JPS5662337A - Production of wiring and electrode - Google Patents
Production of wiring and electrodeInfo
- Publication number
- JPS5662337A JPS5662337A JP13773079A JP13773079A JPS5662337A JP S5662337 A JPS5662337 A JP S5662337A JP 13773079 A JP13773079 A JP 13773079A JP 13773079 A JP13773079 A JP 13773079A JP S5662337 A JPS5662337 A JP S5662337A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- wiring
- ground
- ground layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To reduce capacity with a less effective permeability and to minimize mutual capacity preventing electric field concentration between adjacent conductors by removing a part or the whole part of an insulated layer in the portiol having neither wiring nor electrode. CONSTITUTION:An Al ground layer 5, an SiO2 insulator layer 10, a Ti bonded layer 5, a Pd anti-diffusion layer 6 and a ground layer 7 for Au plating are applied on the surface of a silicon substrate 3 in that order. A resist 11 is applied thereon and an opening 12 is formed by partially removing the layers according to a desired wiring and electrode pattern. With the ground layer 7 as a netative electrode, a selective Au plating is made in the opening 12 to attain a desired thickness to form a wiring and an electrode metal 8. After the resist 11 is removed completely, with the plated metal layer as mask, the ground layer 7, the anti-diffusion layer 6, the bonded layer 5 and the insulated layer 10 are removed properly to form a wiring and an electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13773079A JPS5662337A (en) | 1979-10-26 | 1979-10-26 | Production of wiring and electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13773079A JPS5662337A (en) | 1979-10-26 | 1979-10-26 | Production of wiring and electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5662337A true JPS5662337A (en) | 1981-05-28 |
Family
ID=15205484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13773079A Pending JPS5662337A (en) | 1979-10-26 | 1979-10-26 | Production of wiring and electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5662337A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158959A (en) * | 1982-03-16 | 1983-09-21 | Toshiba Corp | High density thin film circuit board |
JPH04326765A (en) * | 1991-04-26 | 1992-11-16 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
-
1979
- 1979-10-26 JP JP13773079A patent/JPS5662337A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158959A (en) * | 1982-03-16 | 1983-09-21 | Toshiba Corp | High density thin film circuit board |
JPH0336317B2 (en) * | 1982-03-16 | 1991-05-31 | Tokyo Shibaura Electric Co | |
US5203078A (en) * | 1985-07-17 | 1993-04-20 | Ibiden Co., Ltd. | Printed wiring board for IC cards |
JPH04326765A (en) * | 1991-04-26 | 1992-11-16 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
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