JPS5662337A - Production of wiring and electrode - Google Patents

Production of wiring and electrode

Info

Publication number
JPS5662337A
JPS5662337A JP13773079A JP13773079A JPS5662337A JP S5662337 A JPS5662337 A JP S5662337A JP 13773079 A JP13773079 A JP 13773079A JP 13773079 A JP13773079 A JP 13773079A JP S5662337 A JPS5662337 A JP S5662337A
Authority
JP
Japan
Prior art keywords
layer
electrode
wiring
ground
ground layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13773079A
Other languages
Japanese (ja)
Inventor
Norio Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP13773079A priority Critical patent/JPS5662337A/en
Publication of JPS5662337A publication Critical patent/JPS5662337A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To reduce capacity with a less effective permeability and to minimize mutual capacity preventing electric field concentration between adjacent conductors by removing a part or the whole part of an insulated layer in the portiol having neither wiring nor electrode. CONSTITUTION:An Al ground layer 5, an SiO2 insulator layer 10, a Ti bonded layer 5, a Pd anti-diffusion layer 6 and a ground layer 7 for Au plating are applied on the surface of a silicon substrate 3 in that order. A resist 11 is applied thereon and an opening 12 is formed by partially removing the layers according to a desired wiring and electrode pattern. With the ground layer 7 as a netative electrode, a selective Au plating is made in the opening 12 to attain a desired thickness to form a wiring and an electrode metal 8. After the resist 11 is removed completely, with the plated metal layer as mask, the ground layer 7, the anti-diffusion layer 6, the bonded layer 5 and the insulated layer 10 are removed properly to form a wiring and an electrode.
JP13773079A 1979-10-26 1979-10-26 Production of wiring and electrode Pending JPS5662337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13773079A JPS5662337A (en) 1979-10-26 1979-10-26 Production of wiring and electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13773079A JPS5662337A (en) 1979-10-26 1979-10-26 Production of wiring and electrode

Publications (1)

Publication Number Publication Date
JPS5662337A true JPS5662337A (en) 1981-05-28

Family

ID=15205484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13773079A Pending JPS5662337A (en) 1979-10-26 1979-10-26 Production of wiring and electrode

Country Status (1)

Country Link
JP (1) JPS5662337A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158959A (en) * 1982-03-16 1983-09-21 Toshiba Corp High density thin film circuit board
JPH04326765A (en) * 1991-04-26 1992-11-16 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158959A (en) * 1982-03-16 1983-09-21 Toshiba Corp High density thin film circuit board
JPH0336317B2 (en) * 1982-03-16 1991-05-31 Tokyo Shibaura Electric Co
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
JPH04326765A (en) * 1991-04-26 1992-11-16 Mitsubishi Electric Corp Semiconductor device and manufacture thereof

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