JPH0115385B2 - - Google Patents

Info

Publication number
JPH0115385B2
JPH0115385B2 JP56165718A JP16571881A JPH0115385B2 JP H0115385 B2 JPH0115385 B2 JP H0115385B2 JP 56165718 A JP56165718 A JP 56165718A JP 16571881 A JP16571881 A JP 16571881A JP H0115385 B2 JPH0115385 B2 JP H0115385B2
Authority
JP
Japan
Prior art keywords
mounting plate
ceramic substrate
adhesive
thermal expansion
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56165718A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5867473A (ja
Inventor
Toyokazu Inaba
Takemi Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56165718A priority Critical patent/JPS5867473A/ja
Publication of JPS5867473A publication Critical patent/JPS5867473A/ja
Publication of JPH0115385B2 publication Critical patent/JPH0115385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electronic Switches (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP56165718A 1981-10-19 1981-10-19 サ−マルヘツド Granted JPS5867473A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56165718A JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56165718A JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Publications (2)

Publication Number Publication Date
JPS5867473A JPS5867473A (ja) 1983-04-22
JPH0115385B2 true JPH0115385B2 (enrdf_load_stackoverflow) 1989-03-16

Family

ID=15817740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56165718A Granted JPS5867473A (ja) 1981-10-19 1981-10-19 サ−マルヘツド

Country Status (1)

Country Link
JP (1) JPS5867473A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176555U (ja) * 1983-05-13 1984-11-26 ティーディーケイ株式会社 サ−マルヘツド

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52125775A (en) * 1976-04-14 1977-10-21 Fujitsu Ten Ltd Htbrid integrated circuit unit
JPS5851830B2 (ja) * 1976-05-31 1983-11-18 松下電器産業株式会社 サ−マルヘツド
JPS5329564A (en) * 1976-08-31 1978-03-18 Fujitsu Ltd Method of fixing ceramic substrate
JPS6217251Y2 (enrdf_load_stackoverflow) * 1978-03-24 1987-05-01

Also Published As

Publication number Publication date
JPS5867473A (ja) 1983-04-22

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