JP7692342B2 - ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置 - Google Patents

ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置 Download PDF

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Publication number
JP7692342B2
JP7692342B2 JP2021205715A JP2021205715A JP7692342B2 JP 7692342 B2 JP7692342 B2 JP 7692342B2 JP 2021205715 A JP2021205715 A JP 2021205715A JP 2021205715 A JP2021205715 A JP 2021205715A JP 7692342 B2 JP7692342 B2 JP 7692342B2
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Japan
Prior art keywords
polishing
workpiece
polishing head
head
pad
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JP2021205715A
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English (en)
Japanese (ja)
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JP2023091146A5 (enExample
JP2023091146A (ja
Inventor
裕一 加藤
治 鍋谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2021205715A priority Critical patent/JP7692342B2/ja
Priority to US18/080,252 priority patent/US20230191553A1/en
Priority to TW111147954A priority patent/TW202333892A/zh
Priority to KR1020220174423A priority patent/KR20230094154A/ko
Priority to CN202211633440.1A priority patent/CN116352595A/zh
Publication of JP2023091146A publication Critical patent/JP2023091146A/ja
Publication of JP2023091146A5 publication Critical patent/JP2023091146A5/ja
Application granted granted Critical
Publication of JP7692342B2 publication Critical patent/JP7692342B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021205715A 2021-12-20 2021-12-20 ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置 Active JP7692342B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021205715A JP7692342B2 (ja) 2021-12-20 2021-12-20 ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置
US18/080,252 US20230191553A1 (en) 2021-12-20 2022-12-13 Method of raising polishing head after polishing of workpiece, polishing apparatus for workpiece, and computer-readable storage medium storing program
TW111147954A TW202333892A (zh) 2021-12-20 2022-12-14 於工件研磨後使得研磨頭上升的方法、工件的研磨裝置、及記錄了程式的電腦可讀取記錄媒體
KR1020220174423A KR20230094154A (ko) 2021-12-20 2022-12-14 워크피스의 연마 후에 연마 헤드를 상승시키는 방법, 워크피스의 연마 장치, 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
CN202211633440.1A CN116352595A (zh) 2021-12-20 2022-12-19 在工件的研磨后使研磨头上升的方法、研磨装置及计算机可读取的记录介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021205715A JP7692342B2 (ja) 2021-12-20 2021-12-20 ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置

Publications (3)

Publication Number Publication Date
JP2023091146A JP2023091146A (ja) 2023-06-30
JP2023091146A5 JP2023091146A5 (enExample) 2024-05-21
JP7692342B2 true JP7692342B2 (ja) 2025-06-13

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JP2021205715A Active JP7692342B2 (ja) 2021-12-20 2021-12-20 ワークピースの研磨後に研磨ヘッドを上昇させる方法、ワークピースの研磨装置

Country Status (5)

Country Link
US (1) US20230191553A1 (enExample)
JP (1) JP7692342B2 (enExample)
KR (1) KR20230094154A (enExample)
CN (1) CN116352595A (enExample)
TW (1) TW202333892A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118081513B (zh) * 2024-04-18 2024-07-30 浙江大学 一种压电阵列驱动的薄膜主动应力调控磨抛装置及方法
CN119526238B (zh) * 2024-12-09 2025-11-28 西安奕斯伟材料科技股份有限公司 硅片抛光方法和硅片抛光设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009178800A (ja) 2008-01-30 2009-08-13 Ebara Corp 研磨方法及び研磨装置
JP5210444B1 (ja) 2012-07-20 2013-06-12 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017039176A (ja) 2015-08-18 2017-02-23 株式会社荏原製作所 基板吸着方法、トップリングおよび基板研磨装置
US20200043773A1 (en) 2018-08-06 2020-02-06 Ebara Corporation Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper suface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
JP2021013987A (ja) 2019-07-12 2021-02-12 株式会社荏原製作所 基板処理システムおよび記録媒体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220934B1 (en) * 1998-07-23 2001-04-24 Micron Technology, Inc. Method for controlling pH during planarization and cleaning of microelectronic substrates
US6769973B2 (en) * 2001-05-31 2004-08-03 Samsung Electronics Co., Ltd. Polishing head of chemical mechanical polishing apparatus and polishing method using the same
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009178800A (ja) 2008-01-30 2009-08-13 Ebara Corp 研磨方法及び研磨装置
JP5210444B1 (ja) 2012-07-20 2013-06-12 ミクロ技研株式会社 研磨ヘッド及び研磨処理装置
JP2017039176A (ja) 2015-08-18 2017-02-23 株式会社荏原製作所 基板吸着方法、トップリングおよび基板研磨装置
US20200043773A1 (en) 2018-08-06 2020-02-06 Ebara Corporation Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper suface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus
JP2021013987A (ja) 2019-07-12 2021-02-12 株式会社荏原製作所 基板処理システムおよび記録媒体

Also Published As

Publication number Publication date
US20230191553A1 (en) 2023-06-22
TW202333892A (zh) 2023-09-01
CN116352595A (zh) 2023-06-30
KR20230094154A (ko) 2023-06-27
JP2023091146A (ja) 2023-06-30

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