JPWO2022260087A1 - - Google Patents

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Publication number
JPWO2022260087A1
JPWO2022260087A1 JP2023527898A JP2023527898A JPWO2022260087A1 JP WO2022260087 A1 JPWO2022260087 A1 JP WO2022260087A1 JP 2023527898 A JP2023527898 A JP 2023527898A JP 2023527898 A JP2023527898 A JP 2023527898A JP WO2022260087 A1 JPWO2022260087 A1 JP WO2022260087A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023527898A
Other languages
Japanese (ja)
Other versions
JPWO2022260087A5 (https=
JP7838579B2 (ja
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Application filed filed Critical
Publication of JPWO2022260087A1 publication Critical patent/JPWO2022260087A1/ja
Publication of JPWO2022260087A5 publication Critical patent/JPWO2022260087A5/ja
Application granted granted Critical
Publication of JP7838579B2 publication Critical patent/JP7838579B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/06—Non-steroidal liquid crystal compounds
    • C09K19/08—Non-steroidal liquid crystal compounds containing at least two non-condensed rings
    • C09K19/10—Non-steroidal liquid crystal compounds containing at least two non-condensed rings containing at least two benzene rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C09K19/3804—Polymers with mesogenic groups in the main chain
    • C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/06—Non-steroidal liquid crystal compounds
    • C09K19/062—Non-steroidal liquid crystal compounds containing one non-condensed benzene ring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023527898A 2021-06-09 2022-06-08 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板 Active JP7838579B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021096552 2021-06-09
JP2021096552 2021-06-09
PCT/JP2022/023141 WO2022260087A1 (ja) 2021-06-09 2022-06-08 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板

Publications (3)

Publication Number Publication Date
JPWO2022260087A1 true JPWO2022260087A1 (https=) 2022-12-15
JPWO2022260087A5 JPWO2022260087A5 (https=) 2024-02-07
JP7838579B2 JP7838579B2 (ja) 2026-04-01

Family

ID=84426071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023527898A Active JP7838579B2 (ja) 2021-06-09 2022-06-08 多孔質液晶ポリマーシート、金属層付き多孔質液晶ポリマーシート、及び、電子回路基板

Country Status (4)

Country Link
US (1) US12503649B2 (https=)
JP (1) JP7838579B2 (https=)
CN (1) CN116711468A (https=)
WO (1) WO2022260087A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116724075B (zh) * 2021-06-09 2025-11-28 株式会社村田制作所 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板
CN116490942A (zh) * 2021-07-20 2023-07-25 住友电气工业株式会社 印刷布线板及印刷布线板的制造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351864A (ja) * 1999-06-11 2000-12-19 Sumitomo Chem Co Ltd 多孔質フィルムおよび多孔質フィルムの製造方法
JP2001072789A (ja) * 1999-09-02 2001-03-21 Toray Ind Inc 発泡成形体用樹脂組成物および発泡成形体
WO2007097249A1 (ja) * 2006-02-20 2007-08-30 Daicel Chemical Industries, Ltd. 多孔性フィルム及び多孔性フィルムを用いた積層体
JP2008308669A (ja) * 2007-05-14 2008-12-25 Sumitomo Chemical Co Ltd 多孔質フィルムの製造方法
JP2012224692A (ja) * 2011-04-16 2012-11-15 Nitto Denko Corp 多孔質樹脂積層体
JP2016051820A (ja) * 2014-08-29 2016-04-11 住友電気工業株式会社 プリント配線板、及びプリント配線板の製造方法
JP2017119378A (ja) * 2015-12-28 2017-07-06 住友電工ファインポリマー株式会社 積層体、プリント配線板用基材及び積層体の製造方法
JP2018109090A (ja) * 2016-12-28 2018-07-12 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
JP6434195B2 (ja) * 2016-07-04 2018-12-05 Ｊｘｔｇエネルギー株式会社 全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品
JP2019167484A (ja) * 2018-03-26 2019-10-03 日東電工株式会社 発泡シート

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2876918B2 (ja) 1992-09-22 1999-03-31 不二製油株式会社 パンの製造法
US5545475A (en) 1994-09-20 1996-08-13 W. L. Gore & Associates Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof
WO2004060660A1 (ja) 2002-12-27 2004-07-22 Nec Corporation シート材及び配線板
JP5032957B2 (ja) * 2007-11-28 2012-09-26 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物
CN103467984B (zh) 2013-09-18 2015-11-25 四川大学 一种多孔聚酰亚胺纳米复合薄膜及其制备方法
JP7024142B2 (ja) * 2019-04-23 2022-02-22 株式会社クラレ 熱可塑性液晶ポリマーフィルム、積層体、および成形体、ならびにそれらの製造方法
CN116724075B (zh) 2021-06-09 2025-11-28 株式会社村田制作所 多孔质液晶聚合物片材、带金属层的多孔质液晶聚合物片材以及电子电路基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000351864A (ja) * 1999-06-11 2000-12-19 Sumitomo Chem Co Ltd 多孔質フィルムおよび多孔質フィルムの製造方法
JP2001072789A (ja) * 1999-09-02 2001-03-21 Toray Ind Inc 発泡成形体用樹脂組成物および発泡成形体
WO2007097249A1 (ja) * 2006-02-20 2007-08-30 Daicel Chemical Industries, Ltd. 多孔性フィルム及び多孔性フィルムを用いた積層体
JP2008308669A (ja) * 2007-05-14 2008-12-25 Sumitomo Chemical Co Ltd 多孔質フィルムの製造方法
JP2012224692A (ja) * 2011-04-16 2012-11-15 Nitto Denko Corp 多孔質樹脂積層体
JP2016051820A (ja) * 2014-08-29 2016-04-11 住友電気工業株式会社 プリント配線板、及びプリント配線板の製造方法
JP2017119378A (ja) * 2015-12-28 2017-07-06 住友電工ファインポリマー株式会社 積層体、プリント配線板用基材及び積層体の製造方法
JP6434195B2 (ja) * 2016-07-04 2018-12-05 Ｊｘｔｇエネルギー株式会社 全芳香族液晶ポリエステル樹脂、成形品、および電気電子部品
JP2018109090A (ja) * 2016-12-28 2018-07-12 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
JP2019167484A (ja) * 2018-03-26 2019-10-03 日東電工株式会社 発泡シート

Also Published As

Publication number Publication date
CN116711468A (zh) 2023-09-05
US20230295506A1 (en) 2023-09-21
US12503649B2 (en) 2025-12-23
WO2022260087A1 (ja) 2022-12-15
JP7838579B2 (ja) 2026-04-01

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