CN116018678A - 导热板、以及安装有此导热板的半导体封装体 - Google Patents

导热板、以及安装有此导热板的半导体封装体 Download PDF

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Publication number
CN116018678A
CN116018678A CN202180053897.2A CN202180053897A CN116018678A CN 116018678 A CN116018678 A CN 116018678A CN 202180053897 A CN202180053897 A CN 202180053897A CN 116018678 A CN116018678 A CN 116018678A
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CN
China
Prior art keywords
diffusion member
heat
thermal diffusion
conducting plate
heat conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180053897.2A
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English (en)
Chinese (zh)
Inventor
奥聪志
松谷晃男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of CN116018678A publication Critical patent/CN116018678A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180053897.2A 2020-09-02 2021-09-02 导热板、以及安装有此导热板的半导体封装体 Pending CN116018678A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-147802 2020-09-02
JP2020147802 2020-09-02
PCT/JP2021/032236 WO2022050337A1 (ja) 2020-09-02 2021-09-02 ベイパーチャンバー、及び、これを搭載する半導体パッケージ

Publications (1)

Publication Number Publication Date
CN116018678A true CN116018678A (zh) 2023-04-25

Family

ID=80491082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180053897.2A Pending CN116018678A (zh) 2020-09-02 2021-09-02 导热板、以及安装有此导热板的半导体封装体

Country Status (4)

Country Link
US (1) US20230207425A1 (https=)
JP (1) JP7731361B2 (https=)
CN (1) CN116018678A (https=)
WO (1) WO2022050337A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025192282A1 (ja) * 2024-03-15 2025-09-18 日本発條株式会社 積層体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003124665A (ja) * 2001-10-11 2003-04-25 Fujikura Ltd 電子装置用放熱構造
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
JP5554444B1 (ja) * 2013-09-02 2014-07-23 株式会社フジクラ 半導体パッケージの複合冷却構造
US20180023904A1 (en) * 2014-12-18 2018-01-25 Kaneka Corporation Graphite laminates, processes for producing graphite laminates, structural object for heat transport, and rod-shaped heat-transporting object
JP6645362B2 (ja) * 2016-05-31 2020-02-14 日産自動車株式会社 半導体装置
JP7164545B2 (ja) * 2017-11-21 2022-11-01 ローム株式会社 半導体装置、パワーモジュールおよび電源装置
JP2019140332A (ja) * 2018-02-14 2019-08-22 トヨタ自動車株式会社 半導体装置
JP2021100006A (ja) * 2018-03-28 2021-07-01 株式会社カネカ 半導体パッケージ

Also Published As

Publication number Publication date
US20230207425A1 (en) 2023-06-29
JPWO2022050337A1 (https=) 2022-03-10
WO2022050337A1 (ja) 2022-03-10
JP7731361B2 (ja) 2025-08-29

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