JP7830941B2 - 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法 - Google Patents

感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法

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Publication number
JP7830941B2
JP7830941B2 JP2021546305A JP2021546305A JP7830941B2 JP 7830941 B2 JP7830941 B2 JP 7830941B2 JP 2021546305 A JP2021546305 A JP 2021546305A JP 2021546305 A JP2021546305 A JP 2021546305A JP 7830941 B2 JP7830941 B2 JP 7830941B2
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JP
Japan
Prior art keywords
organic
resin composition
photosensitive resin
cured product
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021546305A
Other languages
English (en)
Japanese (ja)
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JPWO2022039028A1 (https=
Inventor
圭 池田
悠佑 小森
一登 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of JPWO2022039028A1 publication Critical patent/JPWO2022039028A1/ja
Application granted granted Critical
Publication of JP7830941B2 publication Critical patent/JP7830941B2/ja
Active legal-status Critical Current
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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/023Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional [2D] radiating surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2021546305A 2020-08-17 2021-08-04 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法 Active JP7830941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020137261 2020-08-17
JP2020137261 2020-08-17
PCT/JP2021/028917 WO2022039028A1 (ja) 2020-08-17 2021-08-04 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法

Publications (2)

Publication Number Publication Date
JPWO2022039028A1 JPWO2022039028A1 (https=) 2022-02-24
JP7830941B2 true JP7830941B2 (ja) 2026-03-17

Family

ID=80322677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021546305A Active JP7830941B2 (ja) 2020-08-17 2021-08-04 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法

Country Status (5)

Country Link
JP (1) JP7830941B2 (https=)
KR (1) KR102891923B1 (https=)
CN (1) CN115698854B (https=)
TW (1) TW202208516A (https=)
WO (1) WO2022039028A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190309A1 (ja) * 2023-03-13 2024-09-19 東レ株式会社 感光性組成物、硬化物、表示装置、及び硬化物の製造方法
WO2025203858A1 (ja) * 2024-03-25 2025-10-02 東レ株式会社 感光性樹脂組成物、硬化物、表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002091343A (ja) 2000-06-28 2002-03-27 Toray Ind Inc 表示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
KR101308811B1 (ko) * 2008-05-09 2013-09-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체, 감광성 폴리이미드 전구체 조성물, 감광성 드라이 필름 및 그들을 사용한 플렉시블 프린트 배선 기판
JP2011227492A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd ネガ型レジスト組成物、並びに、当該レジスト組成物を用いたレリーフパターンの製造方法及び電子部品
JP5691657B2 (ja) * 2011-03-04 2015-04-01 日油株式会社 感光性樹脂組成物およびその用途
JP5468650B2 (ja) * 2011-09-29 2014-04-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6140506B2 (ja) * 2013-03-29 2017-05-31 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP2016166951A (ja) * 2015-03-09 2016-09-15 Jnc株式会社 感光性組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002091343A (ja) 2000-06-28 2002-03-27 Toray Ind Inc 表示装置

Also Published As

Publication number Publication date
CN115698854A (zh) 2023-02-03
WO2022039028A1 (ja) 2022-02-24
KR20230051766A (ko) 2023-04-18
TW202208516A (zh) 2022-03-01
JPWO2022039028A1 (https=) 2022-02-24
CN115698854B (zh) 2025-08-22
KR102891923B1 (ko) 2025-11-27

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