JPS6181177U - - Google Patents
Info
- Publication number
- JPS6181177U JPS6181177U JP16706484U JP16706484U JPS6181177U JP S6181177 U JPS6181177 U JP S6181177U JP 16706484 U JP16706484 U JP 16706484U JP 16706484 U JP16706484 U JP 16706484U JP S6181177 U JPS6181177 U JP S6181177U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- outer frame
- frame portion
- circuit section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 claims description 2
- 239000000523 sample Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Description
第１図はこの考案の一実施例の概略を示す図、
第２図はこの考案の一部を拡大した斜視図、第３
図は第２図の断面図、また、第４図は従来よりの
方法による検査を示す図である。
２１は、最終的に必要とする印刷配線板、２２
は溝、２３は印刷配線板の外枠、２４はチツプ
部品、２５は、チツプ部品接続パツド、２６は外
部に導き出された検査用パツド、２７はインサー
キツトテスターのプローブを示す。なお、図中、
同一符号は同一または相当部分を示す。
FIG. 1 is a diagram schematically showing an embodiment of this invention;
Figure 2 is an enlarged perspective view of a part of this invention;
The figure is a cross-sectional view of FIG. 2, and FIG. 4 is a diagram showing inspection by a conventional method. 21 is the printed wiring board that is finally required; 22
23 is a groove, 23 is an outer frame of the printed wiring board, 24 is a chip component, 25 is a chip component connection pad, 26 is a test pad led to the outside, and 27 is a probe of an in-circuit tester. In addition, in the figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
ら部品取付ランドの間をつなぐ接続ランドとを有
する印刷配線板上の回路部、印刷配線板上の上記
回路部の外側に設けられ回路部の所定のテストポ
イントからのびる接続ランドによつて接続されサ
ーキツトテスタの検査用プローブがタツチできる
検査用パツドを有する外枠部と、前記回路部と前
記外枠部の間に設けられた切込みとを備え、サー
キツトテストによる検査後外枠部を切離すように
したことを特徴とする高密度実装印刷配線板。 A circuit section on a printed wiring board that has a component mounting land on which a chip component is attached and a connection land that connects these component mounting lands, and a circuit section provided outside of the circuit section on the printed wiring board. an outer frame portion having a test pad that is connected by a connection land extending from a point and can be touched by a test probe of a circuit tester; and a notch provided between the circuit portion and the outer frame portion; A high-density mounting printed wiring board characterized in that an outer frame portion is separated after inspection by a kit test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16706484U JPS6181177U (en) | 1984-10-31 | 1984-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16706484U JPS6181177U (en) | 1984-10-31 | 1984-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6181177U true JPS6181177U (en) | 1986-05-29 |
Family
ID=30724867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16706484U Pending JPS6181177U (en) | 1984-10-31 | 1984-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6181177U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253214A (en) * | 2005-03-08 | 2006-09-21 | Sumitomo Electric Ind Ltd | Optical module |
| JP2015195272A (en) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | Semiconductor device and semiconductor manufacturing method |
-
1984
- 1984-10-31 JP JP16706484U patent/JPS6181177U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253214A (en) * | 2005-03-08 | 2006-09-21 | Sumitomo Electric Ind Ltd | Optical module |
| JP2015195272A (en) * | 2014-03-31 | 2015-11-05 | 新光電気工業株式会社 | Semiconductor device and semiconductor manufacturing method |
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