JPWO2022050337A1 - - Google Patents

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Publication number
JPWO2022050337A1
JPWO2022050337A1 JP2022546960A JP2022546960A JPWO2022050337A1 JP WO2022050337 A1 JPWO2022050337 A1 JP WO2022050337A1 JP 2022546960 A JP2022546960 A JP 2022546960A JP 2022546960 A JP2022546960 A JP 2022546960A JP WO2022050337 A1 JPWO2022050337 A1 JP WO2022050337A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022546960A
Other languages
Japanese (ja)
Other versions
JPWO2022050337A5 (https=
JP7731361B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022050337A1 publication Critical patent/JPWO2022050337A1/ja
Publication of JPWO2022050337A5 publication Critical patent/JPWO2022050337A5/ja
Application granted granted Critical
Publication of JP7731361B2 publication Critical patent/JP7731361B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
JP2022546960A 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ Active JP7731361B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020147802 2020-09-02
JP2020147802 2020-09-02
PCT/JP2021/032236 WO2022050337A1 (ja) 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Publications (3)

Publication Number Publication Date
JPWO2022050337A1 true JPWO2022050337A1 (https=) 2022-03-10
JPWO2022050337A5 JPWO2022050337A5 (https=) 2023-05-24
JP7731361B2 JP7731361B2 (ja) 2025-08-29

Family

ID=80491082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546960A Active JP7731361B2 (ja) 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Country Status (4)

Country Link
US (1) US20230207425A1 (https=)
JP (1) JP7731361B2 (https=)
CN (1) CN116018678A (https=)
WO (1) WO2022050337A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192282A1 (ja) * 2024-03-15 2025-09-18 日本発條株式会社 積層体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124665A (ja) * 2001-10-11 2003-04-25 Fujikura Ltd 電子装置用放熱構造
JP2008522129A (ja) * 2004-12-01 2008-06-26 コンバージェンス テクノロジーズ リミテッド 沸騰促進マルチウィック構造物を備えた蒸気チャンバー
JP2015050323A (ja) * 2013-09-02 2015-03-16 株式会社フジクラ 半導体パッケージの複合冷却構造
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP2017216350A (ja) * 2016-05-31 2017-12-07 日産自動車株式会社 半導体装置
WO2019102665A1 (ja) * 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2019140332A (ja) * 2018-02-14 2019-08-22 トヨタ自動車株式会社 半導体装置
WO2019188614A1 (ja) * 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124665A (ja) * 2001-10-11 2003-04-25 Fujikura Ltd 電子装置用放熱構造
JP2008522129A (ja) * 2004-12-01 2008-06-26 コンバージェンス テクノロジーズ リミテッド 沸騰促進マルチウィック構造物を備えた蒸気チャンバー
JP2015050323A (ja) * 2013-09-02 2015-03-16 株式会社フジクラ 半導体パッケージの複合冷却構造
WO2016098890A1 (ja) * 2014-12-18 2016-06-23 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
JP2017216350A (ja) * 2016-05-31 2017-12-07 日産自動車株式会社 半導体装置
WO2019102665A1 (ja) * 2017-11-21 2019-05-31 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2019140332A (ja) * 2018-02-14 2019-08-22 トヨタ自動車株式会社 半導体装置
WO2019188614A1 (ja) * 2018-03-28 2019-10-03 株式会社カネカ 半導体パッケージ

Also Published As

Publication number Publication date
US20230207425A1 (en) 2023-06-29
WO2022050337A1 (ja) 2022-03-10
CN116018678A (zh) 2023-04-25
JP7731361B2 (ja) 2025-08-29

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