JP7635359B2 - 熱デバイス - Google Patents

熱デバイス Download PDF

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Publication number
JP7635359B2
JP7635359B2 JP2023502338A JP2023502338A JP7635359B2 JP 7635359 B2 JP7635359 B2 JP 7635359B2 JP 2023502338 A JP2023502338 A JP 2023502338A JP 2023502338 A JP2023502338 A JP 2023502338A JP 7635359 B2 JP7635359 B2 JP 7635359B2
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JP
Japan
Prior art keywords
region
thermal device
intermediate member
phase change
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023502338A
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English (en)
Japanese (ja)
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JPWO2022181453A1 (https=
JPWO2022181453A5 (https=
Inventor
裕一 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022181453A1 publication Critical patent/JPWO2022181453A1/ja
Publication of JPWO2022181453A5 publication Critical patent/JPWO2022181453A5/ja
Application granted granted Critical
Publication of JP7635359B2 publication Critical patent/JP7635359B2/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/10—Arrangements for sealing the margins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023502338A 2021-02-26 2022-02-17 熱デバイス Active JP7635359B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021030210 2021-02-26
JP2021030210 2021-02-26
PCT/JP2022/006476 WO2022181453A1 (ja) 2021-02-26 2022-02-17 熱デバイス

Publications (3)

Publication Number Publication Date
JPWO2022181453A1 JPWO2022181453A1 (https=) 2022-09-01
JPWO2022181453A5 JPWO2022181453A5 (https=) 2023-11-16
JP7635359B2 true JP7635359B2 (ja) 2025-02-25

Family

ID=83048925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502338A Active JP7635359B2 (ja) 2021-02-26 2022-02-17 熱デバイス

Country Status (6)

Country Link
US (1) US12595974B2 (https=)
EP (1) EP4300572A4 (https=)
JP (1) JP7635359B2 (https=)
KR (1) KR20230136170A (https=)
CN (1) CN116940796A (https=)
WO (1) WO2022181453A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021263114A2 (en) * 2020-06-25 2021-12-30 Virginia Polytechnic Institute And State University Planar bridging-droplet thermal diode
CN114608368A (zh) * 2020-12-08 2022-06-10 绍兴三花新能源汽车部件有限公司 换热器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4035155B1 (ja) 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
JP2010243077A (ja) 2009-04-07 2010-10-28 Sony Corp 熱輸送デバイスの製造方法、熱輸送デバイス、電子機器及びカシメピン
WO2011149216A2 (ko) 2010-05-24 2011-12-01 한국과학기술원 플랫형 열 분산기 및 그 제조 방법
WO2018139568A1 (ja) 2017-01-27 2018-08-02 古河電気工業株式会社 ベーパーチャンバ
US20190247964A1 (en) 2018-02-13 2019-08-15 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber water-filling section sealing structure

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2782010A (en) * 1948-12-18 1957-02-19 Modine Mfg Co Heat exchanger
GB1467182A (en) 1973-12-26 1977-03-16 Burroughs Corp Gas discharge display panel
JPS5732613Y2 (https=) 1976-12-31 1982-07-17
JPS5918631B2 (ja) * 1977-02-28 1984-04-28 日本特殊陶業株式会社 セラミックヒ−トパイプの製造方法
JPS5810370Y2 (ja) 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板
JP2539663B2 (ja) 1988-05-11 1996-10-02 株式会社フジクラ 高温用セラミックヒ―トパイプ
US20020192531A1 (en) * 1998-12-30 2002-12-19 Joerg Zimmerman Liquid reactant flow field plates for liquid feed fuel cells
JP2002081874A (ja) * 2000-09-11 2002-03-22 Canon Inc プレート型ヒートパイプ及びその製造方法
US7414843B2 (en) * 2004-03-10 2008-08-19 Intel Corporation Method and apparatus for a layered thermal management arrangement
WO2007029359A1 (en) 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US20090178784A1 (en) * 2008-01-15 2009-07-16 Chin-Wen Wang Manufacturing Method of Isothermal Vapor Chamber And Product Thereof
JP4683080B2 (ja) 2008-07-10 2011-05-11 ソニー株式会社 熱輸送デバイス、電子機器、封入装置及び熱輸送デバイスの製造方法
JP2012132582A (ja) 2010-12-20 2012-07-12 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
TWI736745B (zh) * 2017-02-24 2021-08-21 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法
WO2019230911A1 (ja) 2018-05-30 2019-12-05 大日本印刷株式会社 ベーパーチャンバー、及び電子機器
US20240255939A1 (en) 2023-01-27 2024-08-01 Hitachi, Ltd. Reinforcement learning system for maintenance decision making

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4035155B1 (ja) 2006-07-28 2008-01-16 株式会社渕上ミクロ ヒートパイプ及びその製造方法
JP2010243077A (ja) 2009-04-07 2010-10-28 Sony Corp 熱輸送デバイスの製造方法、熱輸送デバイス、電子機器及びカシメピン
WO2011149216A2 (ko) 2010-05-24 2011-12-01 한국과학기술원 플랫형 열 분산기 및 그 제조 방법
WO2018139568A1 (ja) 2017-01-27 2018-08-02 古河電気工業株式会社 ベーパーチャンバ
US20190247964A1 (en) 2018-02-13 2019-08-15 Asia Vital Components Co., Ltd. Manufacturing method of vapor chamber water-filling section sealing structure

Also Published As

Publication number Publication date
EP4300572A4 (en) 2025-01-15
US12595974B2 (en) 2026-04-07
JPWO2022181453A1 (https=) 2022-09-01
WO2022181453A1 (ja) 2022-09-01
EP4300572A1 (en) 2024-01-03
US20240142179A1 (en) 2024-05-02
CN116940796A (zh) 2023-10-24
KR20230136170A (ko) 2023-09-26

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