JP7838579B2 - 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板 - Google Patents
多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板Info
- Publication number
- JP7838579B2 JP7838579B2 JP2023527898A JP2023527898A JP7838579B2 JP 7838579 B2 JP7838579 B2 JP 7838579B2 JP 2023527898 A JP2023527898 A JP 2023527898A JP 2023527898 A JP2023527898 A JP 2023527898A JP 7838579 B2 JP7838579 B2 JP 7838579B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal polymer
- polymer sheet
- porous liquid
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/06—Non-steroidal liquid crystal compounds
- C09K19/08—Non-steroidal liquid crystal compounds containing at least two non-condensed rings
- C09K19/10—Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/06—Non-steroidal liquid crystal compounds
- C09K19/062—Non-steroidal liquid crystal compounds containing one non-condensed benzene ring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021096552 | 2021-06-09 | ||
| JP2021096552 | 2021-06-09 | ||
| PCT/JP2022/023141 WO2022260087A1 (ja) | 2021-06-09 | 2022-06-08 | 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022260087A1 JPWO2022260087A1 (https=) | 2022-12-15 |
| JPWO2022260087A5 JPWO2022260087A5 (https=) | 2024-02-07 |
| JP7838579B2 true JP7838579B2 (ja) | 2026-04-01 |
Family
ID=84426071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023527898A Active JP7838579B2 (ja) | 2021-06-09 | 2022-06-08 | 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12503649B2 (https=) |
| JP (1) | JP7838579B2 (https=) |
| CN (1) | CN116711468A (https=) |
| WO (1) | WO2022260087A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116724075B (zh) * | 2021-06-09 | 2025-11-28 | 株式会社村田制作所 | 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板 |
| CN116490942A (zh) * | 2021-07-20 | 2023-07-25 | 住友电气工业株式会社 | 印刷布线板及印刷布线板的制造方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351864A (ja) | 1999-06-11 | 2000-12-19 | Sumitomo Chem Co Ltd | 多孔質フィルムおよび多孔質フィルムの製造方法 |
| JP2001072789A (ja) | 1999-09-02 | 2001-03-21 | Toray Ind Inc | 発泡成形体用樹脂組成物および発泡成形体 |
| WO2007097249A1 (ja) | 2006-02-20 | 2007-08-30 | Daicel Chemical Industries, Ltd. | 多孔性フィルム及び多孔性フィルムを用いた積層体 |
| JP2008308669A (ja) | 2007-05-14 | 2008-12-25 | Sumitomo Chemical Co Ltd | 多孔質フィルムの製造方法 |
| JP2012224692A (ja) | 2011-04-16 | 2012-11-15 | Nitto Denko Corp | 多孔質樹脂積層体 |
| JP2016051820A (ja) | 2014-08-29 | 2016-04-11 | 住友電気工業株式会社 | プリント配線板、及びプリント配線板の製造方法 |
| JP2017119378A (ja) | 2015-12-28 | 2017-07-06 | 住友電工ファインポリマー株式会社 | 積層体、プリント配線板用基材及び積層体の製造方法 |
| JP2018109090A (ja) | 2016-12-28 | 2018-07-12 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 |
| JP6434195B2 (ja) | 2016-07-04 | 2018-12-05 | Jxtgエネルギー株式会社 | 全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品 |
| JP2019167484A (ja) | 2018-03-26 | 2019-10-03 | 日東電工株式会社 | 発泡シート |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2876918B2 (ja) | 1992-09-22 | 1999-03-31 | 不二製油株式会社 | パンの製造法 |
| US5545475A (en) | 1994-09-20 | 1996-08-13 | W. L. Gore & Associates | Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof |
| WO2004060660A1 (ja) | 2002-12-27 | 2004-07-22 | Nec Corporation | シート材及び配線板 |
| JP5032957B2 (ja) * | 2007-11-28 | 2012-09-26 | ポリプラスチックス株式会社 | 全芳香族ポリエステル及びポリエステル樹脂組成物 |
| CN103467984B (zh) | 2013-09-18 | 2015-11-25 | 四川大学 | 一种多孔聚酰亚胺纳米复合薄膜及其制备方法 |
| JP7024142B2 (ja) * | 2019-04-23 | 2022-02-22 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法 |
| CN116724075B (zh) | 2021-06-09 | 2025-11-28 | 株式会社村田制作所 | 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板 |
-
2022
- 2022-06-08 CN CN202280009537.7A patent/CN116711468A/zh active Pending
- 2022-06-08 JP JP2023527898A patent/JP7838579B2/ja active Active
- 2022-06-08 WO PCT/JP2022/023141 patent/WO2022260087A1/ja not_active Ceased
-
2023
- 2023-05-24 US US18/322,764 patent/US12503649B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351864A (ja) | 1999-06-11 | 2000-12-19 | Sumitomo Chem Co Ltd | 多孔質フィルムおよび多孔質フィルムの製造方法 |
| JP2001072789A (ja) | 1999-09-02 | 2001-03-21 | Toray Ind Inc | 発泡成形体用樹脂組成物および発泡成形体 |
| WO2007097249A1 (ja) | 2006-02-20 | 2007-08-30 | Daicel Chemical Industries, Ltd. | 多孔性フィルム及び多孔性フィルムを用いた積層体 |
| JP2008308669A (ja) | 2007-05-14 | 2008-12-25 | Sumitomo Chemical Co Ltd | 多孔質フィルムの製造方法 |
| JP2012224692A (ja) | 2011-04-16 | 2012-11-15 | Nitto Denko Corp | 多孔質樹脂積層体 |
| JP2016051820A (ja) | 2014-08-29 | 2016-04-11 | 住友電気工業株式会社 | プリント配線板、及びプリント配線板の製造方法 |
| JP2017119378A (ja) | 2015-12-28 | 2017-07-06 | 住友電工ファインポリマー株式会社 | 積層体、プリント配線板用基材及び積層体の製造方法 |
| JP6434195B2 (ja) | 2016-07-04 | 2018-12-05 | Jxtgエネルギー株式会社 | 全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品 |
| JP2018109090A (ja) | 2016-12-28 | 2018-07-12 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 |
| JP2019167484A (ja) | 2018-03-26 | 2019-10-03 | 日東電工株式会社 | 発泡シート |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116711468A (zh) | 2023-09-05 |
| US20230295506A1 (en) | 2023-09-21 |
| US12503649B2 (en) | 2025-12-23 |
| WO2022260087A1 (ja) | 2022-12-15 |
| JPWO2022260087A1 (https=) | 2022-12-15 |
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