JPH01177820U - - Google Patents
Info
- Publication number
- JPH01177820U JPH01177820U JP7542088U JP7542088U JPH01177820U JP H01177820 U JPH01177820 U JP H01177820U JP 7542088 U JP7542088 U JP 7542088U JP 7542088 U JP7542088 U JP 7542088U JP H01177820 U JPH01177820 U JP H01177820U
- Authority
- JP
- Japan
- Prior art keywords
- current
- power equipment
- metal
- carrying contact
- silver plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
Landscapes
- Contacts (AREA)
Description
第１図は本考案の実施例の要部を示す断面図、
第２図は第１図の実施例の右側の導体接続部の正
面図、第３図は銀メツキ層における金属原子の分
布状態を説明する断面図である。 １，２…導体、３…円柱状通電接触子、４…フ
インガ状通電接触子、８…円柱状通電接触子、３
ａ，４ｃ，４ｄ，８ａ…銀メツキ層が形成される
接点部。
第２図は第１図の実施例の右側の導体接続部の正
面図、第３図は銀メツキ層における金属原子の分
布状態を説明する断面図である。 １，２…導体、３…円柱状通電接触子、４…フ
インガ状通電接触子、８…円柱状通電接触子、３
ａ，４ｃ，４ｄ，８ａ…銀メツキ層が形成される
接点部。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 接点部の表面に銀メツキ層が形成された電
力機器用通電接触子において、 前記銀メツキ層に金属イオンを照射注入して表
面硬化処理を施したことを特徴とする電力機器用
通電接触子。 (2) 前記金属イオンはアンチモン、銅及びカド
ミウムらかなる金属群から選択された少なくとも
１つの金属のイオンである請求項１に記載の電力
機器用通電接触子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7542088U JPH01177820U (ja) | 1988-06-07 | 1988-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7542088U JPH01177820U (ja) | 1988-06-07 | 1988-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01177820U true JPH01177820U (ja) | 1989-12-19 |
Family
ID=31300491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7542088U Pending JPH01177820U (ja) | 1988-06-07 | 1988-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01177820U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011086902A1 (ja) * | 2010-01-12 | 2011-07-21 | 株式会社 東芝 | ガス絶縁開閉装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5438557A (en) * | 1977-08-31 | 1979-03-23 | Matsushita Electric Works Ltd | Method of making contact |
| JPS5618326A (en) * | 1979-07-24 | 1981-02-21 | Hazemeijer Bv | Method of improveing switching contact |
-
1988
- 1988-06-07 JP JP7542088U patent/JPH01177820U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5438557A (en) * | 1977-08-31 | 1979-03-23 | Matsushita Electric Works Ltd | Method of making contact |
| JPS5618326A (en) * | 1979-07-24 | 1981-02-21 | Hazemeijer Bv | Method of improveing switching contact |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011086902A1 (ja) * | 2010-01-12 | 2011-07-21 | 株式会社 東芝 | ガス絶縁開閉装置 |
| JP2011147217A (ja) * | 2010-01-12 | 2011-07-28 | Toshiba Corp | ガス絶縁開閉装置 |
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