TW202205494A - 基板映射設備及其方法 - Google Patents

基板映射設備及其方法 Download PDF

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Publication number
TW202205494A
TW202205494A TW110124052A TW110124052A TW202205494A TW 202205494 A TW202205494 A TW 202205494A TW 110124052 A TW110124052 A TW 110124052A TW 110124052 A TW110124052 A TW 110124052A TW 202205494 A TW202205494 A TW 202205494A
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TW
Taiwan
Prior art keywords
wafer
substrate
camera
substrate carrier
common
Prior art date
Application number
TW110124052A
Other languages
English (en)
Chinese (zh)
Inventor
拉迪克 蘇加托夫
洛伊 王
卡爾 謝
胡斯托 格西諾
奧斯汀 懷斯
卡斯帕 韓森
艾瑞克 帕斯特
Original Assignee
美商布魯克斯自動機械公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商布魯克斯自動機械公司 filed Critical 美商布魯克斯自動機械公司
Publication of TW202205494A publication Critical patent/TW202205494A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW110124052A 2020-06-30 2021-06-30 基板映射設備及其方法 TW202205494A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063046555P 2020-06-30 2020-06-30
US63/046,555 2020-06-30

Publications (1)

Publication Number Publication Date
TW202205494A true TW202205494A (zh) 2022-02-01

Family

ID=79031420

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110124052A TW202205494A (zh) 2020-06-30 2021-06-30 基板映射設備及其方法

Country Status (7)

Country Link
US (2) US12002696B2 (cg-RX-API-DMAC7.html)
EP (2) EP4589645A3 (cg-RX-API-DMAC7.html)
JP (1) JP7681628B2 (cg-RX-API-DMAC7.html)
KR (1) KR20230029972A (cg-RX-API-DMAC7.html)
CN (3) CN116056810B (cg-RX-API-DMAC7.html)
TW (1) TW202205494A (cg-RX-API-DMAC7.html)
WO (1) WO2022006319A1 (cg-RX-API-DMAC7.html)

Cited By (4)

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CN117125439A (zh) * 2022-05-27 2023-11-28 泰克元有限公司 处理器
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置
US20240170312A1 (en) * 2022-11-21 2024-05-23 Applied Materials, Inc. Determining a substrate location threshold based on optical properties
CN117125439B (zh) * 2022-05-27 2026-05-01 泰克元有限公司 处理器

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JP7849187B2 (ja) * 2022-02-24 2026-04-21 株式会社ディスコ 搬送装置
CN119856273A (zh) * 2022-07-08 2025-04-18 朗姆研究公司 用于半导体制造装备的移动传感器设备
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection
JP2024080228A (ja) * 2022-12-02 2024-06-13 株式会社安川電機 基板搬送装置および基板搬送方法
CN118723287A (zh) * 2023-03-28 2024-10-01 Jcet星科金朋韩国有限公司 具有改进的翘曲控制的承载半导体封装条的载体组件
CN117438356B (zh) * 2023-12-21 2024-04-19 浙江果纳半导体技术有限公司 一种自适应晶圆传输方法、可存储介质和晶圆传输设备
US20260026294A1 (en) * 2024-07-19 2026-01-22 Kla Corporation Systems and methods for wafer overview image scan and pre-alignment of film frame carrier

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JP3380147B2 (ja) * 1997-11-13 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
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DE19814046C1 (de) * 1998-03-30 1999-11-18 Jenoptik Jena Gmbh Anordnung zur Detektion von scheibenförmigen Objekten in einer Kassette
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JP7073697B2 (ja) 2017-12-07 2022-05-24 Tdk株式会社 ロードポート
JP6804069B2 (ja) * 2018-08-03 2020-12-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、基板処理装置及び半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置
CN117125439A (zh) * 2022-05-27 2023-11-28 泰克元有限公司 处理器
TWI851239B (zh) * 2022-05-27 2024-08-01 南韓商泰克元有限公司 處理器
CN117125439B (zh) * 2022-05-27 2026-05-01 泰克元有限公司 处理器
US20240170312A1 (en) * 2022-11-21 2024-05-23 Applied Materials, Inc. Determining a substrate location threshold based on optical properties

Also Published As

Publication number Publication date
EP4171843C0 (en) 2025-06-25
US12002696B2 (en) 2024-06-04
EP4589645A3 (en) 2026-01-21
US20240290642A1 (en) 2024-08-29
CN120656970A (zh) 2025-09-16
US20210407831A1 (en) 2021-12-30
JP7681628B2 (ja) 2025-05-22
JP2023532334A (ja) 2023-07-27
KR20230029972A (ko) 2023-03-03
EP4171843A1 (en) 2023-05-03
EP4589645A2 (en) 2025-07-23
EP4171843A4 (en) 2024-01-17
CN116056810A (zh) 2023-05-02
CN116056810B (zh) 2025-09-05
EP4171843B1 (en) 2025-06-25
WO2022006319A1 (en) 2022-01-06
US12564003B2 (en) 2026-02-24
CN121035002A (zh) 2025-11-28

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