JPH01107557A - 配線の形成方法 - Google Patents
配線の形成方法Info
- Publication number
- JPH01107557A JPH01107557A JP26372187A JP26372187A JPH01107557A JP H01107557 A JPH01107557 A JP H01107557A JP 26372187 A JP26372187 A JP 26372187A JP 26372187 A JP26372187 A JP 26372187A JP H01107557 A JPH01107557 A JP H01107557A
- Authority
- JP
- Japan
- Prior art keywords
- film
- hole
- deposited
- target
- molybdenum silicide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 11
- 238000004544 sputter deposition Methods 0.000 claims abstract description 29
- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910021344 molybdenum silicide Inorganic materials 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 10
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 10
- -1 molybdenum pentasilicate Chemical compound 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000004299 exfoliation Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 40
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910020968 MoSi2 Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910016006 MoSi Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26372187A JPH01107557A (ja) | 1987-10-21 | 1987-10-21 | 配線の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26372187A JPH01107557A (ja) | 1987-10-21 | 1987-10-21 | 配線の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01107557A true JPH01107557A (ja) | 1989-04-25 |
| JPH0552057B2 JPH0552057B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-04 |
Family
ID=17393386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26372187A Granted JPH01107557A (ja) | 1987-10-21 | 1987-10-21 | 配線の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01107557A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6119883A (en) * | 1998-12-07 | 2000-09-19 | Owens-Illinois Closure Inc. | Tamper-indicating closure and method of manufacture |
| US6152316A (en) * | 1999-05-17 | 2000-11-28 | Owens-Illinois Closure Inc. | Tamper-indicating closure and method of manufacture |
| US6382443B1 (en) | 1999-04-28 | 2002-05-07 | Owens-Illinois Closure Inc. | Tamper-indicating closure with lugs on a stop flange for spacing the flange from the finish of a container |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60189241A (ja) * | 1984-03-08 | 1985-09-26 | Agency Of Ind Science & Technol | 段差の被覆方法 |
| JPS60193336A (ja) * | 1984-03-15 | 1985-10-01 | Nec Corp | コンタクト電極の形成方法 |
-
1987
- 1987-10-21 JP JP26372187A patent/JPH01107557A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60189241A (ja) * | 1984-03-08 | 1985-09-26 | Agency Of Ind Science & Technol | 段差の被覆方法 |
| JPS60193336A (ja) * | 1984-03-15 | 1985-10-01 | Nec Corp | コンタクト電極の形成方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6119883A (en) * | 1998-12-07 | 2000-09-19 | Owens-Illinois Closure Inc. | Tamper-indicating closure and method of manufacture |
| US6382443B1 (en) | 1999-04-28 | 2002-05-07 | Owens-Illinois Closure Inc. | Tamper-indicating closure with lugs on a stop flange for spacing the flange from the finish of a container |
| US6152316A (en) * | 1999-05-17 | 2000-11-28 | Owens-Illinois Closure Inc. | Tamper-indicating closure and method of manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0552057B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |