JPH0116037B2 - - Google Patents
Info
- Publication number
- JPH0116037B2 JPH0116037B2 JP3616084A JP3616084A JPH0116037B2 JP H0116037 B2 JPH0116037 B2 JP H0116037B2 JP 3616084 A JP3616084 A JP 3616084A JP 3616084 A JP3616084 A JP 3616084A JP H0116037 B2 JPH0116037 B2 JP H0116037B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- substrate
- printed wiring
- circuit pattern
- drive mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000126 substance Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 17
- 238000005507 spraying Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011176 pooling Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3616084A JPS60182184A (ja) | 1984-02-29 | 1984-02-29 | 基板製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3616084A JPS60182184A (ja) | 1984-02-29 | 1984-02-29 | 基板製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60182184A JPS60182184A (ja) | 1985-09-17 |
| JPH0116037B2 true JPH0116037B2 (fr) | 1989-03-22 |
Family
ID=12462011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3616084A Granted JPS60182184A (ja) | 1984-02-29 | 1984-02-29 | 基板製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60182184A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0286151A (ja) * | 1988-09-22 | 1990-03-27 | Sumitomo Metal Mining Co Ltd | リードフレームの製造方法 |
| JPH0572165U (ja) * | 1992-03-05 | 1993-09-28 | 昭和電工株式会社 | エッチング装置 |
| TWI226077B (en) * | 2001-07-05 | 2005-01-01 | Tokyo Electron Ltd | Liquid processing apparatus and liquid processing method |
-
1984
- 1984-02-29 JP JP3616084A patent/JPS60182184A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60182184A (ja) | 1985-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |