JP2022070657A - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP2022070657A JP2022070657A JP2020179834A JP2020179834A JP2022070657A JP 2022070657 A JP2022070657 A JP 2022070657A JP 2020179834 A JP2020179834 A JP 2020179834A JP 2020179834 A JP2020179834 A JP 2020179834A JP 2022070657 A JP2022070657 A JP 2022070657A
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- XNFGZQXMDBREDW-FLFKKZLDSA-N [(e)-dodec-2-enoyl] (e)-dodec-2-enoate Chemical compound CCCCCCCCC\C=C\C(=O)OC(=O)\C=C\CCCCCCCCC XNFGZQXMDBREDW-FLFKKZLDSA-N 0.000 description 1
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- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
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- 125000002947 alkylene group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
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- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- RRZKHZBOZDIQJG-UHFFFAOYSA-N azane;manganese Chemical compound N.[Mn] RRZKHZBOZDIQJG-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
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- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
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- 238000009835 boiling Methods 0.000 description 1
- XSEUMFJMFFMCIU-UHFFFAOYSA-N buformin Chemical compound CCCC\N=C(/N)N=C(N)N XSEUMFJMFFMCIU-UHFFFAOYSA-N 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- JWKNCJFGBOQAQL-UHFFFAOYSA-N butyl dodecaneperoxoate Chemical compound CCCCCCCCCCCC(=O)OOCCCC JWKNCJFGBOQAQL-UHFFFAOYSA-N 0.000 description 1
- DAQREMPZDNTSMS-UHFFFAOYSA-M butyl(triphenyl)phosphanium;thiocyanate Chemical compound [S-]C#N.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 DAQREMPZDNTSMS-UHFFFAOYSA-M 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- VUFGUVLLDPOSBC-XRZFDKQNSA-M cephalothin sodium Chemical compound [Na+].N([C@H]1[C@@H]2N(C1=O)C(=C(CS2)COC(=O)C)C([O-])=O)C(=O)CC1=CC=CS1 VUFGUVLLDPOSBC-XRZFDKQNSA-M 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000004700 cobalt complex Chemical class 0.000 description 1
- FCEOGYWNOSBEPV-FDGPNNRMSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FCEOGYWNOSBEPV-FDGPNNRMSA-N 0.000 description 1
- JUPWRUDTZGBNEX-UHFFFAOYSA-N cobalt;pentane-2,4-dione Chemical compound [Co].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O JUPWRUDTZGBNEX-UHFFFAOYSA-N 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 150000004696 coordination complex Chemical class 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- ZKXWKVVCCTZOLD-FDGPNNRMSA-N copper;(z)-4-hydroxypent-3-en-2-one Chemical compound [Cu].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O ZKXWKVVCCTZOLD-FDGPNNRMSA-N 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
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- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 description 1
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- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
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- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002168 ethanoic acid esters Chemical class 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
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- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- AQBLLJNPHDIAPN-LNTINUHCSA-K iron(3+);(z)-4-oxopent-2-en-2-olate Chemical compound [Fe+3].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O AQBLLJNPHDIAPN-LNTINUHCSA-K 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
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- 238000007561 laser diffraction method Methods 0.000 description 1
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- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
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- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- MZYHMUONCNKCHE-UHFFFAOYSA-N naphthalene-1,2,3,4-tetracarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=C(C(O)=O)C(C(O)=O)=C21 MZYHMUONCNKCHE-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- JFOJYGMDZRCSPA-UHFFFAOYSA-J octadecanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O JFOJYGMDZRCSPA-UHFFFAOYSA-J 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- CUQCMXFWIMOWRP-UHFFFAOYSA-N phenyl biguanide Chemical compound NC(N)=NC(N)=NC1=CC=CC=C1 CUQCMXFWIMOWRP-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
- RLJWTAURUFQFJP-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.CC(C)O.CC(C)O RLJWTAURUFQFJP-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- VXUYXOFXAQZZMF-UHFFFAOYSA-N tetraisopropyl titanate Substances CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 1
- GHPYAGKTTCKKDF-UHFFFAOYSA-M tetraphenylphosphanium;thiocyanate Chemical compound [S-]C#N.C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 GHPYAGKTTCKKDF-UHFFFAOYSA-M 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Abstract
Description
[1] (A)エポキシ樹脂、
(B)酸無水物系硬化剤、アミン系硬化剤、及びフェノール系硬化剤から選ばれる少なくとも1種の硬化剤、
(C)脂肪族構造を有するポリエステルポリオール樹脂、及び
(D)無機充填材、を含む樹脂組成物であって、
(C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、1質量%以上20質量%以下である、樹脂組成物。
[2] (A)成分が、縮合環骨格を含む、[1]に記載の樹脂組成物。
[3] (C)成分の末端が、ヒドロキシ基及びカルボキシル基のいずれかである、[1]又は[2]に記載の樹脂組成物。
[4] (C)成分が、ポリエステル由来の構造及びポリオール由来の構造を有する樹脂である、[1]~[3]のいずれかに記載の樹脂組成物。
[5] ポリオール由来の構造が、エチレンオキシド構造、プロピレンオキシド構造、及びブチレンオキシド構造のいずれかを含む、[4]に記載の樹脂組成物。
[6] (D)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、60質量%以上である、[1]~[5]のいずれかに記載の樹脂組成物。
[7] 封止層用である、[1]~[6]のいずれかに記載の樹脂組成物。
[8] 支持体と、該支持体上に設けられた、[1]~[7]のいずれかに記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
[9] [1]~[7]のいずれかに記載の樹脂組成物の硬化物により形成された硬化物層を含む、回路基板。
[10] [9]に記載の回路基板と、該回路基板上に搭載された半導体チップとを含む、半導体チップパッケージ。
[11] [1]~[7]のいずれかに記載の樹脂組成物、もしくは[8]に記載の樹脂シートにより封止された半導体チップを含む半導体チップパッケージ。
[12] [10]又は[11]に記載の半導体チップパッケージを備える半導体装置。
樹脂組成物は、(A)エポキシ樹脂、(B)酸無水物系硬化剤、アミン系硬化剤、及びフェノール系硬化剤から選ばれる少なくとも1種の硬化剤、(C)脂肪族構造を有するポリエステルポリオール樹脂、及び(D)無機充填材、を含む樹脂組成物であって、(C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、1質量%以上20質量%以下である。このような樹脂組成物によれば、他の層との接合強度が高く、線熱膨張係数が低く、反り及びフローマークの発生が抑制された硬化物を得ることができる。
樹脂組成物は、(A)成分として(A)エポキシ樹脂を含有する。(A)エポキシ樹脂としては、例えば、ビキシレノール型エポキシ樹脂、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリスフェノール型エポキシ樹脂、ナフトールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、tert-ブチル-カテコール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、線状脂肪族エポキシ樹脂、ブタジエン構造を有するエポキシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹脂、スピロ環含有エポキシ樹脂、シクロヘキサン型エポキシ樹脂、シクロヘキサンジメタノール型エポキシ樹脂、ナフチレンエーテル型エポキシ樹脂、トリメチロール型エポキシ樹脂、テトラフェニルエタン型エポキシ樹脂、グリシジルエーテル型エポキシ樹脂等が挙げられる。中でも、(A)成分としては、本発明の効果を顕著に得る観点から、ナフタレン型エポキシ樹脂、脂環式エポキシ樹脂、及びグリシジルエーテル型エポキシ樹脂から選択される1種以上が好ましく、ナフタレン型エポキシ樹脂、及び脂環式エポキシ樹脂のいずれかがより好ましい。中でも、(A)エポキシ樹脂としては、ナフタレン型エポキシ樹脂、ナフトール型エポキシ樹脂、アントラセン型エポキシ樹脂等の縮合環骨格を含むことが好ましい。エポキシ樹脂は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
樹脂の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により、ポリスチレン換算の値として測定できる。
樹脂組成物は、(B)成分として、(B)酸無水物系硬化剤、アミン系硬化剤、及びフェノール系硬化剤から選ばれる少なくとも1種の硬化剤を含有する。硬化剤は、通常、(A)成分と反応して樹脂組成物を硬化させる機能を有するが、特にこれら硬化剤を樹脂組成物に含有させることで、(A)成分と反応して樹脂組成物を硬化させる機能に加えて、反り及びフローマークの発生が抑制された硬化物を得ることが可能となる。(B)成分は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
樹脂組成物は、(C)成分として(C)脂肪族構造を有するポリエステルポリオール樹脂を含有する。(C)成分における脂肪族構造により、樹脂組成物の硬化物に柔軟性が付与され、その結果、反りの発生が抑制される。また、(C)成分におけるポリエステルポリオールの官能基により、樹脂組成物に含まれる他の成分との相溶性が、反りの発生及びフローマークの発生の抑制が維持される程度に向上することで、高い接合強度を有し且つ硬化物の反り及びフローマークの発生が抑制された硬化物を得ることが可能となる。また、(C)成分は樹脂組成物の硬化物に柔軟性を付与することから、硬化物の応力を緩和する作用を発揮できるので、硬化物の線熱膨張係数(CTE)を低くできる。(C)成分は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。
樹脂組成物は、(D)成分として(D)無機充填材を含有する。(D)無機充填材を樹脂組成物に含有させることで、線熱膨張係数が低い硬化物を得ることが可能となる。
樹脂組成物は、上述した成分以外に、任意の成分として、更に、(E)成分として硬化促進剤を含有していてもよい。
樹脂組成物は、上述した成分以外に、任意の成分として、更にその他の添加剤を含んでいてもよい。このような添加剤としては、例えば、着色剤、顔料、熱可塑性樹脂、増粘剤、消泡剤、レベリング剤、密着性付与剤等の樹脂添加剤などが挙げられる。これらの添加剤は、1種類単独で用いてもよく、2種類以上を組み合わせて用いてもよい。それぞれの含有量は当業者であれば適宜設定できる。
上述した樹脂組成物を用いた硬化物は、フローマークの発生が抑制されるという特性を示す。よって、前記の硬化物は、フローマークの発生が抑制された絶縁層又は封止層をもたらす。具体的に、樹脂組成物をシリコンウエハ上に圧縮成型し、樹脂組成物層を形成し、樹脂組成物層を加熱して硬化物の層を得る。この場合、硬化物の表面のフローマークの発生が抑制される。フローマークの発生の測定の詳細は、後述する実施例に記載の方法に従って測定することができる。
本発明の樹脂シートは、支持体と、該支持体上に設けられた樹脂組成物層と、を有する。樹脂組成物層は、本発明の樹脂組成物を含む層であり、通常は、樹脂組成物で形成されている。
本発明の回路基板は、本発明の樹脂組成物の硬化物により形成された硬化物層を含む。硬化物層は絶縁層又は封止層となりうる。この回路基板は、例えば、下記の工程(1)及び工程(2)を含む製造方法によって、製造できる。
(1)基材上に、樹脂組成物層を形成する工程。
(2)樹脂組成物層を熱硬化して、絶縁層を形成する工程。
例えば、樹脂シートを用いて回路基板を製造した場合、回路基板の製造方法は、樹脂シートの支持体を剥離する工程を含んでいてもよい。支持体は、樹脂組成物層の熱硬化の前に剥離してもよく、樹脂組成物層の熱硬化の後に剥離してもよい。
本発明の第一実施形態に係る半導体チップパッケージは、上述した回路基板と、この回路基板に搭載された半導体チップとを含む。この半導体チップパッケージは、回路基板に半導体チップを接合することにより、製造することができる。
(A)基材に仮固定フィルムを積層する工程、
(B)半導体チップを、仮固定フィルム上に仮固定する工程、
(C)本発明の樹脂シートの樹脂組成物層を、半導体チップ上に積層、又は本発明の樹脂組成物を半導体チップ上に塗布し、熱硬化させて封止層を形成する工程、
(D)基材及び仮固定フィルムを半導体チップから剥離する工程、
(E)半導体チップの基材及び仮固定フィルムを剥離した面に再配線形成層(絶縁層)を形成する工程、
(F)再配線形成層(絶縁層)上に導体層(再配線層)を形成する工程、及び
(G)導体層上にソルダーレジスト層を形成する工程、を含む。また、半導体チップパッケージの製造方法は、(H)複数の半導体チップパッケージを個々の半導体チップパッケージにダイシングし、個片化する工程を含み得る。
半導体装置は、半導体チップパッケージを備える。半導体装置としては、例えば、電気製品(例えば、コンピューター、携帯電話、スマートフォン、タブレット型デバイス、ウェラブルデバイス、デジタルカメラ、医療機器、及びテレビ等)及び乗物(例えば、自動二輪車、自動車、電車、船舶及び航空機等)等に供される各種半導体装置が挙げられる。
反応容器にε-カプロラクトンモノマー(ダイセル社製「プラクセルM」)22.6g、ポリプロピレングリコール、ジオール型、3,000(富士フィルム和光純薬社製)10g、2-エチルヘキサン酸すず(II)(富士フィルム和光純薬製)1.62gを仕込み、窒素雰囲気下130℃に昇温し、約16時間攪拌させ反応させた。反応後の生成物をクロロホルムに溶かし、その生成物をメタノールで再沈殿させたのち乾燥させ、脂肪族骨格からなるヒドロキシル基末端のポリエステルポリオール樹脂Aを得た。GPC分析からMn=9000であった。
反応容器にε-カプロラクトンモノマー(ダイセル社製「プラクセルM」)22.6g、ポリエチレングリコール1540(富士フィルム和光純薬社製)10g、2-エチルヘキサン酸すず(II)(富士フィルム和光純薬製)1.3gを仕込み、窒素雰囲気下130℃に昇温し、約16時間攪拌させ反応させた。反応後の生成物をクロロホルムに溶かし、その生成物をメタノールで再沈殿させたのち乾燥させ、脂肪族骨格からなるヒドロキシル基末端のポリエステルポリオール樹脂Bを得た。GPC分析からMn=4500であった。
反応容器にε-カプロラクトンモノマー(ダイセル社製「プラクセルM」)22.6g、ポリテトラメチレンエーテルグリコールPTMG1000(三菱ケミカル社製)10g、2-エチルヘキサン酸すず(II)(富士フィルム和光純薬製)1.3gを仕込み、窒素雰囲気下130℃に昇温し、約16時間攪拌させ反応させた。反応後の生成物をクロロホルムに溶かし、その生成物をメタノールで再沈殿させたのち乾燥させ、脂肪族骨格からなるヒドロキシル基末端のポリエステルポリオール樹脂Cを得た。GPC分析からMn=3100であった。
シリカA:平均粒径9μm、比表面積5.0m2/g、KBM573(信越化学工業社製)で表面処理されたもの。
シリカB:平均粒径1.6μm、比表面積3.4m2/g、KBM573(信越化学工業社製)で表面処理されたもの。
アルミナA:平均粒径8.4μm、比表面積0.9m2/g、KBM573(信越化学工業製)で表面処理されたもの。
ナフタレン型エポキシ樹脂(DIC社製「HP4032D」、エポキシ当量144g/eq.)8部、脂環型エポキシ樹脂(ダイセル社製「セロキサイド2021P」、エポキシ当量136g/eq.)6.6部、合成例1で得たポリエステルポリオールA 2.5部、アミン系硬化剤(日本化薬社製「カヤハードA-A」)0.5部、シリカA 80部、硬化促進剤(四国化成社製「2MA-OK-PW」)0.4部を、ミキサーを用いて均一に分散して、樹脂組成物1を得た。
ナフタレン型エポキシ樹脂(DIC社製「HP4032D」、エポキシ当量144g/eq.)3部、脂環型エポキシ樹脂(ダイセル社製「セロキサイド2021P」、エポキシ当量136g/eq.)3部、合成例1で得たポリエステルポリオールA 4部、酸無水物系硬化剤(新日本理化製「MH-700」)10部、シリカB 90部、硬化促進剤(四国化成社製「2MA-OK-PW」)0.5部を、ミキサーを用いて均一に分散して、樹脂組成物2を得た。
ナフタレン型エポキシ樹脂(DIC社製「HP4032D」、エポキシ当量144g/eq.)8部、脂環型エポキシ樹脂(ダイセル社製「セロキサイド2021P」、エポキシ当量136g/eq.)7部、2,2’-ジアリルビスフェノールA(大和化成工業社製:DABPA)1部、合成例1で得たポリエステルポリオールA 2部、シリカA 80部、硬化促進剤(四国化成社製「2MA-OK-PW」)0.4部を、ミキサーを用いて均一に分散して、樹脂組成物3を得た。
実施例2において、シリカB 90部を、アルミナA 120部に変えた。以上の事項以外は実施例2と同様にして樹脂組成物4を得た。
ナフタレン型エポキシ樹脂(DIC社製「HP4032D」、エポキシ当量144g/eq.)3部、脂環型エポキシ樹脂(ダイセル社製「セロキサイド2021P」、エポキシ当量136g/eq.)2部、グリシジルエーテル型エポキシ樹脂(ポリエーテルグリコールジグリシジルエーテル、ナガセケムテックス社製「EX-992L」、エポキシ当量680g/eq.)1部、合成例1で得たポリエステルポリオールA 9部、酸無水物系硬化剤(新日本理化製「MH-700」)10部、シリカA 100部、硬化促進剤(四国化成社製「2MA-OK-PW」)0.5部を、ミキサーを用いて均一に分散して、樹脂組成物5を得た。
実施例2において、ポリエステルポリオール樹脂A 4部を、ポリエステルポリオール樹脂B 4部に変えた。以上の事項以外は実施例2と同様にして樹脂組成物6を得た。
実施例3において、ポリエステルポリオール樹脂A 2部を、ポリエステルポリオール樹脂C 2部に変えた。以上の事項以外は実施例3と同様にして樹脂組成物7を得た。
実施例5において、グリシジルエーテル型エポキシ樹脂(ポリエーテルグリコールジグリシジルエーテル、ナガセケムテックス社製「EX-992L」、エポキシ当量680g/eq.)1部を、フルオレン型エポキシ樹脂(大阪ガスケミカル社製、「EG-280」、エポキシ当量460g/eq.)1部に変えた。以上の事項以外は実施例5と同様にして樹脂組成物8を得た。
実施例1において、合成例1で得たポリエステルポリオールA 2.5部を用いなかった。以上の事項以外は実施例1と同様にして樹脂組成物9を得た。
実施例2において、合成例1で得たポリエステルポリオールAの量を4部から0.5部に変え、シリカB 90部を、シリカA 100部に変えた。以上の事項以外は実施例2と同様にして樹脂組成物10を得た。
実施例2において、合成例1で得たポリエステルポリオールAの量を4部から35部に変え、シリカB 90部を、シリカA 100部に変えた。以上の事項以外は実施例2と同様にして樹脂組成物11を得た。
12インチシリコンウエハ上に、実施例及び比較例で作製した樹脂組成物を、コンプレッションモールド装置(金型温度:130℃、圧力:6MPa、キュアタイム:10分)を用いて圧縮成型して、厚さ300μmの樹脂組成物層を形成した。その後、150℃で60分間加熱させた後、樹脂組成物層の表面を目視にてフローマークを確認し、以下の基準で評価した。
〇:フローマークがない。
×:フローマークがある。
ポリイミドが塗布されたシリコンウエハ上に、直径4mmにくり抜いたシリコンラバー枠を用いて、実施例及び比較例で作製した樹脂組成物を高さ5mmの円柱状に充填した。180℃90分加熱した後、シリコンラバー枠を外すことで、樹脂組成物の硬化物からなる試験片を作製した。ボンドテスター(Dage社製 シリーズ4000)にてヘッド位置がシリコンウエハから1mm、ヘッドスピード700μm/sの条件でポリイミドと樹脂組成物の硬化物の界面のシェア強度を測定した。試験は5回実施し、その平均値を用い、以下の基準で評価した。
◎:シェア強度が2.5kgf/mm2以上。
〇:シェア強度が2.0kgf/mm2以上、2.5kgf/mm2未満。
△:シェア強度が1.7kgf/mm2以上、2.0kgf/mm2未満。
×:シェア強度が1.7kgf/mm2未満。
12インチシリコンウエハ上に、実施例及び比較例で調製した樹脂組成物を、コンプレッションモールド装置(金型温度:130℃、圧力:6MPa、キュアタイム:10分)を用いて圧縮成型して、厚さ300μmの樹脂組成物層を形成した。その後、180℃で90分加熱して、樹脂組成物層を熱硬化させた。これにより、シリコンウエハと樹脂組成物の硬化物層とを含む試料基板を得た。シャドウモアレ測定装置(Akorometrix社製「ThermoireAXP」)を用いて、前記の試料基板を25℃での反り量を測定した。測定は、電子情報技術産業協会規格のJEITA EDX-7311-24に準拠して行った。具体的には、測定領域の基板面の全データの最小二乗法によって算出した仮想平面を基準面として、その基準面から垂直方向の最小値と最大値との差を反り量として求め、以下の基準で評価した。
◎:反り量が1.8mm未満。
〇:反り量が1.8mm以上2mm未満。
×:反り量が2mm以上。
離型処理した12インチシリコンウエハ上に、実施例及び比較例で作製した樹脂組成物を、コンプレッションモールド装置(金型温度:130℃、圧力:6MPa、キュアタイム:10分)を用いて圧縮成型して、厚さ300μmの樹脂組成物層を形成した。その後、離型処理した12インチシリコンウエハから樹脂組成物層を剥がし、150℃で60分間加熱して樹脂組成物層を熱硬化させ硬化物サンプルを作製した。硬化物サンプルを幅5mm、長さ15mmに切断して、試験片を得た。この試験片について、熱機械分析装置(リガク社製「ThermoPlus TMA8310」)を用いて、引張加重法にて熱機械分析を行った。詳細には、試験片を前記熱機械分析装置に装着した後、荷重1g、昇温速度5℃/分の測定条件にて、連続して2回測定を行った。そして、2回目の測定において、25℃から150℃までの範囲における平面方向の線熱膨張係数(ppm/℃)を算出し、以下の基準で評価した。
◎:13ppm/℃未満。
〇:13ppm以上15ppm/℃未満。
×:15ppm/℃以上。
Claims (12)
- (A)エポキシ樹脂、
(B)酸無水物系硬化剤、アミン系硬化剤、及びフェノール系硬化剤から選ばれる少なくとも1種の硬化剤、
(C)脂肪族構造を有するポリエステルポリオール樹脂、及び
(D)無機充填材、を含む樹脂組成物であって、
(C)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、1質量%以上20質量%以下である、樹脂組成物。 - (A)成分が、縮合環骨格を含む、請求項1に記載の樹脂組成物。
- (C)成分の末端が、ヒドロキシ基及びカルボキシル基のいずれかである、請求項1又は2に記載の樹脂組成物。
- (C)成分が、ポリエステル由来の構造及びポリオール由来の構造を有する樹脂である、請求項1~3のいずれか1項に記載の樹脂組成物。
- ポリオール由来の構造が、エチレンオキシド構造、プロピレンオキシド構造、及びブチレンオキシド構造のいずれかを含む、請求項4に記載の樹脂組成物。
- (D)成分の含有量が、樹脂組成物中の不揮発成分を100質量%とした場合、60質量%以上である、請求項1~5のいずれか1項に記載の樹脂組成物。
- 封止層用である、請求項1~6のいずれか1項に記載の樹脂組成物。
- 支持体と、該支持体上に設けられた、請求項1~7のいずれか1項に記載の樹脂組成物を含む樹脂組成物層とを含む、樹脂シート。
- 請求項1~7のいずれか1項に記載の樹脂組成物の硬化物により形成された硬化物層を含む、回路基板。
- 請求項9に記載の回路基板と、該回路基板上に搭載された半導体チップとを含む、半導体チップパッケージ。
- 請求項1~7のいずれか1項に記載の樹脂組成物、もしくは請求項8に記載の樹脂シートにより封止された半導体チップを含む半導体チップパッケージ。
- 請求項10又は11に記載の半導体チップパッケージを備える半導体装置。
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