette composition, et son utilisation |
| JPH0594717A (ja) * | 1990-02-06 | 1993-04-16 | Matsushita Electric Works Ltd | 複合誘電体 |
| JPH07182921A (ja) * | 1990-12-06 | 1995-07-21 | Matsushita Electric Works Ltd | 複合誘電体およびプリント回路用基板 |
| US5962122A (en) * | 1995-11-28 | 1999-10-05 | Hoechst Celanese Corporation | Liquid crystalline polymer composites having high dielectric constant |
| US5965273A (en) * | 1997-01-31 | 1999-10-12 | Hoechst Celanese Corporation | Polymeric compositions having a temperature-stable dielectric constant |
| JP2008013694A (ja) * | 2006-07-07 | 2008-01-24 | Murata Mfg Co Ltd | 樹脂セラミック複合材料およびその製造方法、ならびに複合材料シート、フィルムコンデンサおよび積層コンデンサ |
| JP2008291214A (ja) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138448A (en) * | 1977-05-10 | 1978-12-02 | Toshiba Corp | Dielectric composition for capacitors |
| JPS5655474A (en) * | 1979-10-12 | 1981-05-16 | Sekisui Chem Co Ltd | Radiofrequency heating curable adhesive |
| JPS58141222A (ja) * | 1982-01-26 | 1983-08-22 | Unitika Ltd | 高誘電率フイルム |
| JPS59159819A (ja) * | 1983-03-02 | 1984-09-10 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS609005A (ja) * | 1983-06-27 | 1985-01-18 | 大塚化学株式会社 | 導電性チタン酸アルカリを含有する組成物及び成形物 |
| JPS60170103A (ja) * | 1984-02-14 | 1985-09-03 | 松下電器産業株式会社 | コンデンサ |
| JPS6248711A (ja) * | 1985-08-27 | 1987-03-03 | Matsushita Electric Works Ltd | 広範な誘電率を有する組成物 |
-
1988
- 1988-03-27 JP JP7288688A patent/JPH01245059A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53138448A (en) * | 1977-05-10 | 1978-12-02 | Toshiba Corp | Dielectric composition for capacitors |
| JPS5655474A (en) * | 1979-10-12 | 1981-05-16 | Sekisui Chem Co Ltd | Radiofrequency heating curable adhesive |
| JPS58141222A (ja) * | 1982-01-26 | 1983-08-22 | Unitika Ltd | 高誘電率フイルム |
| JPS59159819A (ja) * | 1983-03-02 | 1984-09-10 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS609005A (ja) * | 1983-06-27 | 1985-01-18 | 大塚化学株式会社 | 導電性チタン酸アルカリを含有する組成物及び成形物 |
| JPS60170103A (ja) * | 1984-02-14 | 1985-09-03 | 松下電器産業株式会社 | コンデンサ |
| JPS6248711A (ja) * | 1985-08-27 | 1987-03-03 | Matsushita Electric Works Ltd | 広範な誘電率を有する組成物 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2608616A1 (fr) * | 1986-12-23 | 1988-06-24 | Matsushita Electric Works Ltd | Composition de resine poly(oxyphenylene), procede de fabrication de cette composition, et son utilisation |
| JPH0594717A (ja) * | 1990-02-06 | 1993-04-16 | Matsushita Electric Works Ltd | 複合誘電体 |
| JPH07182921A (ja) * | 1990-12-06 | 1995-07-21 | Matsushita Electric Works Ltd | 複合誘電体およびプリント回路用基板 |
| US5962122A (en) * | 1995-11-28 | 1999-10-05 | Hoechst Celanese Corporation | Liquid crystalline polymer composites having high dielectric constant |
| US5965273A (en) * | 1997-01-31 | 1999-10-12 | Hoechst Celanese Corporation | Polymeric compositions having a temperature-stable dielectric constant |
| JP2008013694A (ja) * | 2006-07-07 | 2008-01-24 | Murata Mfg Co Ltd | 樹脂セラミック複合材料およびその製造方法、ならびに複合材料シート、フィルムコンデンサおよび積層コンデンサ |
| JP2008291214A (ja) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05415B2 (enExample) | 1993-01-05 |
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