CN115698854B - 感光性树脂组合物、硬化物、有机电致发光显示装置、半导体装置及硬化物的制造方法 - Google Patents

感光性树脂组合物、硬化物、有机电致发光显示装置、半导体装置及硬化物的制造方法

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Publication number
CN115698854B
CN115698854B CN202180043115.7A CN202180043115A CN115698854B CN 115698854 B CN115698854 B CN 115698854B CN 202180043115 A CN202180043115 A CN 202180043115A CN 115698854 B CN115698854 B CN 115698854B
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CN
China
Prior art keywords
resin composition
photosensitive resin
cured product
formula
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180043115.7A
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English (en)
Chinese (zh)
Other versions
CN115698854A (zh
Inventor
池田圭
小森悠佑
三好一登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
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Toray Industries Inc
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Publication date
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Publication of CN115698854A publication Critical patent/CN115698854A/zh
Application granted granted Critical
Publication of CN115698854B publication Critical patent/CN115698854B/zh
Active legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
CN202180043115.7A 2020-08-17 2021-08-04 感光性树脂组合物、硬化物、有机电致发光显示装置、半导体装置及硬化物的制造方法 Active CN115698854B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020137261 2020-08-17
JP2020-137261 2020-08-17
PCT/JP2021/028917 WO2022039028A1 (ja) 2020-08-17 2021-08-04 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法

Publications (2)

Publication Number Publication Date
CN115698854A CN115698854A (zh) 2023-02-03
CN115698854B true CN115698854B (zh) 2025-08-22

Family

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Family Applications (1)

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CN202180043115.7A Active CN115698854B (zh) 2020-08-17 2021-08-04 感光性树脂组合物、硬化物、有机电致发光显示装置、半导体装置及硬化物的制造方法

Country Status (5)

Country Link
JP (1) JP7830941B2 (https=)
KR (1) KR102891923B1 (https=)
CN (1) CN115698854B (https=)
TW (1) TW202208516A (https=)
WO (1) WO2022039028A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190309A1 (ja) * 2023-03-13 2024-09-19 東レ株式会社 感光性組成物、硬化物、表示装置、及び硬化物の製造方法
WO2025203858A1 (ja) * 2024-03-25 2025-10-02 東レ株式会社 感光性樹脂組成物、硬化物、表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185291A (ja) * 2011-03-04 2012-09-27 Nof Corp 感光性樹脂組成物およびその用途
CN105954972A (zh) * 2015-03-09 2016-09-21 捷恩智株式会社 感光性组合物、硬化膜、彩色滤光片、显示元件、固体摄像元件、触摸屏及led发光体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
JP4982927B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
KR101308811B1 (ko) * 2008-05-09 2013-09-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체, 감광성 폴리이미드 전구체 조성물, 감광성 드라이 필름 및 그들을 사용한 플렉시블 프린트 배선 기판
JP2011227492A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd ネガ型レジスト組成物、並びに、当該レジスト組成物を用いたレリーフパターンの製造方法及び電子部品
JP5468650B2 (ja) * 2011-09-29 2014-04-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6140506B2 (ja) * 2013-03-29 2017-05-31 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185291A (ja) * 2011-03-04 2012-09-27 Nof Corp 感光性樹脂組成物およびその用途
CN105954972A (zh) * 2015-03-09 2016-09-21 捷恩智株式会社 感光性组合物、硬化膜、彩色滤光片、显示元件、固体摄像元件、触摸屏及led发光体

Also Published As

Publication number Publication date
CN115698854A (zh) 2023-02-03
WO2022039028A1 (ja) 2022-02-24
KR20230051766A (ko) 2023-04-18
TW202208516A (zh) 2022-03-01
JPWO2022039028A1 (https=) 2022-02-24
KR102891923B1 (ko) 2025-11-27
JP7830941B2 (ja) 2026-03-17

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