JPH01163352U - - Google Patents
Info
- Publication number
- JPH01163352U JPH01163352U JP1988059123U JP5912388U JPH01163352U JP H01163352 U JPH01163352 U JP H01163352U JP 1988059123 U JP1988059123 U JP 1988059123U JP 5912388 U JP5912388 U JP 5912388U JP H01163352 U JPH01163352 U JP H01163352U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- chip
- type light
- light
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988059123U JPH01163352U (US07714131-20100511-C00038.png) | 1988-04-30 | 1988-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988059123U JPH01163352U (US07714131-20100511-C00038.png) | 1988-04-30 | 1988-04-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01163352U true JPH01163352U (US07714131-20100511-C00038.png) | 1989-11-14 |
Family
ID=31284910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988059123U Pending JPH01163352U (US07714131-20100511-C00038.png) | 1988-04-30 | 1988-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01163352U (US07714131-20100511-C00038.png) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05114751A (ja) * | 1991-10-23 | 1993-05-07 | Sharp Corp | 光半導体装置 |
JPH05218507A (ja) * | 1992-02-05 | 1993-08-27 | Sanyo Electric Co Ltd | 光半導体装置 |
JPH07115227A (ja) * | 1993-10-15 | 1995-05-02 | Rohm Co Ltd | 発光装置およびこれを用いた発光ユニット |
JPH07131072A (ja) * | 1993-10-29 | 1995-05-19 | Rohm Co Ltd | 面実装型側面発光器、および、これを用いた発光装置、ならびにこの発光装置を用いた液晶表示装置 |
JPH08306261A (ja) * | 1995-04-28 | 1996-11-22 | Shichizun Denshi:Kk | 表面実装型タクトスイッチ及びその製造方法 |
JPH0936432A (ja) * | 1995-07-17 | 1997-02-07 | Sharp Corp | 横発光型ledおよびその製造方法 |
JPH09181359A (ja) * | 1995-12-27 | 1997-07-11 | Shichizun Denshi:Kk | チップ型発光ダイオード |
JPH10150138A (ja) * | 1996-11-15 | 1998-06-02 | Citizen Electron Co Ltd | 下面電極付き側面使用電子部品 |
JPH10290029A (ja) * | 1997-04-14 | 1998-10-27 | Rohm Co Ltd | Ledチップ部品 |
JP2000196000A (ja) * | 1998-12-25 | 2000-07-14 | Rohm Co Ltd | チップ電子部品及びその製造方法 |
JP2001160630A (ja) * | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | チップ型半導体装置 |
JP2006190764A (ja) * | 2005-01-05 | 2006-07-20 | Stanley Electric Co Ltd | 表面実装型led |
JP2013105784A (ja) * | 2011-11-10 | 2013-05-30 | Seiko Instruments Inc | 光センサ装置およびその製造方法 |
JP2019054248A (ja) * | 2018-09-19 | 2019-04-04 | 日亜化学工業株式会社 | 発光装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS624157B2 (US07714131-20100511-C00038.png) * | 1984-10-30 | 1987-01-28 | Sanyo Electric Co | |
JPS6210456B2 (US07714131-20100511-C00038.png) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk |
-
1988
- 1988-04-30 JP JP1988059123U patent/JPH01163352U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6210456B2 (US07714131-20100511-C00038.png) * | 1980-12-10 | 1987-03-06 | Sanyo Denki Kk | |
JPS624157B2 (US07714131-20100511-C00038.png) * | 1984-10-30 | 1987-01-28 | Sanyo Electric Co |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05114751A (ja) * | 1991-10-23 | 1993-05-07 | Sharp Corp | 光半導体装置 |
JPH05218507A (ja) * | 1992-02-05 | 1993-08-27 | Sanyo Electric Co Ltd | 光半導体装置 |
JPH07115227A (ja) * | 1993-10-15 | 1995-05-02 | Rohm Co Ltd | 発光装置およびこれを用いた発光ユニット |
JPH07131072A (ja) * | 1993-10-29 | 1995-05-19 | Rohm Co Ltd | 面実装型側面発光器、および、これを用いた発光装置、ならびにこの発光装置を用いた液晶表示装置 |
JPH08306261A (ja) * | 1995-04-28 | 1996-11-22 | Shichizun Denshi:Kk | 表面実装型タクトスイッチ及びその製造方法 |
JPH0936432A (ja) * | 1995-07-17 | 1997-02-07 | Sharp Corp | 横発光型ledおよびその製造方法 |
JPH09181359A (ja) * | 1995-12-27 | 1997-07-11 | Shichizun Denshi:Kk | チップ型発光ダイオード |
JPH10150138A (ja) * | 1996-11-15 | 1998-06-02 | Citizen Electron Co Ltd | 下面電極付き側面使用電子部品 |
JPH10290029A (ja) * | 1997-04-14 | 1998-10-27 | Rohm Co Ltd | Ledチップ部品 |
JP2000196000A (ja) * | 1998-12-25 | 2000-07-14 | Rohm Co Ltd | チップ電子部品及びその製造方法 |
JP2001160630A (ja) * | 1999-12-03 | 2001-06-12 | Rohm Co Ltd | チップ型半導体装置 |
JP2006190764A (ja) * | 2005-01-05 | 2006-07-20 | Stanley Electric Co Ltd | 表面実装型led |
JP2013105784A (ja) * | 2011-11-10 | 2013-05-30 | Seiko Instruments Inc | 光センサ装置およびその製造方法 |
JP2019054248A (ja) * | 2018-09-19 | 2019-04-04 | 日亜化学工業株式会社 | 発光装置 |