CN116209706A - 预浸体、覆金属层叠板及印刷配线板 - Google Patents

预浸体、覆金属层叠板及印刷配线板 Download PDF

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Publication number
CN116209706A
CN116209706A CN202180058075.3A CN202180058075A CN116209706A CN 116209706 A CN116209706 A CN 116209706A CN 202180058075 A CN202180058075 A CN 202180058075A CN 116209706 A CN116209706 A CN 116209706A
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CN
China
Prior art keywords
group
compound
prepreg
formula
hydrocarbon group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180058075.3A
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English (en)
Chinese (zh)
Inventor
宫木伸行
川岛直之
山下祐徳
穴吹翔马
西野健太
亀山洸瑠
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Jicc 02 Co ltd
Original Assignee
JSR Corp
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Publication date
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Publication of CN116209706A publication Critical patent/CN116209706A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/247—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using fibres of at least two types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN202180058075.3A 2020-09-01 2021-08-19 预浸体、覆金属层叠板及印刷配线板 Pending CN116209706A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020146667 2020-09-01
JP2020-146667 2020-09-01
PCT/JP2021/030351 WO2022050064A1 (ja) 2020-09-01 2021-08-19 プリプレグ、金属張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
CN116209706A true CN116209706A (zh) 2023-06-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180058075.3A Pending CN116209706A (zh) 2020-09-01 2021-08-19 预浸体、覆金属层叠板及印刷配线板

Country Status (6)

Country Link
US (1) US20230345631A1 (https=)
JP (1) JP7816155B2 (https=)
KR (1) KR20230059790A (https=)
CN (1) CN116209706A (https=)
TW (1) TWI912346B (https=)
WO (1) WO2022050064A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119677789A (zh) * 2022-08-09 2025-03-21 纳美仕有限公司 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件
CN118047913A (zh) 2022-11-16 2024-05-17 Agc多材料美国有限公司 可固化组合物
WO2024257781A1 (ja) * 2023-06-16 2024-12-19 Jsr株式会社 配線基板形成用熱硬化性樹脂組成物、硬化物、プリプレグおよび層間絶縁フィルム
TW202536021A (zh) * 2023-10-16 2025-09-16 日商Ａｇｃ股份有限公司 樹脂組合物、預浸體、金屬箔積層板及其製造方法
WO2025115606A1 (ja) * 2023-11-30 2025-06-05 Jsr株式会社 樹脂組成物、硬化物、および電子部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106255713A (zh) * 2014-04-04 2016-12-21 日立化成株式会社 聚苯醚衍生物、热固化性树脂组合物、树脂清漆、预浸渍体、层叠板及多层印制线路板
CN109071804A (zh) * 2016-04-20 2018-12-21 Jsr株式会社 聚合物、组合物、成形体、硬化物以及层叠体
CN109563250A (zh) * 2016-07-28 2019-04-02 Jsr株式会社 聚合物、组合物、成形体、硬化物及层叠体
CN111386313A (zh) * 2018-01-09 2020-07-07 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、及印刷布线板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4745625B2 (ja) * 2003-06-19 2011-08-10 住友化学株式会社 エポキシ化合物およびエポキシ樹脂硬化物
ATE551373T1 (de) * 2003-08-07 2012-04-15 Zeon Corp Polymerisierbare zusammensetzung und daraus hergestellter körper
JP5465854B2 (ja) 2008-08-26 2014-04-09 パナソニック株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
JP6919290B2 (ja) * 2016-04-27 2021-08-18 Jsr株式会社 組成物、硬化物及び積層体
JP7702778B2 (ja) * 2020-04-27 2025-07-04 味の素株式会社 樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106255713A (zh) * 2014-04-04 2016-12-21 日立化成株式会社 聚苯醚衍生物、热固化性树脂组合物、树脂清漆、预浸渍体、层叠板及多层印制线路板
CN109071804A (zh) * 2016-04-20 2018-12-21 Jsr株式会社 聚合物、组合物、成形体、硬化物以及层叠体
CN109563250A (zh) * 2016-07-28 2019-04-02 Jsr株式会社 聚合物、组合物、成形体、硬化物及层叠体
CN111386313A (zh) * 2018-01-09 2020-07-07 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板、树脂复合片、及印刷布线板

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Publication number Publication date
WO2022050064A1 (ja) 2022-03-10
TWI912346B (zh) 2026-01-21
US20230345631A1 (en) 2023-10-26
KR20230059790A (ko) 2023-05-03
JPWO2022050064A1 (https=) 2022-03-10
TW202214746A (zh) 2022-04-16
JP7816155B2 (ja) 2026-02-18

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