JP7816155B2 - プリプレグ、金属張積層板、及びプリント配線板 - Google Patents

プリプレグ、金属張積層板、及びプリント配線板

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Publication number
JP7816155B2
JP7816155B2 JP2022546221A JP2022546221A JP7816155B2 JP 7816155 B2 JP7816155 B2 JP 7816155B2 JP 2022546221 A JP2022546221 A JP 2022546221A JP 2022546221 A JP2022546221 A JP 2022546221A JP 7816155 B2 JP7816155 B2 JP 7816155B2
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Japan
Prior art keywords
group
carbon atoms
compounds
hydrocarbon group
groups
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JP2022546221A
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English (en)
Japanese (ja)
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JPWO2022050064A1 (https=
Inventor
伸行 宮木
直之 川島
祐徳 山下
翔馬 穴吹
健太 西野
洸瑠 亀山
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JSR Corp
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JSR Corp
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Publication of JP7816155B2 publication Critical patent/JP7816155B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/247—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using fibres of at least two types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2022546221A 2020-09-01 2021-08-19 プリプレグ、金属張積層板、及びプリント配線板 Active JP7816155B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020146667 2020-09-01
JP2020146667 2020-09-01
PCT/JP2021/030351 WO2022050064A1 (ja) 2020-09-01 2021-08-19 プリプレグ、金属張積層板、及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2022050064A1 JPWO2022050064A1 (https=) 2022-03-10
JP7816155B2 true JP7816155B2 (ja) 2026-02-18

Family

ID=80491093

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JP2022546221A Active JP7816155B2 (ja) 2020-09-01 2021-08-19 プリプレグ、金属張積層板、及びプリント配線板

Country Status (6)

Country Link
US (1) US20230345631A1 (https=)
JP (1) JP7816155B2 (https=)
KR (1) KR20230059790A (https=)
CN (1) CN116209706A (https=)
TW (1) TWI912346B (https=)
WO (1) WO2022050064A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119677789A (zh) * 2022-08-09 2025-03-21 纳美仕有限公司 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件
CN118047913A (zh) 2022-11-16 2024-05-17 Agc多材料美国有限公司 可固化组合物
WO2024257781A1 (ja) * 2023-06-16 2024-12-19 Jsr株式会社 配線基板形成用熱硬化性樹脂組成物、硬化物、プリプレグおよび層間絶縁フィルム
TW202536021A (zh) * 2023-10-16 2025-09-16 日商Ａｇｃ股份有限公司 樹脂組合物、預浸體、金屬箔積層板及其製造方法
WO2025115606A1 (ja) * 2023-11-30 2025-06-05 Jsr株式会社 樹脂組成物、硬化物、および電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005029788A (ja) 2003-06-19 2005-02-03 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2017200997A (ja) 2016-04-27 2017-11-09 Jsr株式会社 組成物、硬化物及び積層体
JP2021172756A (ja) 2020-04-27 2021-11-01 味の素株式会社 樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE551373T1 (de) * 2003-08-07 2012-04-15 Zeon Corp Polymerisierbare zusammensetzung und daraus hergestellter körper
JP5465854B2 (ja) 2008-08-26 2014-04-09 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
WO2015152427A1 (ja) * 2014-04-04 2015-10-08 日立化成株式会社 Ｎ－置換マレイミド基を有するポリフェニレンエーテル誘導体、並びにそれを用いた熱硬化性樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及び多層プリント配線板
WO2017183461A1 (ja) * 2016-04-20 2017-10-26 Jsr株式会社 重合体、組成物、成形体、硬化物及び積層体
WO2018020981A1 (ja) * 2016-07-28 2018-02-01 Jsr株式会社 重合体、組成物、成形体、硬化物及び積層体
CN111386313B (zh) * 2018-01-09 2020-10-30 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、及印刷布线板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005029788A (ja) 2003-06-19 2005-02-03 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2017200997A (ja) 2016-04-27 2017-11-09 Jsr株式会社 組成物、硬化物及び積層体
JP2021172756A (ja) 2020-04-27 2021-11-01 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
WO2022050064A1 (ja) 2022-03-10
CN116209706A (zh) 2023-06-02
TWI912346B (zh) 2026-01-21
US20230345631A1 (en) 2023-10-26
KR20230059790A (ko) 2023-05-03
JPWO2022050064A1 (https=) 2022-03-10
TW202214746A (zh) 2022-04-16

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