JPH01176940U - - Google Patents
Info
- Publication number
- JPH01176940U JPH01176940U JP7457788U JP7457788U JPH01176940U JP H01176940 U JPH01176940 U JP H01176940U JP 7457788 U JP7457788 U JP 7457788U JP 7457788 U JP7457788 U JP 7457788U JP H01176940 U JPH01176940 U JP H01176940U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- circuit board
- semiconductor chip
- ultraviolet curing
- preventing leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は考案の実施例を説明し、イは上面図、
ロは縦断面図である。第２図は考案の実施例を製
作する製法説明図である。第３図は従来例を説明
し、イ，ロ，ハはそれぞれ縦断面図である。
１…絶縁板、２…回路パターン、３…回路基板
、４…枠、５…ネガフイルム、６…紫外線、７…
スペーサー、８…ガイドピン。
Figure 1 illustrates an embodiment of the invention, and Figure 1 is a top view;
B is a vertical sectional view. FIG. 2 is an explanatory diagram of a manufacturing method for manufacturing an embodiment of the invention. FIG. 3 explains a conventional example, and A, B, and C are longitudinal cross-sectional views, respectively. 1... Insulating board, 2... Circuit pattern, 3... Circuit board, 4... Frame, 5... Negative film, 6... Ultraviolet rays, 7...
Spacer, 8...Guide pin.
Claims (1)
紫外線硬化／熱硬化樹脂による半導体チツプ封止
樹脂の流出防止用枠を固着形成したことを特徴と
する半導体チツプ封止樹脂の流出防止枠付き回路
基板。 A circuit board with a frame for preventing leakage of semiconductor chip sealing resin, characterized in that a frame for preventing leakage of semiconductor chip sealing resin made of ultraviolet curing resin or ultraviolet curing/thermosetting resin is fixedly formed at a predetermined position of the circuit board. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7457788U JPH01176940U (en) | 1988-06-04 | 1988-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7457788U JPH01176940U (en) | 1988-06-04 | 1988-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176940U true JPH01176940U (en) | 1989-12-18 |
Family
ID=31299682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7457788U Pending JPH01176940U (en) | 1988-06-04 | 1988-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176940U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893240A (en) * | 1981-11-30 | 1983-06-02 | Japan Synthetic Rubber Co Ltd | Semiconductor device and preparation thereof |
| JPS58127333A (en) * | 1982-01-11 | 1983-07-29 | クリテイコン・インコ−ポレイテツド | Method of sealing semiconductor chip |
| JPS61184834A (en) * | 1985-02-13 | 1986-08-18 | Toshiba Chem Corp | Manufacture of resin-molded semiconductor device |
-
1988
- 1988-06-04 JP JP7457788U patent/JPH01176940U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5893240A (en) * | 1981-11-30 | 1983-06-02 | Japan Synthetic Rubber Co Ltd | Semiconductor device and preparation thereof |
| JPS58127333A (en) * | 1982-01-11 | 1983-07-29 | クリテイコン・インコ−ポレイテツド | Method of sealing semiconductor chip |
| JPS61184834A (en) * | 1985-02-13 | 1986-08-18 | Toshiba Chem Corp | Manufacture of resin-molded semiconductor device |
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