CN116056810B - 衬底映射装置及其方法 - Google Patents

衬底映射装置及其方法

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Publication number
CN116056810B
CN116056810B CN202180053513.7A CN202180053513A CN116056810B CN 116056810 B CN116056810 B CN 116056810B CN 202180053513 A CN202180053513 A CN 202180053513A CN 116056810 B CN116056810 B CN 116056810B
Authority
CN
China
Prior art keywords
substrate
camera
common support
carrier
common
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180053513.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN116056810A (zh
Inventor
R·苏努加托夫
R·R·王
K·谢
J·格拉西亚诺
A·怀斯
C·汉森
E·帕斯托
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Original Assignee
Borucos Automation Usa Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Borucos Automation Usa Co ltd filed Critical Borucos Automation Usa Co ltd
Priority to CN202510797176.2A priority Critical patent/CN120656970A/zh
Priority to CN202511151198.8A priority patent/CN121035002A/zh
Publication of CN116056810A publication Critical patent/CN116056810A/zh
Application granted granted Critical
Publication of CN116056810B publication Critical patent/CN116056810B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202180053513.7A 2020-06-30 2021-06-30 衬底映射装置及其方法 Active CN116056810B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202510797176.2A CN120656970A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法
CN202511151198.8A CN121035002A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063046555P 2020-06-30 2020-06-30
US63/046555 2020-06-30
US17/362599 2021-06-29
US17/362,599 US12002696B2 (en) 2020-06-30 2021-06-29 Substrate mapping apparatus and method therefor
PCT/US2021/039966 WO2022006319A1 (en) 2020-06-30 2021-06-30 Substrate mapping apparatus and method therefor

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN202511151198.8A Division CN121035002A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法
CN202510797176.2A Division CN120656970A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法

Publications (2)

Publication Number Publication Date
CN116056810A CN116056810A (zh) 2023-05-02
CN116056810B true CN116056810B (zh) 2025-09-05

Family

ID=79031420

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202180053513.7A Active CN116056810B (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法
CN202510797176.2A Pending CN120656970A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法
CN202511151198.8A Pending CN121035002A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN202510797176.2A Pending CN120656970A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法
CN202511151198.8A Pending CN121035002A (zh) 2020-06-30 2021-06-30 衬底映射装置及其方法

Country Status (7)

Country Link
US (2) US12002696B2 (cg-RX-API-DMAC7.html)
EP (2) EP4589645A3 (cg-RX-API-DMAC7.html)
JP (1) JP7681628B2 (cg-RX-API-DMAC7.html)
KR (1) KR20230029972A (cg-RX-API-DMAC7.html)
CN (3) CN116056810B (cg-RX-API-DMAC7.html)
TW (1) TW202205494A (cg-RX-API-DMAC7.html)
WO (1) WO2022006319A1 (cg-RX-API-DMAC7.html)

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JP7849187B2 (ja) * 2022-02-24 2026-04-21 株式会社ディスコ 搬送装置
TWI831162B (zh) * 2022-03-24 2024-02-01 上銀科技股份有限公司 裝載埠及其映射裝置
KR102926940B1 (ko) * 2022-05-27 2026-02-12 (주)테크윙 핸들러
CN119856273A (zh) * 2022-07-08 2025-04-18 朗姆研究公司 用于半导体制造装备的移动传感器设备
US12136225B2 (en) * 2022-09-09 2024-11-05 Applied Materials, Inc. Clog detection via image analytics
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection
US20240170312A1 (en) * 2022-11-21 2024-05-23 Applied Materials, Inc. Determining a substrate location threshold based on optical properties
JP2024080228A (ja) * 2022-12-02 2024-06-13 株式会社安川電機 基板搬送装置および基板搬送方法
CN118723287A (zh) * 2023-03-28 2024-10-01 Jcet星科金朋韩国有限公司 具有改进的翘曲控制的承载半导体封装条的载体组件
CN117438356B (zh) * 2023-12-21 2024-04-19 浙江果纳半导体技术有限公司 一种自适应晶圆传输方法、可存储介质和晶圆传输设备
US20260026294A1 (en) * 2024-07-19 2026-01-22 Kla Corporation Systems and methods for wafer overview image scan and pre-alignment of film frame carrier

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CN108290694A (zh) * 2015-10-01 2018-07-17 因特瓦克公司 用于衬底制造的晶圆板和掩模装置

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Also Published As

Publication number Publication date
EP4171843C0 (en) 2025-06-25
US12002696B2 (en) 2024-06-04
EP4589645A3 (en) 2026-01-21
US20240290642A1 (en) 2024-08-29
CN120656970A (zh) 2025-09-16
US20210407831A1 (en) 2021-12-30
JP7681628B2 (ja) 2025-05-22
JP2023532334A (ja) 2023-07-27
TW202205494A (zh) 2022-02-01
KR20230029972A (ko) 2023-03-03
EP4171843A1 (en) 2023-05-03
EP4589645A2 (en) 2025-07-23
EP4171843A4 (en) 2024-01-17
CN116056810A (zh) 2023-05-02
EP4171843B1 (en) 2025-06-25
WO2022006319A1 (en) 2022-01-06
US12564003B2 (en) 2026-02-24
CN121035002A (zh) 2025-11-28

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