JPH01120373U - - Google Patents
Info
- Publication number
- JPH01120373U JPH01120373U JP1435588U JP1435588U JPH01120373U JP H01120373 U JPH01120373 U JP H01120373U JP 1435588 U JP1435588 U JP 1435588U JP 1435588 U JP1435588 U JP 1435588U JP H01120373 U JPH01120373 U JP H01120373U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- test section
- test
- cause
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例を示すプリント基
板要部の斜視図、第２図は本考案の第２実施例を
示すプリント基板要部の斜視図、第３図は本考案
の第３実施例を示すプリント基板要部の斜視図、
第４図は半田不良箇所を示す拡大縦断面図である
。
１……プリント基板、５……テスト部、６……
パターン配線、８……試験用電子部品、１０……
切離し線。
Fig. 1 is a perspective view of the main parts of a printed circuit board showing a first embodiment of the present invention, Fig. 2 is a perspective view of main parts of a printed circuit board showing a second embodiment of the invention, and Fig. 3 is a perspective view of the main parts of a printed circuit board showing a second embodiment of the invention. A perspective view of a main part of a printed circuit board showing a third embodiment,
FIG. 4 is an enlarged longitudinal cross-sectional view showing a solder defect location. 1...Printed circuit board, 5...Test section, 6...
Pattern wiring, 8...Electronic components for testing, 10...
separation line.
Claims (1)
け、当該テスト部５に前記プリント基板１に本来
実装すべきもののうち、一番半田付不良を起し易
いものと同等又はそれ以上に半田付不良を起し易
い、試験用パターン６や試験用の実装部品８等を
配置したことを特徴とするプリント基板。 A test section 5 is provided in a part of the main body of the printed circuit board 1, and the test section 5 is soldered to the test section 5 to the same level or more than the one that is most likely to cause soldering defects among the items that should be originally mounted on the printed circuit board 1. A printed circuit board characterized in that a test pattern 6, a test mounting component 8, etc., which are likely to cause defects, are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1435588U JPH01120373U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1435588U JPH01120373U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120373U true JPH01120373U (en) | 1989-08-15 |
Family
ID=31225479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1435588U Pending JPH01120373U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101128146B1 (en) * | 2005-06-01 | 2012-03-23 | 엘지전자 주식회사 | Printed Circuit Board |
-
1988
- 1988-02-05 JP JP1435588U patent/JPH01120373U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101128146B1 (en) * | 2005-06-01 | 2012-03-23 | 엘지전자 주식회사 | Printed Circuit Board |