JP7837024B2 - 直接描画装置及びその制御方法 - Google Patents

直接描画装置及びその制御方法

Info

Publication number
JP7837024B2
JP7837024B2 JP2023545591A JP2023545591A JP7837024B2 JP 7837024 B2 JP7837024 B2 JP 7837024B2 JP 2023545591 A JP2023545591 A JP 2023545591A JP 2023545591 A JP2023545591 A JP 2023545591A JP 7837024 B2 JP7837024 B2 JP 7837024B2
Authority
JP
Japan
Prior art keywords
pattern
substrate
direct drawing
error data
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023545591A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023032962A1 (https=
Inventor
健 三宅
▲徳▼ 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Publication of JPWO2023032962A1 publication Critical patent/JPWO2023032962A1/ja
Application granted granted Critical
Publication of JP7837024B2 publication Critical patent/JP7837024B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2023545591A 2021-09-03 2022-08-30 直接描画装置及びその制御方法 Active JP7837024B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021143710 2021-09-03
JP2021143710 2021-09-03
PCT/JP2022/032547 WO2023032962A1 (ja) 2021-09-03 2022-08-30 直接描画装置及びその制御方法

Publications (2)

Publication Number Publication Date
JPWO2023032962A1 JPWO2023032962A1 (https=) 2023-03-09
JP7837024B2 true JP7837024B2 (ja) 2026-03-30

Family

ID=85411249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545591A Active JP7837024B2 (ja) 2021-09-03 2022-08-30 直接描画装置及びその制御方法

Country Status (5)

Country Link
JP (1) JP7837024B2 (https=)
KR (1) KR20240055034A (https=)
CN (1) CN117882014A (https=)
TW (1) TW202319841A (https=)
WO (1) WO2023032962A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311145A (ja) 2004-04-23 2005-11-04 Canon Inc 露光装置、露光方法、デバイス製造方法、パターン形成装置および位置合わせ方法
JP2007220937A (ja) 2006-02-17 2007-08-30 Toppan Printing Co Ltd 基板の重ね描画方法
JP2011158718A (ja) 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2011237781A (ja) 2010-05-06 2011-11-24 Samsung Electronics Co Ltd マスクレス露光装置とマスクレス露光でのオーバーレイのための整列方法
JP2014066870A (ja) 2012-09-26 2014-04-17 Hitachi High-Technologies Corp パターン形成方法及び装置、露光装置並びに表示用パネル製造方法
JP2019061089A (ja) 2017-09-27 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311145A (ja) 2004-04-23 2005-11-04 Canon Inc 露光装置、露光方法、デバイス製造方法、パターン形成装置および位置合わせ方法
JP2007220937A (ja) 2006-02-17 2007-08-30 Toppan Printing Co Ltd 基板の重ね描画方法
JP2011158718A (ja) 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP2011237781A (ja) 2010-05-06 2011-11-24 Samsung Electronics Co Ltd マスクレス露光装置とマスクレス露光でのオーバーレイのための整列方法
JP2014066870A (ja) 2012-09-26 2014-04-17 Hitachi High-Technologies Corp パターン形成方法及び装置、露光装置並びに表示用パネル製造方法
JP2019061089A (ja) 2017-09-27 2019-04-18 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

Also Published As

Publication number Publication date
JPWO2023032962A1 (https=) 2023-03-09
CN117882014A (zh) 2024-04-12
WO2023032962A1 (ja) 2023-03-09
TW202319841A (zh) 2023-05-16
KR20240055034A (ko) 2024-04-26

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