JP7631828B2 - 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 - Google Patents

樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 Download PDF

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Publication number
JP7631828B2
JP7631828B2 JP2021009158A JP2021009158A JP7631828B2 JP 7631828 B2 JP7631828 B2 JP 7631828B2 JP 2021009158 A JP2021009158 A JP 2021009158A JP 2021009158 A JP2021009158 A JP 2021009158A JP 7631828 B2 JP7631828 B2 JP 7631828B2
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resin composition
resin
cured product
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Japanese (ja)
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JP2022113053A (ja
Inventor
啓之 阪内
成 佐々木
安晃 脇坂
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Ajinomoto Co Inc
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Ajinomoto Co Inc
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Priority to JP2021009158A priority Critical patent/JP7631828B2/ja
Priority to TW111101470A priority patent/TWI918829B/zh
Priority to KR1020220008136A priority patent/KR20220106701A/ko
Priority to CN202210059849.0A priority patent/CN114773780A/zh
Publication of JP2022113053A publication Critical patent/JP2022113053A/ja
Priority to JP2024209955A priority patent/JP2025029091A/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021009158A 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 Active JP7631828B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021009158A JP7631828B2 (ja) 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置
TW111101470A TWI918829B (zh) 2021-01-22 2022-01-13 樹脂組成物、樹脂糊膏、硬化物、半導體晶片封裝體及半導體裝置
KR1020220008136A KR20220106701A (ko) 2021-01-22 2022-01-19 수지 조성물, 수지 페이스트, 경화물, 반도체 칩 패키지 및 반도체 장치
CN202210059849.0A CN114773780A (zh) 2021-01-22 2022-01-19 树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置
JP2024209955A JP2025029091A (ja) 2021-01-22 2024-12-03 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021009158A JP7631828B2 (ja) 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

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JP2024209955A Division JP2025029091A (ja) 2021-01-22 2024-12-03 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

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JP2022113053A JP2022113053A (ja) 2022-08-03
JP7631828B2 true JP7631828B2 (ja) 2025-02-19

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JP2021009158A Active JP7631828B2 (ja) 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置
JP2024209955A Pending JP2025029091A (ja) 2021-01-22 2024-12-03 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

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JP (2) JP7631828B2 (https=)
KR (1) KR20220106701A (https=)
CN (1) CN114773780A (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024100934A1 (https=) * 2022-11-10 2024-05-16
JP2024074518A (ja) * 2022-11-21 2024-05-31 旭化成株式会社 エポキシ樹脂組成物
CN115923033B (zh) * 2022-12-20 2026-04-14 四川汇源塑料光纤有限公司 一种光纤接收器件的注塑模具及生产方法
JP7772029B2 (ja) 2023-06-06 2025-11-18 味の素株式会社 樹脂組成物
CN117106398B (zh) * 2023-08-22 2024-04-16 湖北三选科技有限公司 一种印刷用液态模封胶、芯片及其制备方法
JP7852657B2 (ja) * 2024-02-01 2026-04-28 味の素株式会社 樹脂組成物
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
KR20260006910A (ko) 2024-07-05 2026-01-13 한화이센셜 주식회사 열경화성 절연수지 및 이를 이용한 절연필름

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234031A (ja) 2000-02-22 2001-08-28 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2015104917A1 (ja) 2014-01-08 2015-07-16 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP2017119846A (ja) 2015-12-25 2017-07-06 味の素株式会社 樹脂組成物
JP2018150440A (ja) 2017-03-10 2018-09-27 味の素株式会社 樹脂組成物
WO2018221681A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 封止用液状樹脂組成物及び電子部品装置
JP2020037652A (ja) 2018-09-04 2020-03-12 味の素株式会社 樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3043838B2 (ja) * 1991-06-05 2000-05-22 日本ユニカー株式会社 シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
BR112016012775B1 (pt) * 2013-12-18 2021-03-02 Dow Global Technologies Llc processo para formar um polímero e polímero
US10287387B2 (en) * 2014-09-11 2019-05-14 Kaneka Corporation Epoxy resin composition for casting
JP2018083893A (ja) * 2016-11-24 2018-05-31 日立化成株式会社 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234031A (ja) 2000-02-22 2001-08-28 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
WO2015104917A1 (ja) 2014-01-08 2015-07-16 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び樹脂封止半導体装置
JP2017119846A (ja) 2015-12-25 2017-07-06 味の素株式会社 樹脂組成物
JP2018150440A (ja) 2017-03-10 2018-09-27 味の素株式会社 樹脂組成物
WO2018221681A1 (ja) 2017-05-31 2018-12-06 日立化成株式会社 封止用液状樹脂組成物及び電子部品装置
JP2020037652A (ja) 2018-09-04 2020-03-12 味の素株式会社 樹脂組成物

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Publication number Publication date
CN114773780A (zh) 2022-07-22
JP2025029091A (ja) 2025-03-05
JP2022113053A (ja) 2022-08-03
KR20220106701A (ko) 2022-07-29
TW202244158A (zh) 2022-11-16

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