JP7681628B2 - 基板マッピング装置およびそのための方法 - Google Patents

基板マッピング装置およびそのための方法 Download PDF

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JP7681628B2
JP7681628B2 JP2022581488A JP2022581488A JP7681628B2 JP 7681628 B2 JP7681628 B2 JP 7681628B2 JP 2022581488 A JP2022581488 A JP 2022581488A JP 2022581488 A JP2022581488 A JP 2022581488A JP 7681628 B2 JP7681628 B2 JP 7681628B2
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Prior art keywords
wafer
substrate
camera
substrate carrier
wafers
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JP2023532334A5 (cg-RX-API-DMAC7.html
JP2023532334A (ja
Inventor
スヌガトフ、ラディック
アール ワン、ロイ
シェ、カール
グラシアーノ、フスト
ワイズ、オースティン
ハンセン、カスパー
パストール、エリック
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ブルックス オートメーション ユーエス、エルエルシー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022581488A 2020-06-30 2021-06-30 基板マッピング装置およびそのための方法 Active JP7681628B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063046555P 2020-06-30 2020-06-30
US63/046,555 2020-06-30
US17/362,599 2021-06-29
US17/362,599 US12002696B2 (en) 2020-06-30 2021-06-29 Substrate mapping apparatus and method therefor
PCT/US2021/039966 WO2022006319A1 (en) 2020-06-30 2021-06-30 Substrate mapping apparatus and method therefor

Publications (3)

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JP2023532334A JP2023532334A (ja) 2023-07-27
JP2023532334A5 JP2023532334A5 (cg-RX-API-DMAC7.html) 2024-07-08
JP7681628B2 true JP7681628B2 (ja) 2025-05-22

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JP2022581488A Active JP7681628B2 (ja) 2020-06-30 2021-06-30 基板マッピング装置およびそのための方法

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US (2) US12002696B2 (cg-RX-API-DMAC7.html)
EP (2) EP4589645A3 (cg-RX-API-DMAC7.html)
JP (1) JP7681628B2 (cg-RX-API-DMAC7.html)
KR (1) KR20230029972A (cg-RX-API-DMAC7.html)
CN (3) CN116056810B (cg-RX-API-DMAC7.html)
TW (1) TW202205494A (cg-RX-API-DMAC7.html)
WO (1) WO2022006319A1 (cg-RX-API-DMAC7.html)

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US11469123B2 (en) * 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7849187B2 (ja) * 2022-02-24 2026-04-21 株式会社ディスコ 搬送装置
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置
KR102926940B1 (ko) * 2022-05-27 2026-02-12 (주)테크윙 핸들러
CN119856273A (zh) * 2022-07-08 2025-04-18 朗姆研究公司 用于半导体制造装备的移动传感器设备
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection
US20240170312A1 (en) * 2022-11-21 2024-05-23 Applied Materials, Inc. Determining a substrate location threshold based on optical properties
JP2024080228A (ja) * 2022-12-02 2024-06-13 株式会社安川電機 基板搬送装置および基板搬送方法
CN118723287A (zh) * 2023-03-28 2024-10-01 Jcet星科金朋韩国有限公司 具有改进的翘曲控制的承载半导体封装条的载体组件
CN117438356B (zh) * 2023-12-21 2024-04-19 浙江果纳半导体技术有限公司 一种自适应晶圆传输方法、可存储介质和晶圆传输设备
US20260026294A1 (en) * 2024-07-19 2026-01-22 Kla Corporation Systems and methods for wafer overview image scan and pre-alignment of film frame carrier

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JP2002527897A (ja) 1998-10-15 2002-08-27 アシスト テクノロジーズ インコーポレイテッド ウェーハ・マッピング・システム
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EP4171843C0 (en) 2025-06-25
US12002696B2 (en) 2024-06-04
EP4589645A3 (en) 2026-01-21
US20240290642A1 (en) 2024-08-29
CN120656970A (zh) 2025-09-16
US20210407831A1 (en) 2021-12-30
JP2023532334A (ja) 2023-07-27
TW202205494A (zh) 2022-02-01
KR20230029972A (ko) 2023-03-03
EP4171843A1 (en) 2023-05-03
EP4589645A2 (en) 2025-07-23
EP4171843A4 (en) 2024-01-17
CN116056810A (zh) 2023-05-02
CN116056810B (zh) 2025-09-05
EP4171843B1 (en) 2025-06-25
WO2022006319A1 (en) 2022-01-06
US12564003B2 (en) 2026-02-24
CN121035002A (zh) 2025-11-28

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