JPWO2024062921A5 - - Google Patents

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Publication number
JPWO2024062921A5
JPWO2024062921A5 JP2024548186A JP2024548186A JPWO2024062921A5 JP WO2024062921 A5 JPWO2024062921 A5 JP WO2024062921A5 JP 2024548186 A JP2024548186 A JP 2024548186A JP 2024548186 A JP2024548186 A JP 2024548186A JP WO2024062921 A5 JPWO2024062921 A5 JP WO2024062921A5
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JP2024548186A
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Japanese (ja)
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JP7816546B2 (ja
JPWO2024062921A1 (https=
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Priority claimed from PCT/JP2023/032475 external-priority patent/WO2024062921A1/ja
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Publication of JPWO2024062921A5 publication Critical patent/JPWO2024062921A5/ja
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JP2024548186A 2022-09-20 2023-09-06 プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置 Active JP7816546B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022148963 2022-09-20
JP2022148963 2022-09-20
PCT/JP2023/032475 WO2024062921A1 (ja) 2022-09-20 2023-09-06 プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置

Publications (3)

Publication Number Publication Date
JPWO2024062921A1 JPWO2024062921A1 (https=) 2024-03-28
JPWO2024062921A5 true JPWO2024062921A5 (https=) 2025-04-17
JP7816546B2 JP7816546B2 (ja) 2026-02-18

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ID=90454235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024548186A Active JP7816546B2 (ja) 2022-09-20 2023-09-06 プレスヘッド、プレス装置、半導体製造装置、および電子部品製造装置

Country Status (3)

Country Link
JP (1) JP7816546B2 (https=)
CN (1) CN119768904A (https=)
WO (1) WO2024062921A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4101695B2 (ja) * 2003-05-06 2008-06-18 日本タングステン株式会社 加熱圧着用ツール及びその製造方法
JP5169543B2 (ja) * 2008-07-02 2013-03-27 Ｎｅｃエンジニアリング株式会社 半導体チップの実装装置
JP6582975B2 (ja) * 2015-12-28 2019-10-02 富士通株式会社 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法

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