JPH01135561A - 接着剤塗布装置 - Google Patents

接着剤塗布装置

Info

Publication number
JPH01135561A
JPH01135561A JP62283820A JP28382087A JPH01135561A JP H01135561 A JPH01135561 A JP H01135561A JP 62283820 A JP62283820 A JP 62283820A JP 28382087 A JP28382087 A JP 28382087A JP H01135561 A JPH01135561 A JP H01135561A
Authority
JP
Japan
Prior art keywords
amount
coating
adhesive
application
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62283820A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0565229B2 (enExample
Inventor
Kouichi Asai
鎬一 浅井
Mamoru Tsuda
護 津田
Kunio Oe
邦夫 大江
Takashi Iwatsuki
岩月　隆始
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP62283820A priority Critical patent/JPH01135561A/ja
Publication of JPH01135561A publication Critical patent/JPH01135561A/ja
Publication of JPH0565229B2 publication Critical patent/JPH0565229B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
JP62283820A 1987-08-27 1987-11-10 接着剤塗布装置 Granted JPH01135561A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62283820A JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21365887 1987-08-27
JP62-213658 1987-08-27
JP62283820A JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP4102106A Division JP2535473B2 (ja) 1987-08-27 1992-03-27 プリント基板用高粘性流体塗布装置
JP4102107A Division JP2535474B2 (ja) 1987-08-27 1992-03-27 試し打ち機能を備えた高粘性流体塗布装置
JP7327624A Division JP2669811B2 (ja) 1987-08-27 1995-12-15 高粘性流体塗布装置
JP7327623A Division JP2863475B2 (ja) 1987-08-27 1995-12-15 高粘性流体塗布装置

Publications (2)

Publication Number Publication Date
JPH01135561A true JPH01135561A (ja) 1989-05-29
JPH0565229B2 JPH0565229B2 (enExample) 1993-09-17

Family

ID=16642811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62283820A Granted JPH01135561A (ja) 1987-08-27 1987-11-10 接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPH01135561A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818558A (en) * 1987-08-04 1989-04-04 Worthington Foods, Inc. Fiber/tofu food product and method for making the same
JPH01307470A (ja) * 1988-06-06 1989-12-12 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
JPH02214577A (ja) * 1989-02-14 1990-08-27 Matsushita Electric Ind Co Ltd 接着剤塗布方法
JPH02303571A (ja) * 1989-05-15 1990-12-17 Sanyo Electric Co Ltd ディスペンサ装置及びディスペンサ制御方法
JPH0362597A (ja) * 1989-07-28 1991-03-18 Matsushita Electric Ind Co Ltd 粘性流体塗布方法と粘性流体塗布装置
JPH0394859A (ja) * 1989-09-05 1991-04-19 Musashi Eng Co Ltd マルチプリセット式ディスペンサー
JP2007098306A (ja) * 2005-10-05 2007-04-19 Tdk Corp 吐出制御装置
JP2021146228A (ja) * 2020-03-16 2021-09-27 日本発條株式会社 接着剤の塗布方法および塗布装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
JPS59128735U (ja) * 1983-02-17 1984-08-30 新日本無線株式会社 半導体チツプの接着装置
JPS59152689A (ja) * 1983-02-18 1984-08-31 三洋電機株式会社 チツプ状電子部品固定用接着剤塗布装置
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS6156500A (ja) * 1984-08-28 1986-03-22 株式会社東芝 電子部品装着装置
JPS6271239A (ja) * 1985-09-25 1987-04-01 Hitachi Ltd 半導体製造方法及び製造装置
JPS62110775A (ja) * 1985-11-11 1987-05-21 Hitachi Ltd 塗布装置
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置
JPS647967A (en) * 1987-07-01 1989-01-11 Sharp Kk Paste coating device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
JPS59128735U (ja) * 1983-02-17 1984-08-30 新日本無線株式会社 半導体チツプの接着装置
JPS59152689A (ja) * 1983-02-18 1984-08-31 三洋電機株式会社 チツプ状電子部品固定用接着剤塗布装置
JPS601900A (ja) * 1983-06-17 1985-01-08 松下電器産業株式会社 認識付電子部品実装装置
JPS6156500A (ja) * 1984-08-28 1986-03-22 株式会社東芝 電子部品装着装置
JPS6271239A (ja) * 1985-09-25 1987-04-01 Hitachi Ltd 半導体製造方法及び製造装置
JPS62110775A (ja) * 1985-11-11 1987-05-21 Hitachi Ltd 塗布装置
JPS62130596A (ja) * 1985-12-02 1987-06-12 三菱電機株式会社 電子部品自動組立装置
JPS647967A (en) * 1987-07-01 1989-01-11 Sharp Kk Paste coating device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818558A (en) * 1987-08-04 1989-04-04 Worthington Foods, Inc. Fiber/tofu food product and method for making the same
JPH01307470A (ja) * 1988-06-06 1989-12-12 Matsushita Electric Ind Co Ltd 粘性流体塗布装置
JPH02214577A (ja) * 1989-02-14 1990-08-27 Matsushita Electric Ind Co Ltd 接着剤塗布方法
JPH02303571A (ja) * 1989-05-15 1990-12-17 Sanyo Electric Co Ltd ディスペンサ装置及びディスペンサ制御方法
JPH0362597A (ja) * 1989-07-28 1991-03-18 Matsushita Electric Ind Co Ltd 粘性流体塗布方法と粘性流体塗布装置
JPH0394859A (ja) * 1989-09-05 1991-04-19 Musashi Eng Co Ltd マルチプリセット式ディスペンサー
JP2007098306A (ja) * 2005-10-05 2007-04-19 Tdk Corp 吐出制御装置
JP2021146228A (ja) * 2020-03-16 2021-09-27 日本発條株式会社 接着剤の塗布方法および塗布装置
US11998943B2 (en) 2020-03-16 2024-06-04 Nhk Spring Co., Ltd. Application device for applying adhesive, and adhesive application method
US12202002B2 (en) 2020-03-16 2025-01-21 Nhk Spring Co., Ltd. Application device for applying adhesive, and adhesive application method

Also Published As

Publication number Publication date
JPH0565229B2 (enExample) 1993-09-17

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