JP7731361B2 - ベイパーチャンバー、及び、これを搭載する半導体パッケージ - Google Patents

ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Info

Publication number
JP7731361B2
JP7731361B2 JP2022546960A JP2022546960A JP7731361B2 JP 7731361 B2 JP7731361 B2 JP 7731361B2 JP 2022546960 A JP2022546960 A JP 2022546960A JP 2022546960 A JP2022546960 A JP 2022546960A JP 7731361 B2 JP7731361 B2 JP 7731361B2
Authority
JP
Japan
Prior art keywords
diffusion member
vapor chamber
heat diffusion
chamber body
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022546960A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022050337A1 (https=
JPWO2022050337A5 (https=
Inventor
聡志 奥
晃男 松谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of JPWO2022050337A1 publication Critical patent/JPWO2022050337A1/ja
Publication of JPWO2022050337A5 publication Critical patent/JPWO2022050337A5/ja
Application granted granted Critical
Publication of JP7731361B2 publication Critical patent/JP7731361B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022546960A 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ Active JP7731361B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020147802 2020-09-02
JP2020147802 2020-09-02
PCT/JP2021/032236 WO2022050337A1 (ja) 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2022050337A1 JPWO2022050337A1 (https=) 2022-03-10
JPWO2022050337A5 JPWO2022050337A5 (https=) 2023-05-24
JP7731361B2 true JP7731361B2 (ja) 2025-08-29

Family

ID=80491082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546960A Active JP7731361B2 (ja) 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Country Status (4)

Country Link
US (1) US20230207425A1 (https=)
JP (1) JP7731361B2 (https=)
CN (1) CN116018678A (https=)
WO (1) WO2022050337A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192282A1 (ja) * 2024-03-15 2025-09-18 日本発條株式会社 積層体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124665A (ja) 2001-10-11 2003-04-25 Fujikura Ltd 電子装置用放熱構造
JP2008522129A (ja) 2004-12-01 2008-06-26 コンバージェンス テクノロジーズ リミテッド 沸騰促進マルチウィック構造物を備えた蒸気チャンバー
JP2015050323A (ja) 2013-09-02 2015-03-16 株式会社フジクラ 半導体パッケージの複合冷却構造
WO2016098890A1 (ja) 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP2017216350A (ja) 2016-05-31 2017-12-07 日産自動車株式会社 半導体装置
WO2019102665A1 (ja) 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2019140332A (ja) 2018-02-14 2019-08-22 トヨタ自動車株式会社 半導体装置
WO2019188614A1 (ja) 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124665A (ja) 2001-10-11 2003-04-25 Fujikura Ltd 電子装置用放熱構造
JP2008522129A (ja) 2004-12-01 2008-06-26 コンバージェンス テクノロジーズ リミテッド 沸騰促進マルチウィック構造物を備えた蒸気チャンバー
JP2015050323A (ja) 2013-09-02 2015-03-16 株式会社フジクラ 半導体パッケージの複合冷却構造
WO2016098890A1 (ja) 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP2017216350A (ja) 2016-05-31 2017-12-07 日産自動車株式会社 半導体装置
WO2019102665A1 (ja) 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2019140332A (ja) 2018-02-14 2019-08-22 トヨタ自動車株式会社 半導体装置
WO2019188614A1 (ja) 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ

Also Published As

Publication number Publication date
US20230207425A1 (en) 2023-06-29
JPWO2022050337A1 (https=) 2022-03-10
WO2022050337A1 (ja) 2022-03-10
CN116018678A (zh) 2023-04-25

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