KR20240055034A - 직접 묘화 장치 및 그 제어 방법 - Google Patents

직접 묘화 장치 및 그 제어 방법 Download PDF

Info

Publication number
KR20240055034A
KR20240055034A KR1020247010318A KR20247010318A KR20240055034A KR 20240055034 A KR20240055034 A KR 20240055034A KR 1020247010318 A KR1020247010318 A KR 1020247010318A KR 20247010318 A KR20247010318 A KR 20247010318A KR 20240055034 A KR20240055034 A KR 20240055034A
Authority
KR
South Korea
Prior art keywords
pattern
substrate
error data
drawing device
direct drawing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247010318A
Other languages
English (en)
Korean (ko)
Inventor
켄 미야케
덕 리
Original Assignee
상에이 기켄 가부시키가이샤
가부시키가이샤 에오릭
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 상에이 기켄 가부시키가이샤, 가부시키가이샤 에오릭 filed Critical 상에이 기켄 가부시키가이샤
Publication of KR20240055034A publication Critical patent/KR20240055034A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019—Calibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020247010318A 2021-09-03 2022-08-30 직접 묘화 장치 및 그 제어 방법 Pending KR20240055034A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021143710 2021-09-03
JPJP-P-2021-143710 2021-09-03
PCT/JP2022/032547 WO2023032962A1 (ja) 2021-09-03 2022-08-30 直接描画装置及びその制御方法

Publications (1)

Publication Number Publication Date
KR20240055034A true KR20240055034A (ko) 2024-04-26

Family

ID=85411249

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247010318A Pending KR20240055034A (ko) 2021-09-03 2022-08-30 직접 묘화 장치 및 그 제어 방법

Country Status (5)

Country Link
JP (1) JP7837024B2 (https=)
KR (1) KR20240055034A (https=)
CN (1) CN117882014A (https=)
TW (1) TW202319841A (https=)
WO (1) WO2023032962A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311145A (ja) * 2004-04-23 2005-11-04 Canon Inc 露光装置、露光方法、デバイス製造方法、パターン形成装置および位置合わせ方法
JP2007220937A (ja) * 2006-02-17 2007-08-30 Toppan Printing Co Ltd 基板の重ね描画方法
JP2011158718A (ja) * 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
KR101059811B1 (ko) * 2010-05-06 2011-08-26 삼성전자주식회사 마스크리스 노광 장치와 마스크리스 노광에서 오버레이를 위한 정렬 방법
JP2014066870A (ja) * 2012-09-26 2014-04-17 Hitachi High-Technologies Corp パターン形成方法及び装置、露光装置並びに表示用パネル製造方法
JP6900284B2 (ja) * 2017-09-27 2021-07-07 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法

Also Published As

Publication number Publication date
JPWO2023032962A1 (https=) 2023-03-09
JP7837024B2 (ja) 2026-03-30
CN117882014A (zh) 2024-04-12
WO2023032962A1 (ja) 2023-03-09
TW202319841A (zh) 2023-05-16

Similar Documents

Publication Publication Date Title
TWI684390B (zh) 加工位置校正裝置及其方法
JP4128156B2 (ja) 部品実装方法及び装置
US7283660B2 (en) Multi-layer printed circuit board fabrication system and method
TWI633279B (zh) 基板測量裝置及雷射加工系統
JP5301329B2 (ja) 電子部品の実装方法
KR102860260B1 (ko) 다이 배치 오차를 보정하기 위한 적응적 라우팅
CN103079746A (zh) 激光加工装置及基板位置检测方法
KR20120123581A (ko) 패턴 정렬을 수행하기 위한 방법 및 장치
US9423242B2 (en) Board-warping measuring apparatus and board-warping measuring method thereof
US20030086600A1 (en) Multi-layer printed circuit board fabrication system and method
CN114998334A (zh) 工件通孔位置校准方法及检测装置
US6819789B1 (en) Scaling and registration calibration especially in printed circuit board fabrication
US6563530B1 (en) Camera position-correcting method and system and dummy component for use in camera position correction
US20130075135A1 (en) Printed circuit board and manufacturing method thereof
KR20130004311A (ko) 패턴 정렬을 수행하기 위한 방법 및 장치
US8400174B2 (en) Method of correcting a position of a prober
JP3644846B2 (ja) 描画装置の移動誤差検出装置及びその方法
KR20240055034A (ko) 직접 묘화 장치 및 그 제어 방법
JP4351955B2 (ja) 基準点の位置決定方法
JP2002239877A (ja) 穴加工位置補正方法、穴加工位置補正装置、およびレーザ加工装置
JP2005030793A (ja) 基板検査装置および検査方法
JP2010113001A (ja) 直接露光方法および直接露光装置
JP2001315299A (ja) スクリーン印刷におけるスクリーンマスクの位置合わせ方法
KR20220137634A (ko) 전기 회로의 제조에서의 패터닝된 오브젝트의 다수의 피처의 검사를 위한 시스템 및 방법
KR20260038194A (ko) 이미지 센서의 스티칭 구조, 렌즈 및 마이크로 카메라

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902