JP2023532334A5 - - Google Patents

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Publication number
JP2023532334A5
JP2023532334A5 JP2022581488A JP2022581488A JP2023532334A5 JP 2023532334 A5 JP2023532334 A5 JP 2023532334A5 JP 2022581488 A JP2022581488 A JP 2022581488A JP 2022581488 A JP2022581488 A JP 2022581488A JP 2023532334 A5 JP2023532334 A5 JP 2023532334A5
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JP
Japan
Prior art keywords
wafer
wafers
substrate carrier
camera
movable door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2022581488A
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English (en)
Japanese (ja)
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JP7681628B2 (ja
JP2023532334A (ja
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Priority claimed from US17/362,599 external-priority patent/US12002696B2/en
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Publication of JP2023532334A publication Critical patent/JP2023532334A/ja
Publication of JP2023532334A5 publication Critical patent/JP2023532334A5/ja
Application granted granted Critical
Publication of JP7681628B2 publication Critical patent/JP7681628B2/ja
Active legal-status Critical Current
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JP2022581488A 2020-06-30 2021-06-30 基板マッピング装置およびそのための方法 Active JP7681628B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063046555P 2020-06-30 2020-06-30
US63/046,555 2020-06-30
US17/362,599 2021-06-29
US17/362,599 US12002696B2 (en) 2020-06-30 2021-06-29 Substrate mapping apparatus and method therefor
PCT/US2021/039966 WO2022006319A1 (en) 2020-06-30 2021-06-30 Substrate mapping apparatus and method therefor

Publications (3)

Publication Number Publication Date
JP2023532334A JP2023532334A (ja) 2023-07-27
JP2023532334A5 true JP2023532334A5 (cg-RX-API-DMAC7.html) 2024-07-08
JP7681628B2 JP7681628B2 (ja) 2025-05-22

Family

ID=79031420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022581488A Active JP7681628B2 (ja) 2020-06-30 2021-06-30 基板マッピング装置およびそのための方法

Country Status (7)

Country Link
US (2) US12002696B2 (cg-RX-API-DMAC7.html)
EP (2) EP4589645A3 (cg-RX-API-DMAC7.html)
JP (1) JP7681628B2 (cg-RX-API-DMAC7.html)
KR (1) KR20230029972A (cg-RX-API-DMAC7.html)
CN (3) CN116056810B (cg-RX-API-DMAC7.html)
TW (1) TW202205494A (cg-RX-API-DMAC7.html)
WO (1) WO2022006319A1 (cg-RX-API-DMAC7.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11469123B2 (en) * 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7849187B2 (ja) * 2022-02-24 2026-04-21 株式会社ディスコ 搬送装置
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置
KR102926940B1 (ko) * 2022-05-27 2026-02-12 (주)테크윙 핸들러
CN119856273A (zh) * 2022-07-08 2025-04-18 朗姆研究公司 用于半导体制造装备的移动传感器设备
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection
US20240170312A1 (en) * 2022-11-21 2024-05-23 Applied Materials, Inc. Determining a substrate location threshold based on optical properties
JP2024080228A (ja) * 2022-12-02 2024-06-13 株式会社安川電機 基板搬送装置および基板搬送方法
CN118723287A (zh) * 2023-03-28 2024-10-01 Jcet星科金朋韩国有限公司 具有改进的翘曲控制的承载半导体封装条的载体组件
CN117438356B (zh) * 2023-12-21 2024-04-19 浙江果纳半导体技术有限公司 一种自适应晶圆传输方法、可存储介质和晶圆传输设备
US20260026294A1 (en) * 2024-07-19 2026-01-22 Kla Corporation Systems and methods for wafer overview image scan and pre-alignment of film frame carrier

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253365B2 (ja) * 1997-10-17 2009-04-08 オリンパス株式会社 ウェハ搬送装置
JP3380147B2 (ja) * 1997-11-13 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
DE19814046C1 (de) * 1998-03-30 1999-11-18 Jenoptik Jena Gmbh Anordnung zur Detektion von scheibenförmigen Objekten in einer Kassette
JPH11354609A (ja) * 1998-06-11 1999-12-24 Mecs Corp 薄型基板収容カセットの蓋開閉装置
US6188323B1 (en) 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6636626B1 (en) 1999-11-30 2003-10-21 Wafermasters, Inc. Wafer mapping apparatus and method
JP3699348B2 (ja) * 2000-11-30 2005-09-28 平田機工株式会社 駆動部隔離ｆｏｕｐオープナ
JP2002224982A (ja) * 2000-12-01 2002-08-13 Yaskawa Electric Corp 薄型基板搬送用ロボットおよび薄型基板検出方法
US6452503B1 (en) 2001-03-15 2002-09-17 Pri Automation, Inc. Semiconductor wafer imaging system
US6825486B1 (en) 2001-07-13 2004-11-30 Cyberoptics Corporation System for mapping wafers using predictive dynamic lighting
US6900451B2 (en) * 2001-11-08 2005-05-31 Multimextrixs, Llc Mapping sensor system for detecting positions of flat objects
JP4196335B2 (ja) * 2003-06-10 2008-12-17 株式会社安川電機 薄型基板検出方法
US7015492B2 (en) 2003-08-15 2006-03-21 Asm International N.V. Method and apparatus for mapping of wafers located inside a closed wafer cassette
US9691651B2 (en) * 2005-01-28 2017-06-27 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
US20050086024A1 (en) * 2003-09-19 2005-04-21 Cyberoptics Semiconductor Inc. Semiconductor wafer location sensing via non contact methods
JP2005167208A (ja) 2003-10-24 2005-06-23 Ade Corp ノッチ化／フラット化２００ｍｍウエーハエッジグリップエンドエフェクタ
US7891936B2 (en) * 2005-03-30 2011-02-22 Brooks Automation, Inc. High speed substrate aligner apparatus
TWI475627B (zh) 2007-05-17 2015-03-01 布魯克斯自動機械公司 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
JP5185756B2 (ja) * 2008-10-01 2013-04-17 川崎重工業株式会社 基板検出装置および方法
CN102576687B (zh) 2009-11-17 2015-11-25 昕芙旎雅有限公司 晶圆检测装置
KR102139617B1 (ko) 2012-12-27 2020-07-31 세메스 주식회사 기판 이송 장치 및 방법
JP6415220B2 (ja) * 2014-09-29 2018-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US10755960B2 (en) * 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
JP6571475B2 (ja) * 2015-09-30 2019-09-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
MY190638A (en) * 2015-10-01 2022-04-29 Intevac Inc Wafer plate and mask arrangement for substrate fabrication
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US10607879B2 (en) 2016-09-08 2020-03-31 Brooks Automation, Inc. Substrate processing apparatus
US10784134B2 (en) 2017-05-03 2020-09-22 Applied Materials, Inc. Image based substrate mapper
US10714364B2 (en) 2017-08-31 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting wafer carriers
KR101843476B1 (ko) 2017-10-11 2018-03-29 주식회사 싸이맥스 로드포트모듈 비전 맵핑장치 및 로드포트모듈 비전 맵핑방법
JP7073697B2 (ja) 2017-12-07 2022-05-24 Tdk株式会社 ロードポート
JP6804069B2 (ja) * 2018-08-03 2020-12-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、基板処理装置及び半導体装置の製造方法

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