JPH01227445A - バンプ付け方法 - Google Patents

バンプ付け方法

Info

Publication number
JPH01227445A
JPH01227445A JP63054550A JP5455088A JPH01227445A JP H01227445 A JPH01227445 A JP H01227445A JP 63054550 A JP63054550 A JP 63054550A JP 5455088 A JP5455088 A JP 5455088A JP H01227445 A JPH01227445 A JP H01227445A
Authority
JP
Japan
Prior art keywords
bonding
bump
lead
bumps
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63054550A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0572104B2 (https=
Inventor
Akihiro Nishimura
明浩 西村
Hajime Nishimoto
西本　肇
Yutaka Harada
豊 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Panasonic Holdings Corp
Original Assignee
Shinkawa Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Matsushita Electric Industrial Co Ltd filed Critical Shinkawa Ltd
Priority to JP63054550A priority Critical patent/JPH01227445A/ja
Publication of JPH01227445A publication Critical patent/JPH01227445A/ja
Publication of JPH0572104B2 publication Critical patent/JPH0572104B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP63054550A 1988-03-08 1988-03-08 バンプ付け方法 Granted JPH01227445A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63054550A JPH01227445A (ja) 1988-03-08 1988-03-08 バンプ付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63054550A JPH01227445A (ja) 1988-03-08 1988-03-08 バンプ付け方法

Publications (2)

Publication Number Publication Date
JPH01227445A true JPH01227445A (ja) 1989-09-11
JPH0572104B2 JPH0572104B2 (https=) 1993-10-08

Family

ID=12973793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63054550A Granted JPH01227445A (ja) 1988-03-08 1988-03-08 バンプ付け方法

Country Status (1)

Country Link
JP (1) JPH01227445A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204948A (ja) * 1990-01-04 1991-09-06 Shinkawa Ltd バンプ付け方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204948A (ja) * 1990-01-04 1991-09-06 Shinkawa Ltd バンプ付け方法

Also Published As

Publication number Publication date
JPH0572104B2 (https=) 1993-10-08

Similar Documents

Publication Publication Date Title
DE69511609T2 (de) Verbinden von einem Halbleiter mit einem Substrat
US6820792B2 (en) Die bonding equipment
KR20000036092A (ko) 아이씨칩의 조립방법, 조립장치 및 그에 사용하는 테이프형지지체
US5207369A (en) Inner lead bonding apparatus
JP5063198B2 (ja) 電子部品装着装置におけるキャリアテープのスプライシング検出方法
JPH01227445A (ja) バンプ付け方法
JPH1012662A (ja) Ｔａｂ部品の圧着装置
JP2701174B2 (ja) バンプ付け方法
JP2006210592A (ja) テープ貼付方法
JPH0831849A (ja) チップのボンディング方法
KR940007536B1 (ko) 범프 부착방법
US5106011A (en) Bump attachment method
JPH10256278A (ja) テープ搬送機構を有する装置
JPH0131694B2 (https=)
JP3440801B2 (ja) 電子部品の接合装置
JP3247445B2 (ja) 半導体装置製造装置及び製造方法
JPH11217546A (ja) 圧着方法及び圧着装置
JPH04352441A (ja) アウタリードボンディング装置
JPH06244530A (ja) 導電性接着膜の圧着装置
JPS61163649A (ja) アウタ−リ−ドボンデイング装置
JPS62144336A (ja) ダイボンデイング装置
JPH077043A (ja) インナ−リ−ドボンディング装置
JPH03104249A (ja) インナーリードのボンディング装置
JPH0878479A (ja) アウタリ−ドボンディング装置およびアウタリ−ドボンディング方法
JPH01206638A (ja) テープボンダにおけるリード検出装置