CN116711468A - 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板 - Google Patents

多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板 Download PDF

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Publication number
CN116711468A
CN116711468A CN202280009537.7A CN202280009537A CN116711468A CN 116711468 A CN116711468 A CN 116711468A CN 202280009537 A CN202280009537 A CN 202280009537A CN 116711468 A CN116711468 A CN 116711468A
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CN
China
Prior art keywords
liquid crystal
crystal polymer
polymer sheet
porous liquid
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280009537.7A
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English (en)
Chinese (zh)
Inventor
六车有贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116711468A publication Critical patent/CN116711468A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/06—Non-steroidal liquid crystal compounds
    • C09K19/08—Non-steroidal liquid crystal compounds containing at least two non-condensed rings
    • C09K19/10—Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/06—Non-steroidal liquid crystal compounds
    • C09K19/062—Non-steroidal liquid crystal compounds containing one non-condensed benzene ring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202280009537.7A 2021-06-09 2022-06-08 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板 Pending CN116711468A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-096552 2021-06-09
JP2021096552 2021-06-09
PCT/JP2022/023141 WO2022260087A1 (ja) 2021-06-09 2022-06-08 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板

Publications (1)

Publication Number Publication Date
CN116711468A true CN116711468A (zh) 2023-09-05

Family

ID=84426071

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280009537.7A Pending CN116711468A (zh) 2021-06-09 2022-06-08 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板

Country Status (4)

Country Link
US (1) US12503649B2 (https=)
JP (1) JP7838579B2 (https=)
CN (1) CN116711468A (https=)
WO (1) WO2022260087A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116724075B (zh) * 2021-06-09 2025-11-28 株式会社村田制作所 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板
CN116490942A (zh) * 2021-07-20 2023-07-25 住友电气工业株式会社 印刷布线板及印刷布线板的制造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072789A (ja) * 1999-09-02 2001-03-21 Toray Ind Inc 発泡成形体用樹脂組成物および発泡成形体
JP2008308669A (ja) * 2007-05-14 2008-12-25 Sumitomo Chemical Co Ltd 多孔質フィルムの製造方法
JP2012224692A (ja) * 2011-04-16 2012-11-15 Nitto Denko Corp 多孔質樹脂積層体
JP2016051820A (ja) * 2014-08-29 2016-04-11 住友電気工業株式会社 プリント配線板、及びプリント配線板の製造方法
JP2017119378A (ja) * 2015-12-28 2017-07-06 住友電工ファインポリマー株式会社 積層体、プリント配線板用基材及び積層体の製造方法
JP2018109090A (ja) * 2016-12-28 2018-07-12 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN109563253A (zh) * 2016-07-04 2019-04-02 Jxtg能源株式会社 全芳香族液晶聚酯树脂、成型品、以及电气电子部件
CN111902505A (zh) * 2018-03-26 2020-11-06 日东电工株式会社 发泡片

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2876918B2 (ja) 1992-09-22 1999-03-31 不二製油株式会社 パンの製造法
US5545475A (en) 1994-09-20 1996-08-13 W. L. Gore & Associates Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof
JP2000351864A (ja) * 1999-06-11 2000-12-19 Sumitomo Chem Co Ltd 多孔質フィルムおよび多孔質フィルムの製造方法
WO2004060660A1 (ja) 2002-12-27 2004-07-22 Nec Corporation シート材及び配線板
EP2410824A3 (en) 2006-02-20 2012-10-31 Daicel Chemical Industries, Ltd. Porous film and layered product including porous film
JP5032957B2 (ja) * 2007-11-28 2012-09-26 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物
CN103467984B (zh) 2013-09-18 2015-11-25 四川大学 一种多孔聚酰亚胺纳米复合薄膜及其制备方法
JP7024142B2 (ja) * 2019-04-23 2022-02-22 株式会社クラレ 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
CN116724075B (zh) 2021-06-09 2025-11-28 株式会社村田制作所 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001072789A (ja) * 1999-09-02 2001-03-21 Toray Ind Inc 発泡成形体用樹脂組成物および発泡成形体
JP2008308669A (ja) * 2007-05-14 2008-12-25 Sumitomo Chemical Co Ltd 多孔質フィルムの製造方法
JP2012224692A (ja) * 2011-04-16 2012-11-15 Nitto Denko Corp 多孔質樹脂積層体
JP2016051820A (ja) * 2014-08-29 2016-04-11 住友電気工業株式会社 プリント配線板、及びプリント配線板の製造方法
JP2017119378A (ja) * 2015-12-28 2017-07-06 住友電工ファインポリマー株式会社 積層体、プリント配線板用基材及び積層体の製造方法
CN109563253A (zh) * 2016-07-04 2019-04-02 Jxtg能源株式会社 全芳香族液晶聚酯树脂、成型品、以及电气电子部件
JP2018109090A (ja) * 2016-12-28 2018-07-12 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN111902505A (zh) * 2018-03-26 2020-11-06 日东电工株式会社 发泡片

Also Published As

Publication number Publication date
US20230295506A1 (en) 2023-09-21
US12503649B2 (en) 2025-12-23
WO2022260087A1 (ja) 2022-12-15
JP7838579B2 (ja) 2026-04-01
JPWO2022260087A1 (https=) 2022-12-15

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