KR20230136170A - 열 디바이스 - Google Patents

열 디바이스 Download PDF

Info

Publication number
KR20230136170A
KR20230136170A KR1020237028742A KR20237028742A KR20230136170A KR 20230136170 A KR20230136170 A KR 20230136170A KR 1020237028742 A KR1020237028742 A KR 1020237028742A KR 20237028742 A KR20237028742 A KR 20237028742A KR 20230136170 A KR20230136170 A KR 20230136170A
Authority
KR
South Korea
Prior art keywords
phase transformation
thermal device
area
communication path
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237028742A
Other languages
English (en)
Korean (ko)
Inventor
유이치 아베
Original Assignee
교세라 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교세라 가부시키가이샤 filed Critical 교세라 가부시키가이샤
Publication of KR20230136170A publication Critical patent/KR20230136170A/ko
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F28D20/021—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat the latent heat storage material and the heat-exchanging means being enclosed in one container
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/10—Arrangements for sealing the margins
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020237028742A 2021-02-26 2022-02-17 열 디바이스 Pending KR20230136170A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021030210 2021-02-26
JPJP-P-2021-030210 2021-02-26
PCT/JP2022/006476 WO2022181453A1 (ja) 2021-02-26 2022-02-17 熱デバイス

Publications (1)

Publication Number Publication Date
KR20230136170A true KR20230136170A (ko) 2023-09-26

Family

ID=83048925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237028742A Pending KR20230136170A (ko) 2021-02-26 2022-02-17 열 디바이스

Country Status (6)

Country Link
US (1) US12595974B2 (https=)
EP (1) EP4300572A4 (https=)
JP (1) JP7635359B2 (https=)
KR (1) KR20230136170A (https=)
CN (1) CN116940796A (https=)
WO (1) WO2022181453A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021263114A2 (en) * 2020-06-25 2021-12-30 Virginia Polytechnic Institute And State University Planar bridging-droplet thermal diode
CN114608368A (zh) * 2020-12-08 2022-06-10 绍兴三花新能源汽车部件有限公司 换热器

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2782010A (en) * 1948-12-18 1957-02-19 Modine Mfg Co Heat exchanger
GB1467182A (en) 1973-12-26 1977-03-16 Burroughs Corp Gas discharge display panel
JPS5732613Y2 (https=) 1976-12-31 1982-07-17
JPS5918631B2 (ja) * 1977-02-28 1984-04-28 日本特殊陶業株式会社 セラミックヒ−トパイプの製造方法
JPS5810370Y2 (ja) 1977-08-26 1983-02-25 日本特殊陶業株式会社 電子回路装置塔載用セラミック基板
JP2539663B2 (ja) 1988-05-11 1996-10-02 株式会社フジクラ 高温用セラミックヒ―トパイプ
US20020192531A1 (en) * 1998-12-30 2002-12-19 Joerg Zimmerman Liquid reactant flow field plates for liquid feed fuel cells
JP2002081874A (ja) * 2000-09-11 2002-03-22 Canon Inc プレート型ヒートパイプ及びその製造方法
US7414843B2 (en) * 2004-03-10 2008-08-19 Intel Corporation Method and apparatus for a layered thermal management arrangement
WO2007029359A1 (en) 2005-09-01 2007-03-15 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
US20210310745A1 (en) * 2006-07-28 2021-10-07 Fuchigami Micro Co., Ltd. Heat pipe and method for manufacturing same
JP2009024933A (ja) * 2007-07-19 2009-02-05 Sony Corp 熱拡散装置及びその製造方法
US20090178784A1 (en) * 2008-01-15 2009-07-16 Chin-Wen Wang Manufacturing Method of Isothermal Vapor Chamber And Product Thereof
JP4683080B2 (ja) 2008-07-10 2011-05-11 ソニー株式会社 熱輸送デバイス、電子機器、封入装置及び熱輸送デバイスの製造方法
JP2010243077A (ja) * 2009-04-07 2010-10-28 Sony Corp 熱輸送デバイスの製造方法、熱輸送デバイス、電子機器及びカシメピン
KR101205715B1 (ko) * 2010-05-24 2012-11-28 한국과학기술원 플랫형 열 분산기 및 그 제조 방법
JP2012132582A (ja) 2010-12-20 2012-07-12 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
CN211668321U (zh) * 2017-01-27 2020-10-13 古河电气工业株式会社 均热板
TWI736745B (zh) * 2017-02-24 2021-08-21 日商大日本印刷股份有限公司 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法
TWI658248B (zh) * 2018-02-13 2019-05-01 奇鋐科技股份有限公司 均溫板注水部封邊結構及其製造方法
WO2019230911A1 (ja) 2018-05-30 2019-12-05 大日本印刷株式会社 ベーパーチャンバー、及び電子機器
US20240255939A1 (en) 2023-01-27 2024-08-01 Hitachi, Ltd. Reinforcement learning system for maintenance decision making

Also Published As

Publication number Publication date
EP4300572A4 (en) 2025-01-15
US12595974B2 (en) 2026-04-07
JPWO2022181453A1 (https=) 2022-09-01
WO2022181453A1 (ja) 2022-09-01
EP4300572A1 (en) 2024-01-03
US20240142179A1 (en) 2024-05-02
CN116940796A (zh) 2023-10-24
JP7635359B2 (ja) 2025-02-25

Similar Documents

Publication Publication Date Title
JP7451678B2 (ja) 放熱部材
KR20230136170A (ko) 열 디바이스
US11525635B2 (en) Vapor chamber water-filling section sealing structure
JP7791301B2 (ja) 熱デバイス
JP7635360B2 (ja) 熱デバイス
CN209199916U (zh) 均温板、散热模块和半导体器件
CN108534574A (zh) 散热装置的中间件及其散热装置
CN111954789A (zh) 均热板
EP4446684B1 (en) Vapor chamber device
CN107801358B (zh) 散热单元的直通结构
US20250354759A1 (en) Thermal device
WO2026048992A1 (ja) 熱デバイス
CN207491438U (zh) 散热单元的直通结构
WO2024204312A1 (ja) 熱デバイス
US11619452B2 (en) Capillary structure of vapor chamber and the vapor chamber
TW202546399A (zh) 立體式熱交換裝置成型結構

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902