JPH0117261B2 - - Google Patents

Info

Publication number
JPH0117261B2
JPH0117261B2 JP58090718A JP9071883A JPH0117261B2 JP H0117261 B2 JPH0117261 B2 JP H0117261B2 JP 58090718 A JP58090718 A JP 58090718A JP 9071883 A JP9071883 A JP 9071883A JP H0117261 B2 JPH0117261 B2 JP H0117261B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
molded
stabilizing material
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58090718A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59217344A (ja
Inventor
Yutaka Misawa
Toshuki Hidaka
Hisashi Sakamoto
Masaaki Takahashi
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58090718A priority Critical patent/JPS59217344A/ja
Publication of JPS59217344A publication Critical patent/JPS59217344A/ja
Publication of JPH0117261B2 publication Critical patent/JPH0117261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/476—
    • H10W74/121—

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58090718A 1983-05-25 1983-05-25 樹脂モ−ルド型半導体装置 Granted JPS59217344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58090718A JPS59217344A (ja) 1983-05-25 1983-05-25 樹脂モ−ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58090718A JPS59217344A (ja) 1983-05-25 1983-05-25 樹脂モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS59217344A JPS59217344A (ja) 1984-12-07
JPH0117261B2 true JPH0117261B2 (en:Method) 1989-03-29

Family

ID=14006319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58090718A Granted JPS59217344A (ja) 1983-05-25 1983-05-25 樹脂モ−ルド型半導体装置

Country Status (1)

Country Link
JP (1) JPS59217344A (en:Method)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031519A1 (ja) * 2011-08-26 2013-03-07 デクセリアルズ株式会社 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5936475B2 (ja) * 2012-07-27 2016-06-22 日立オートモティブシステムズ株式会社 流量測定装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013031519A1 (ja) * 2011-08-26 2013-03-07 デクセリアルズ株式会社 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法

Also Published As

Publication number Publication date
JPS59217344A (ja) 1984-12-07

Similar Documents

Publication Publication Date Title
US5807768A (en) Method for fabricating a heat sink-integrated semiconductor package
JPS634701B2 (en:Method)
JP2002069157A (ja) 半導体封止用樹脂組成物、およびそれを用いた半導体装置、半導体ウエハ、ならびに半導体装置の実装構造
DE102017104305B4 (de) Halbleiterbauelement und Herstellungsverfahren desselben
JPS6347340B2 (en:Method)
JP2017152603A (ja) パワー半導体モジュール及びその製造方法
JPH0117261B2 (en:Method)
JP2002241469A (ja) 熱硬化性樹脂組成物および半導体装置
JPS6170742A (ja) 樹脂モ−ルド型半導体装置
JPS60219755A (ja) 樹脂モ−ルド型半導体装置
JPH06244225A (ja) 半導体装置とその製法
JPS61236142A (ja) 樹脂モ−ルド型半導体装置
JPS62226634A (ja) 半導体素子の製造方法
JPS62130530A (ja) 半導体装置の製造方法
JP3161332B2 (ja) チップ型固体電解コンデンサおよびその製造方法
JP2001055432A (ja) 半導体装置封止用樹脂組成物及びこれを用いた半導体装置、並びに半導体装置製造方法及び製造装置
JPS58222530A (ja) ペレツト付け方法
JP2004303874A (ja) 半導体装置の製造方法及び半導体装置
JPH09129786A (ja) 半導体装置
JPS62246921A (ja) 封止用樹脂組成物
JPS60760A (ja) レジンモ−ルド型半導体装置
US3341938A (en) Method of producing selenium midget rectifiers
JPH04258624A (ja) 封止用樹脂組成物及び半導体封止装置
JPH0230170A (ja) 半導体パッケージおよびその製法
JPS6054445A (ja) 半導体装置の製造法