JP7642782B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP7642782B2
JP7642782B2 JP2023500947A JP2023500947A JP7642782B2 JP 7642782 B2 JP7642782 B2 JP 7642782B2 JP 2023500947 A JP2023500947 A JP 2023500947A JP 2023500947 A JP2023500947 A JP 2023500947A JP 7642782 B2 JP7642782 B2 JP 7642782B2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
emitting device
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023500947A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022176987A1 (https=
JPWO2022176987A5 (https=
Inventor
祥哲 板倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022176987A1 publication Critical patent/JPWO2022176987A1/ja
Publication of JPWO2022176987A5 publication Critical patent/JPWO2022176987A5/ja
Application granted granted Critical
Publication of JP7642782B2 publication Critical patent/JP7642782B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
JP2023500947A 2021-02-19 2022-02-18 発光装置 Active JP7642782B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021025665 2021-02-19
JP2021025665 2021-02-19
PCT/JP2022/006736 WO2022176987A1 (ja) 2021-02-19 2022-02-18 発光装置

Publications (3)

Publication Number Publication Date
JPWO2022176987A1 JPWO2022176987A1 (https=) 2022-08-25
JPWO2022176987A5 JPWO2022176987A5 (https=) 2023-11-09
JP7642782B2 true JP7642782B2 (ja) 2025-03-10

Family

ID=82930642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500947A Active JP7642782B2 (ja) 2021-02-19 2022-02-18 発光装置

Country Status (5)

Country Link
US (1) US20240094486A1 (https=)
EP (1) EP4297205A1 (https=)
JP (1) JP7642782B2 (https=)
CN (1) CN116829999A (https=)
WO (1) WO2022176987A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030002826A1 (en) 2001-06-27 2003-01-02 International Business Machines Corporation Light emitter control system
WO2003084015A1 (en) 2002-03-28 2003-10-09 Fujitsu Limited Laser array device and laser array control method
JP2009186578A (ja) 2008-02-04 2009-08-20 Fuji Xerox Co Ltd 光導波部材、光モジュール、及び光伝送装置
JP2010237483A (ja) 2009-03-31 2010-10-21 Anritsu Corp 光変調器モジュール
WO2014091551A1 (ja) 2012-12-11 2014-06-19 パイオニア株式会社 光源ユニット、光源ユニットの制御方法、プログラム及び記録媒体
US20190296522A1 (en) 2018-03-20 2019-09-26 Vixar, Inc. Eye safe optical modules

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175614A (ja) * 1991-12-26 1993-07-13 Canon Inc 光半導体装置
JP3601931B2 (ja) * 1997-04-22 2004-12-15 シャープ株式会社 光結合半導体装置
JP2004064013A (ja) * 2002-07-31 2004-02-26 Kinseki Ltd 電子部品用パッケ−ジのキャップ封止方法
JP2004207911A (ja) 2002-12-24 2004-07-22 Seiko Epson Corp 光学ユニット、光源制御装置、光強度制御装置、光通信装置
JP6205001B2 (ja) * 2016-01-14 2017-09-27 株式会社フジクラ 光電変換モジュール、及び、アクティブ光ケーブル
DE102020110658A1 (de) * 2020-04-20 2021-10-21 Schott Ag Multilaser-Anordnung, insbesondere RGB-Lasermodul sowie diese umfassende Vorrichtungen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030002826A1 (en) 2001-06-27 2003-01-02 International Business Machines Corporation Light emitter control system
WO2003084015A1 (en) 2002-03-28 2003-10-09 Fujitsu Limited Laser array device and laser array control method
JP2009186578A (ja) 2008-02-04 2009-08-20 Fuji Xerox Co Ltd 光導波部材、光モジュール、及び光伝送装置
JP2010237483A (ja) 2009-03-31 2010-10-21 Anritsu Corp 光変調器モジュール
WO2014091551A1 (ja) 2012-12-11 2014-06-19 パイオニア株式会社 光源ユニット、光源ユニットの制御方法、プログラム及び記録媒体
US20190296522A1 (en) 2018-03-20 2019-09-26 Vixar, Inc. Eye safe optical modules

Also Published As

Publication number Publication date
EP4297205A1 (en) 2023-12-27
JPWO2022176987A1 (https=) 2022-08-25
CN116829999A (zh) 2023-09-29
US20240094486A1 (en) 2024-03-21
WO2022176987A1 (ja) 2022-08-25

Similar Documents

Publication Publication Date Title
TWI854915B (zh) 光源裝置
CN101784872B (zh) 具有可调色彩的照明装置
JP7339591B2 (ja) 発光モジュールの製造方法、発光モジュール及びプロジェクタ
JP7284440B2 (ja) 発光モジュールの製造方法、発光モジュール及びプロジェクタ
US10862266B2 (en) Light source device
CN115867841A (zh) 光波导封装件、发光装置及投影系统
JP7157346B2 (ja) 発光装置
WO2018180807A1 (ja) 光モジュール
CN101828136B (zh) 用于背光应用的侧面发光led光源
JP7642782B2 (ja) 発光装置
JP2002134793A (ja) 光素子用光学デバイス
WO2022176992A1 (ja) 発光装置
JP2013197450A (ja) 発光装置およびその製造方法
TW202320364A (zh) 發光裝置
WO2023153419A1 (ja) 光導波路基板、光導波路パッケージおよび光源モジュール
WO2022064938A1 (ja) 発光装置及びその製造方法
TW202346930A (zh) 光波導基板、光波導封裝及光源模組
JP2025165179A (ja) 発光装置
TW202522056A (zh) 光波導基板、電子元件收納用封裝、電子模組、及電子裝置
JP2026004719A (ja) 光導波路、電子素子収納用パッケージ、電子モジュール及び電子デバイス
JP2009158639A (ja) サイドエミッタ型発光装置
WO2024128324A1 (ja) 発光装置
JP2023123752A (ja) 光導波路モジュール
WO2025070157A1 (ja) 光導波路、電子素子収納用パッケージ、電子モジュール及び電子デバイス
CN121241285A (zh) 具有集成微型led的光子集成电路

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230818

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230818

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240507

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240703

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241029

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250128

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250226

R150 Certificate of patent or registration of utility model

Ref document number: 7642782

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150