JPH01154669U - - Google Patents

Info

Publication number
JPH01154669U
JPH01154669U JP1988050401U JP5040188U JPH01154669U JP H01154669 U JPH01154669 U JP H01154669U JP 1988050401 U JP1988050401 U JP 1988050401U JP 5040188 U JP5040188 U JP 5040188U JP H01154669 U JPH01154669 U JP H01154669U
Authority
JP
Japan
Prior art keywords
pattern
insulating layer
wiring board
printed wiring
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988050401U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988050401U priority Critical patent/JPH01154669U/ja
Priority to US07/312,014 priority patent/US4962287A/en
Publication of JPH01154669U publication Critical patent/JPH01154669U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【図面の簡単な説明】
第１図は本考案の可撓性印刷回路板の一実施例
を示す図であり、イは平面図、ロはイの中央断面
図、第２図は本考案の他の実施例を示す図であり
、イは平面図、ロはイの中央断面図、第３図は従
来の可撓性印刷回路板のを示す図であり、イは平
面図、ロはイの中央断面図である。 ２：下部導電パターン、３，４：被連絡導電パ
ターン、５，５′：絶縁層、６，６′：第１の絶
縁層、７，７′：第２の絶縁層、８，８′：第３
の絶縁層、９，９′：孔、１０：クロスオーバー
パターン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 可撓性のフイルム上に配線パターンが形成され
    た可撓性印刷配線板であつて、導電パターンの一
    部が複数の層を重ねた絶縁層で被覆されて下層導
    電パターンとされており、前記下層導電パターン
    で隔絶された少なくとも一対の被連絡導電パター
    ンが、前記絶縁層上に形成されたクロスオーバー
    パターンによつて連絡されているように構成され
    た可撓性印刷配線板において、少なくとも前記ク
    ロスオーバーパターンが横断するところの前記絶
    縁層の端辺において前記絶縁層を構成する各層の
    うち少なくとも上部の１層の外形を下部の層の外
    形より内方に位置させたことを特徴とする可撓性
    印刷配線板。
JP1988050401U 1988-04-14 1988-04-14 Pending JPH01154669U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988050401U JPH01154669U (ja) 1988-04-14 1988-04-14
US07/312,014 US4962287A (en) 1988-04-14 1989-02-16 Flexible printed wire board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988050401U JPH01154669U (ja) 1988-04-14 1988-04-14

Publications (1)

Publication Number Publication Date
JPH01154669U true JPH01154669U (ja) 1989-10-24

Family

ID=12857847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988050401U Pending JPH01154669U (ja) 1988-04-14 1988-04-14

Country Status (2)

Country Link
US (1) US4962287A (ja)
JP (1) JPH01154669U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110207A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd フレキシブル基板

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3260941B2 (ja) * 1993-06-18 2002-02-25 株式会社日立製作所 多層配線基板および多層配線基板の製造方法
DE19956436A1 (de) * 1999-11-24 2001-06-07 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Datenträgerkarte
US20130161083A1 (en) * 2011-12-22 2013-06-27 Tyco Electronics Corporation Printed circuit boards and methods of manufacturing printed circuit boards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461436A (en) * 1965-08-06 1969-08-12 Transitron Electronic Corp Matrix-type,permanent memory device
GB1386344A (en) * 1972-02-21 1975-03-05 Hochvakuum Dresden Veb Manufacture of multiple laminated conductor boards
DE7624175U1 (de) * 1976-07-31 1976-11-25 Wilhelm Ruf Kg, 8000 Muenchen Tastatur
JPS57133674A (en) * 1981-02-13 1982-08-18 Hitachi Ltd Structure of multilayer wiring
EP0082216B1 (de) * 1981-12-23 1985-10-09 Ibm Deutschland Gmbh Mehrschichtiges, keramisches Substrat für integrierte Halbleiterschaltungen mit mehreren Metallisierungsebenen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110207A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd フレキシブル基板

Also Published As

Publication number Publication date
US4962287A (en) 1990-10-09

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