JPH0115182Y2 - - Google Patents

Info

Publication number
JPH0115182Y2
JPH0115182Y2 JP1984181716U JP18171684U JPH0115182Y2 JP H0115182 Y2 JPH0115182 Y2 JP H0115182Y2 JP 1984181716 U JP1984181716 U JP 1984181716U JP 18171684 U JP18171684 U JP 18171684U JP H0115182 Y2 JPH0115182 Y2 JP H0115182Y2
Authority
JP
Japan
Prior art keywords
lead wire
lead
solder
semiconductor chip
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984181716U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6196555U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984181716U priority Critical patent/JPH0115182Y2/ja
Publication of JPS6196555U publication Critical patent/JPS6196555U/ja
Application granted granted Critical
Publication of JPH0115182Y2 publication Critical patent/JPH0115182Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1984181716U 1984-11-30 1984-11-30 Expired JPH0115182Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (enrdf_load_stackoverflow) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984181716U JPH0115182Y2 (enrdf_load_stackoverflow) 1984-11-30 1984-11-30

Publications (2)

Publication Number Publication Date
JPS6196555U JPS6196555U (enrdf_load_stackoverflow) 1986-06-21
JPH0115182Y2 true JPH0115182Y2 (enrdf_load_stackoverflow) 1989-05-08

Family

ID=30739257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984181716U Expired JPH0115182Y2 (enrdf_load_stackoverflow) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPH0115182Y2 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946664U (enrdf_load_stackoverflow) * 1972-07-28 1974-04-24
JPS5043850U (enrdf_load_stackoverflow) * 1973-08-21 1975-05-02
JPS5651847A (en) * 1979-10-05 1981-05-09 Hitachi Ltd Preparation of semiconductor device

Also Published As

Publication number Publication date
JPS6196555U (enrdf_load_stackoverflow) 1986-06-21

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