JP7816546B2 - プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置 - Google Patents
プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置Info
- Publication number
- JP7816546B2 JP7816546B2 JP2024548186A JP2024548186A JP7816546B2 JP 7816546 B2 JP7816546 B2 JP 7816546B2 JP 2024548186 A JP2024548186 A JP 2024548186A JP 2024548186 A JP2024548186 A JP 2024548186A JP 7816546 B2 JP7816546 B2 JP 7816546B2
- Authority
- JP
- Japan
- Prior art keywords
- press
- electronic component
- head
- sheet portion
- press head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022148963 | 2022-09-20 | ||
| JP2022148963 | 2022-09-20 | ||
| PCT/JP2023/032475 WO2024062921A1 (ja) | 2022-09-20 | 2023-09-06 | プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024062921A1 JPWO2024062921A1 (https=) | 2024-03-28 |
| JPWO2024062921A5 JPWO2024062921A5 (https=) | 2025-04-17 |
| JP7816546B2 true JP7816546B2 (ja) | 2026-02-18 |
Family
ID=90454235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024548186A Active JP7816546B2 (ja) | 2022-09-20 | 2023-09-06 | プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7816546B2 (https=) |
| CN (1) | CN119768904A (https=) |
| WO (1) | WO2024062921A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335627A (ja) | 2003-05-06 | 2004-11-25 | Nippon Tungsten Co Ltd | 加熱圧着用ツール及びその製造方法 |
| JP2017120835A (ja) | 2015-12-28 | 2017-07-06 | 富士通株式会社 | 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5169543B2 (ja) * | 2008-07-02 | 2013-03-27 | Ｎｅｃエンジニアリング株式会社 | 半導体チップの実装装置 |
-
2023
- 2023-09-06 CN CN202380062426.7A patent/CN119768904A/zh active Pending
- 2023-09-06 JP JP2024548186A patent/JP7816546B2/ja active Active
- 2023-09-06 WO PCT/JP2023/032475 patent/WO2024062921A1/ja not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004335627A (ja) | 2003-05-06 | 2004-11-25 | Nippon Tungsten Co Ltd | 加熱圧着用ツール及びその製造方法 |
| JP2017120835A (ja) | 2015-12-28 | 2017-07-06 | 富士通株式会社 | 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024062921A1 (ja) | 2024-03-28 |
| CN119768904A (zh) | 2025-04-04 |
| JPWO2024062921A1 (https=) | 2024-03-28 |
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