JP7757342B2 - 研磨液組成物 - Google Patents

研磨液組成物

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Publication number
JP7757342B2
JP7757342B2 JP2023087080A JP2023087080A JP7757342B2 JP 7757342 B2 JP7757342 B2 JP 7757342B2 JP 2023087080 A JP2023087080 A JP 2023087080A JP 2023087080 A JP2023087080 A JP 2023087080A JP 7757342 B2 JP7757342 B2 JP 7757342B2
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Japan
Prior art keywords
polishing
less
silica particles
substrate
silica
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JP2023087080A
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English (en)
Japanese (ja)
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JP2023174608A5 (enExample
JP2023174608A (ja
Inventor
俊介 坂本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
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Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of JP2023174608A publication Critical patent/JP2023174608A/ja
Publication of JP2023174608A5 publication Critical patent/JP2023174608A5/ja
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Publication of JP7757342B2 publication Critical patent/JP7757342B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Landscapes

  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2023087080A 2022-05-26 2023-05-26 研磨液組成物 Active JP7757342B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022086265 2022-05-26
JP2022086265 2022-05-26

Publications (3)

Publication Number Publication Date
JP2023174608A JP2023174608A (ja) 2023-12-07
JP2023174608A5 JP2023174608A5 (enExample) 2024-04-24
JP7757342B2 true JP7757342B2 (ja) 2025-10-21

Family

ID=89030993

Family Applications (1)

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JP2023087080A Active JP7757342B2 (ja) 2022-05-26 2023-05-26 研磨液組成物

Country Status (1)

Country Link
JP (1) JP7757342B2 (enExample)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002309236A (ja) 2000-05-16 2002-10-23 Mitsui Mining & Smelting Co Ltd セリウム系研摩材およびそのための原料、ならびにそれらの製造方法
JP2006097014A (ja) 2004-09-03 2006-04-13 Showa Denko Kk 混合希土類酸化物、混合希土類フッ素化物及びそれらを用いたセリウム系研磨材、並びにそれらの製造方法
JP2018081733A (ja) 2016-11-15 2018-05-24 花王株式会社 磁気ディスク基板用研磨液組成物
JP2019178302A (ja) 2018-03-30 2019-10-17 株式会社フジミインコーポレーテッド 研磨用組成物、パッド表面調整用組成物およびその利用
JP2021175774A (ja) 2020-05-01 2021-11-04 花王株式会社 研磨液組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002309236A (ja) 2000-05-16 2002-10-23 Mitsui Mining & Smelting Co Ltd セリウム系研摩材およびそのための原料、ならびにそれらの製造方法
JP2006097014A (ja) 2004-09-03 2006-04-13 Showa Denko Kk 混合希土類酸化物、混合希土類フッ素化物及びそれらを用いたセリウム系研磨材、並びにそれらの製造方法
JP2018081733A (ja) 2016-11-15 2018-05-24 花王株式会社 磁気ディスク基板用研磨液組成物
JP2019178302A (ja) 2018-03-30 2019-10-17 株式会社フジミインコーポレーテッド 研磨用組成物、パッド表面調整用組成物およびその利用
JP2021175774A (ja) 2020-05-01 2021-11-04 花王株式会社 研磨液組成物

Also Published As

Publication number Publication date
JP2023174608A (ja) 2023-12-07

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