JPH01128441A - ボンディング用ワイヤ及びワイヤボンディング方法 - Google Patents

ボンディング用ワイヤ及びワイヤボンディング方法

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Publication number
JPH01128441A
JPH01128441A JP62284369A JP28436987A JPH01128441A JP H01128441 A JPH01128441 A JP H01128441A JP 62284369 A JP62284369 A JP 62284369A JP 28436987 A JP28436987 A JP 28436987A JP H01128441 A JPH01128441 A JP H01128441A
Authority
JP
Japan
Prior art keywords
wire
bonding
semi
resin
ultraviolet curing
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Pending
Application number
JP62284369A
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English (en)
Inventor
Yoshihiro Yoshida
芳博 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
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Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP62284369A priority Critical patent/JPH01128441A/ja
Publication of JPH01128441A publication Critical patent/JPH01128441A/ja
Pending legal-status Critical Current

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    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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  • Engineering & Computer Science (AREA)
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 （技術分野） 本発明は、半導体装置の結線に用いられるボンディング
用ワイヤ及びワイヤボンディング方法に関するものであ
る。
（従来の技術） 半導体装置の製造過程において、半導体装置の接続とし
て用いられるボンディングワイヤは、例えば金やアルミ
ニウム等の導電性の細線からなっている。従来、このよ
うなワイヤは裸のまま使用する場合や、ワイヤ基材の表
面に絶縁性樹脂ワニスの皮膜を施して使用する場合が知
られている。
被覆を施さないワイヤによりボンディングを行なう場合
、ワイヤ同志の接触、エツジとワイヤの接触により電気
的ショートを生じる欠点を有し、またこのショートを防
止するため、ワイヤ基材に絶縁性被覆として絶縁性樹脂
ワニスを設けたものが公知であるが、パッケージまでの
工程において、封止される位置には、ワイヤの外周にお
いて前記被覆材、その被覆材と異なる材料の封止材が位
置し、このため、これら異なる材料の熱膨張率の相違に
基づく接合面の不安定な変位を生じ、この不安定な異種
材料界面よりの湿気の侵入等による信頼性の低下を招い
ている。
（発明の目的） 本発明°は、ボンディング用ワイヤとして、ワイヤ相互
の短絡やワイヤとチップ端部との短絡を防ぎうると共に
封止後においてワイヤ接続端の接合面に生じる従来の欠
点を解消しうる手段を提供することを目的とする。
（発明の構成） 本発明は、前記目的を達成するため、ボンディング用ワ
イヤとして、樹脂封止の際に用いる紫外線硬化樹脂をワ
イヤの周囲に半硬化状態に被覆したことを特徴とするも
のであり、このワイヤをキャピラリに通してボンディン
グを行ない、紫外線硬化樹脂により封止を行なうことを
特徴とするものである。
以下、本発明の実施例を図面に基づいて説明する。
ワイヤ１は図示されていない供給手段により、ワイヤボ
ンディングのためにキャピラリ２に送られる。ワイヤと
してはアルミ、金、銅等のワイヤを用いることができる
。
本発明の実施例においては、キャピラリ２の前方位置に
紫外線硬化樹脂塗布手段が設けられている。紫外線硬化
樹脂塗布手段としては、塗布機構３と被覆層を半硬化状
態とする手段４からなる。
ワイヤ１に被覆される紫外線硬化樹脂は、ワイヤボンデ
ィングされた部分を封止する際に使用される紫外線硬化
タイプの樹脂と同一の材料を用い、塗布機構３において
、該紫外線硬化樹脂を収容した液槽３ａ、供給パイプ３
ｂ、及び上下の塗布ローラ３ｃ、３ｄを介してワイヤ１
に紫外線硬化樹脂を塗布する。この塗布された紫外線硬
化樹脂被覆層５は半硬化状態とする手段４、すなわち紫
外線ランプ４ａとこの対向位置に配置された反射ミラー
４ｂにより、ワイヤ１の全周に塗布された紫外線硬化樹
脂被覆層５を半硬化の状態とする。この場合、紫外線ラ
ンプ４ａのパワー、紫外線硬化樹脂に対する゛照射時間
を制御することにより、紫外線硬化樹脂の硬化の程度を
加減することができる。
半硬化状態の紫外線硬化樹脂被覆Ｎ５　ａをもつワイヤ
１はキャピラリ２に送られ、半導体チップ６にワイヤ端
部をボンディングされる。ボンディングの際にワイヤ端
部に加えられる圧力、超音波等によって、ワイヤの接合
部に被覆された半硬化状態の樹脂は容易に除去され、接
合に影響しない。
ワイヤｌの他端はリードフレーム７に接合された後、半
導体チップ６及びワイヤ１に接続されたリードフレーム
７の部分は紫外線硬化樹脂によりモールドされる。第２
図には、半硬化状態の紫外線硬化樹脂被覆層５ａをもつ
ワイヤ１が半導体チップ６とリードフレーム７に接続さ
れた状態を示している。
このような本発明の構成では、絶縁被覆層としてワイヤ
の周りに半硬化状態にした紫外線硬化樹脂層を形成した
ことにより、ワイヤの弾性を失なうことがなく、ワイヤ
の取扱いに支障を生じることがない。またワイヤの捩れ
やだれ等による接触では、半硬化状態の樹脂ははがれる
ことがなく、ワイヤの絶縁被覆としての機能を果すこと
ができる。
また、本発明の構成において、封止する樹脂として紫外
線硬化樹脂と同一の樹脂をワイヤの絶縁被覆層として用
いたことにより、半導体チップ、リードフレームを接続
するワイヤの周囲には、同一材料の絶縁層が位置し、異
種材料による熱膨張率の相違や異種材料による界面を生
しることなく、これに基づ〈従来の問題や欠点を発生す
ることがない。
本発明に用いられる紫外線硬化樹脂としては、例えば、
信越シリコーンＫＪＲ−８０５０Ｓ等を使用することが
できる。
（発明の効果） 本発明の構成により、ワイヤボンディング時にワイヤ相
互またはワイヤと隣接するリードフレームのインナーリ
ード、ダブが接触しても電気的ショートの心配がなく、
半硬化状態の絶縁被覆層をもつワイヤは弾性を失なうこ
となく、且つ被覆層は捩れやだれによりワイヤから剥離
することなく、ボンディング時に使用する力で接合部分
の被覆層を除去できる利点を有している。また、封止さ
れた絶縁材がワイヤの絶縁被覆層と同一であるため、従
来の如き異種材料に基づく湿気の侵入等の欠点を生じる
ことなく、信幀性の高い製品を得る効果を有する。
【図面の簡単な説明】
第１図は本発明の実施例を示す断面図、第２図は本発明
のボンディング用ワイヤの使用状態を示す断面図である
。 ｌ・・・ワイヤ、２・・・キャピラリ、３・・・紫外線
硬化樹脂塗布機構、４・・・被覆層半硬化手段。 特許出願人　　　株式会社　リ　コ　−第２図

Claims (2)

    【特許請求の範囲】
  1. （１）樹脂封止の際に用いる紫外線硬化樹脂をワイヤの
    周囲に半硬化状態に被覆したことを特徴とするボンディ
    ング用ワイヤ。
  2. （２）樹脂封止の際に用いる紫外線硬化樹脂をワイヤの
    周囲に半硬化状態に被覆し、引続き、このワイヤをキャ
    ピラリに通してボンディングを行ない、紫外線硬化樹脂
    により封止を行なうことを特徴とするワイヤボンディン
    グ方法。
JP62284369A 1987-11-12 1987-11-12 ボンディング用ワイヤ及びワイヤボンディング方法 Pending JPH01128441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62284369A JPH01128441A (ja) 1987-11-12 1987-11-12 ボンディング用ワイヤ及びワイヤボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62284369A JPH01128441A (ja) 1987-11-12 1987-11-12 ボンディング用ワイヤ及びワイヤボンディング方法

Publications (1)

Publication Number Publication Date
JPH01128441A true JPH01128441A (ja) 1989-05-22

Family

ID=17677689

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167040U (ja) * 1988-05-16 1989-11-22
JP2007322689A (ja) * 2006-05-31 2007-12-13 Optrex Corp 表示素子の製造装置
WO2016070211A1 (de) * 2014-11-05 2016-05-12 Zizala Lichtsysteme Gmbh Verfahren und vorrichtung zum verbinden eines drahtes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01167040U (ja) * 1988-05-16 1989-11-22
JP2007322689A (ja) * 2006-05-31 2007-12-13 Optrex Corp 表示素子の製造装置
WO2016070211A1 (de) * 2014-11-05 2016-05-12 Zizala Lichtsysteme Gmbh Verfahren und vorrichtung zum verbinden eines drahtes

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