KR102891923B1 - 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법 - Google Patents

감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법

Info

Publication number
KR102891923B1
KR102891923B1 KR1020227042069A KR20227042069A KR102891923B1 KR 102891923 B1 KR102891923 B1 KR 102891923B1 KR 1020227042069 A KR1020227042069 A KR 1020227042069A KR 20227042069 A KR20227042069 A KR 20227042069A KR 102891923 B1 KR102891923 B1 KR 102891923B1
Authority
KR
South Korea
Prior art keywords
resin composition
photosensitive resin
group
organic
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227042069A
Other languages
English (en)
Korean (ko)
Other versions
KR20230051766A (ko
Inventor
케이 이케다
유스케 코모리
카즈토 미요시
Original Assignee
도레이 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20230051766A publication Critical patent/KR20230051766A/ko
Application granted granted Critical
Publication of KR102891923B1 publication Critical patent/KR102891923B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
KR1020227042069A 2020-08-17 2021-08-04 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법 Active KR102891923B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020137261 2020-08-17
JPJP-P-2020-137261 2020-08-17
PCT/JP2021/028917 WO2022039028A1 (ja) 2020-08-17 2021-08-04 感光性樹脂組成物、硬化物、表示装置、半導体装置及び硬化物の製造方法

Publications (2)

Publication Number Publication Date
KR20230051766A KR20230051766A (ko) 2023-04-18
KR102891923B1 true KR102891923B1 (ko) 2025-11-27

Family

ID=80322677

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227042069A Active KR102891923B1 (ko) 2020-08-17 2021-08-04 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법

Country Status (5)

Country Link
JP (1) JP7830941B2 (https=)
KR (1) KR102891923B1 (https=)
CN (1) CN115698854B (https=)
TW (1) TW202208516A (https=)
WO (1) WO2022039028A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190309A1 (ja) * 2023-03-13 2024-09-19 東レ株式会社 感光性組成物、硬化物、表示装置、及び硬化物の製造方法
WO2025203858A1 (ja) * 2024-03-25 2025-10-02 東レ株式会社 感光性樹脂組成物、硬化物、表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
JP4982927B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
KR101308811B1 (ko) * 2008-05-09 2013-09-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체, 감광성 폴리이미드 전구체 조성물, 감광성 드라이 필름 및 그들을 사용한 플렉시블 프린트 배선 기판
JP2011227492A (ja) * 2010-03-30 2011-11-10 Dainippon Printing Co Ltd ネガ型レジスト組成物、並びに、当該レジスト組成物を用いたレリーフパターンの製造方法及び電子部品
JP5691657B2 (ja) * 2011-03-04 2015-04-01 日油株式会社 感光性樹脂組成物およびその用途
JP5468650B2 (ja) * 2011-09-29 2014-04-09 富士フイルム株式会社 感光性樹脂組成物、硬化膜並びにその製造方法
JP5884551B2 (ja) * 2012-02-27 2016-03-15 日油株式会社 感光性樹脂組成物およびその用途
JP6140506B2 (ja) * 2013-03-29 2017-05-31 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターン形成方法
JP2016166951A (ja) * 2015-03-09 2016-09-15 Jnc株式会社 感光性組成物

Also Published As

Publication number Publication date
CN115698854A (zh) 2023-02-03
WO2022039028A1 (ja) 2022-02-24
KR20230051766A (ko) 2023-04-18
TW202208516A (zh) 2022-03-01
JPWO2022039028A1 (https=) 2022-02-24
CN115698854B (zh) 2025-08-22
JP7830941B2 (ja) 2026-03-17

Similar Documents

Publication Publication Date Title
JP6521030B2 (ja) 感光性着色樹脂組成物
CN106715597B (zh) 树脂组合物、耐热性树脂膜的制造方法及显示装置
JP4735778B1 (ja) ポジ型感光性樹脂組成物
JP6724363B2 (ja) 樹脂および感光性樹脂組成物
JP5381491B2 (ja) 樹脂およびポジ型感光性樹脂組成物
KR102542822B1 (ko) 수지 조성물, 그의 경화 릴리프 패턴, 및 그것을 사용한 반도체 전자 부품 또는 반도체 장치의 제조 방법
JP2010008851A (ja) ポジ型感光性樹脂組成物
JP2009258634A (ja) ポジ型感光性樹脂組成物
KR102891923B1 (ko) 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법
JP5176600B2 (ja) ポジ型感光性樹脂組成物
JPWO2015137281A1 (ja) 感光性樹脂組成物
JP2013205553A (ja) ポジ型感光性樹脂組成物
JP6102389B2 (ja) 樹脂組成物
JP7521526B2 (ja) 有機ｅｌ表示装置、硬化物の製造方法および有機ｅｌ表示装置の製造方法
JP2014178400A (ja) ポジ型感光性樹脂組成物
JP2024138963A (ja) 感光性樹脂組成物、硬化物、有機ｅｌ表示装置、および半導体装置
WO2023171487A1 (ja) 感光性樹脂組成物、硬化物、表示装置および表示装置の製造方法
JP2010072143A (ja) ポジ型感光性樹脂組成物
CN116802221A (zh) 感光性树脂组合物、固化物、层叠体、显示装置及显示装置的制造方法
JP7835159B2 (ja) 積層体、表示装置、および表示装置の製造方法
JP2013164432A (ja) ポジ型感光性樹脂組成物
WO2023171284A1 (ja) 感光性樹脂組成物、硬化物、硬化物の製造方法、有機ｅｌ表示装置および表示装置
CN118679427A (zh) 感光性树脂组合物、硬化物、硬化物的制造方法、有机el显示装置及显示装置
KR20240166996A (ko) 포지티브형 감광성 수지 조성물, 경화물, 유기 el 표시 장치, 경화물의 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)