JPWO2022176987A1 - - Google Patents
Info
- Publication number
- JPWO2022176987A1 JPWO2022176987A1 JP2023500947A JP2023500947A JPWO2022176987A1 JP WO2022176987 A1 JPWO2022176987 A1 JP WO2022176987A1 JP 2023500947 A JP2023500947 A JP 2023500947A JP 2023500947 A JP2023500947 A JP 2023500947A JP WO2022176987 A1 JPWO2022176987 A1 JP WO2022176987A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/125—Bends, branchings or intersections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
- H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021025665 | 2021-02-19 | ||
| JP2021025665 | 2021-02-19 | ||
| PCT/JP2022/006736 WO2022176987A1 (ja) | 2021-02-19 | 2022-02-18 | 発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022176987A1 true JPWO2022176987A1 (https=) | 2022-08-25 |
| JPWO2022176987A5 JPWO2022176987A5 (https=) | 2023-11-09 |
| JP7642782B2 JP7642782B2 (ja) | 2025-03-10 |
Family
ID=82930642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023500947A Active JP7642782B2 (ja) | 2021-02-19 | 2022-02-18 | 発光装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240094486A1 (https=) |
| EP (1) | EP4297205A1 (https=) |
| JP (1) | JP7642782B2 (https=) |
| CN (1) | CN116829999A (https=) |
| WO (1) | WO2022176987A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175614A (ja) * | 1991-12-26 | 1993-07-13 | Canon Inc | 光半導体装置 |
| JPH10300990A (ja) * | 1997-04-22 | 1998-11-13 | Sharp Corp | 光結合半導体装置 |
| US20030002826A1 (en) * | 2001-06-27 | 2003-01-02 | International Business Machines Corporation | Light emitter control system |
| WO2003084015A1 (en) * | 2002-03-28 | 2003-10-09 | Fujitsu Limited | Laser array device and laser array control method |
| JP2009186578A (ja) * | 2008-02-04 | 2009-08-20 | Fuji Xerox Co Ltd | 光導波部材、光モジュール、及び光伝送装置 |
| JP2010237483A (ja) * | 2009-03-31 | 2010-10-21 | Anritsu Corp | 光変調器モジュール |
| WO2014091551A1 (ja) * | 2012-12-11 | 2014-06-19 | パイオニア株式会社 | 光源ユニット、光源ユニットの制御方法、プログラム及び記録媒体 |
| US20190296522A1 (en) * | 2018-03-20 | 2019-09-26 | Vixar, Inc. | Eye safe optical modules |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004064013A (ja) * | 2002-07-31 | 2004-02-26 | Kinseki Ltd | 電子部品用パッケ−ジのキャップ封止方法 |
| JP2004207911A (ja) | 2002-12-24 | 2004-07-22 | Seiko Epson Corp | 光学ユニット、光源制御装置、光強度制御装置、光通信装置 |
| JP6205001B2 (ja) * | 2016-01-14 | 2017-09-27 | 株式会社フジクラ | 光電変換モジュール、及び、アクティブ光ケーブル |
| DE102020110658A1 (de) * | 2020-04-20 | 2021-10-21 | Schott Ag | Multilaser-Anordnung, insbesondere RGB-Lasermodul sowie diese umfassende Vorrichtungen |
-
2022
- 2022-02-18 EP EP22756304.6A patent/EP4297205A1/en not_active Withdrawn
- 2022-02-18 WO PCT/JP2022/006736 patent/WO2022176987A1/ja not_active Ceased
- 2022-02-18 JP JP2023500947A patent/JP7642782B2/ja active Active
- 2022-02-18 US US18/277,245 patent/US20240094486A1/en active Pending
- 2022-02-18 CN CN202280014695.1A patent/CN116829999A/zh active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175614A (ja) * | 1991-12-26 | 1993-07-13 | Canon Inc | 光半導体装置 |
| JPH10300990A (ja) * | 1997-04-22 | 1998-11-13 | Sharp Corp | 光結合半導体装置 |
| US20030002826A1 (en) * | 2001-06-27 | 2003-01-02 | International Business Machines Corporation | Light emitter control system |
| WO2003084015A1 (en) * | 2002-03-28 | 2003-10-09 | Fujitsu Limited | Laser array device and laser array control method |
| JP2009186578A (ja) * | 2008-02-04 | 2009-08-20 | Fuji Xerox Co Ltd | 光導波部材、光モジュール、及び光伝送装置 |
| JP2010237483A (ja) * | 2009-03-31 | 2010-10-21 | Anritsu Corp | 光変調器モジュール |
| WO2014091551A1 (ja) * | 2012-12-11 | 2014-06-19 | パイオニア株式会社 | 光源ユニット、光源ユニットの制御方法、プログラム及び記録媒体 |
| US20190296522A1 (en) * | 2018-03-20 | 2019-09-26 | Vixar, Inc. | Eye safe optical modules |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4297205A1 (en) | 2023-12-27 |
| CN116829999A (zh) | 2023-09-29 |
| JP7642782B2 (ja) | 2025-03-10 |
| US20240094486A1 (en) | 2024-03-21 |
| WO2022176987A1 (ja) | 2022-08-25 |
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