JPH0113219B2 - - Google Patents

Info

Publication number
JPH0113219B2
JPH0113219B2 JP55080040A JP8004080A JPH0113219B2 JP H0113219 B2 JPH0113219 B2 JP H0113219B2 JP 55080040 A JP55080040 A JP 55080040A JP 8004080 A JP8004080 A JP 8004080A JP H0113219 B2 JPH0113219 B2 JP H0113219B2
Authority
JP
Japan
Prior art keywords
film base
lead
film
semiconductor chip
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55080040A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5720440A (en
Inventor
Hiromichi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8004080A priority Critical patent/JPS5720440A/ja
Publication of JPS5720440A publication Critical patent/JPS5720440A/ja
Publication of JPH0113219B2 publication Critical patent/JPH0113219B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP8004080A 1980-06-13 1980-06-13 Semiconductor device Granted JPS5720440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8004080A JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8004080A JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5720440A JPS5720440A (en) 1982-02-02
JPH0113219B2 true JPH0113219B2 (enExample) 1989-03-03

Family

ID=13707126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8004080A Granted JPS5720440A (en) 1980-06-13 1980-06-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5720440A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0815167B2 (ja) * 1986-03-26 1996-02-14 株式会社日立製作所 半導体装置
US4999700A (en) * 1989-04-20 1991-03-12 Honeywell Inc. Package to board variable pitch tab

Also Published As

Publication number Publication date
JPS5720440A (en) 1982-02-02

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