CN114773780A - 树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置 - Google Patents

树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置 Download PDF

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Publication number
CN114773780A
CN114773780A CN202210059849.0A CN202210059849A CN114773780A CN 114773780 A CN114773780 A CN 114773780A CN 202210059849 A CN202210059849 A CN 202210059849A CN 114773780 A CN114773780 A CN 114773780A
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CN
China
Prior art keywords
resin composition
cured product
resin
mass
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210059849.0A
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English (en)
Chinese (zh)
Inventor
阪内启之
佐佐木成
胁坂安晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN114773780A publication Critical patent/CN114773780A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202210059849.0A 2021-01-22 2022-01-19 树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置 Pending CN114773780A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-009158 2021-01-22
JP2021009158A JP7631828B2 (ja) 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置

Publications (1)

Publication Number Publication Date
CN114773780A true CN114773780A (zh) 2022-07-22

Family

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Family Applications (1)

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CN202210059849.0A Pending CN114773780A (zh) 2021-01-22 2022-01-19 树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置

Country Status (3)

Country Link
JP (2) JP7631828B2 (https=)
KR (1) KR20220106701A (https=)
CN (1) CN114773780A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115923033A (zh) * 2022-12-20 2023-04-07 四川汇源塑料光纤有限公司 一种光纤接收器件的注塑模具及生产方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024100934A1 (https=) * 2022-11-10 2024-05-16
JP2024074518A (ja) * 2022-11-21 2024-05-31 旭化成株式会社 エポキシ樹脂組成物
JP7772029B2 (ja) 2023-06-06 2025-11-18 味の素株式会社 樹脂組成物
CN117106398B (zh) * 2023-08-22 2024-04-16 湖北三选科技有限公司 一种印刷用液态模封胶、芯片及其制备方法
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
KR20260006910A (ko) 2024-07-05 2026-01-13 한화이센셜 주식회사 열경화성 절연수지 및 이를 이용한 절연필름

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JP3043838B2 (ja) * 1991-06-05 2000-05-22 日本ユニカー株式会社 シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4538882B2 (ja) 2000-02-22 2010-09-08 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
EP3083749B1 (en) * 2013-12-18 2020-01-22 Dow Global Technologies LLC Process for forming an organic polymer in a reaction of a polyene, an epoxy resin and a mixture of thiol and amine curing agents
US9711378B2 (en) 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
WO2016039232A1 (ja) * 2014-09-11 2016-03-17 株式会社カネカ 注型用エポキシ樹脂組成物
TWI737649B (zh) 2015-12-25 2021-09-01 日商味之素股份有限公司 樹脂組成物
JP2018083893A (ja) * 2016-11-24 2018-05-31 日立化成株式会社 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法
JP7066975B2 (ja) 2017-03-10 2022-05-16 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
PT3620481T (pt) 2017-05-31 2024-04-08 Namics Corp Composição de resina líquida para selagem e dispositivo de componentes eletrónicos
JP7424743B2 (ja) 2018-09-04 2024-01-30 味の素株式会社 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115923033A (zh) * 2022-12-20 2023-04-07 四川汇源塑料光纤有限公司 一种光纤接收器件的注塑模具及生产方法

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JP2022113053A (ja) 2022-08-03
KR20220106701A (ko) 2022-07-29
JP7631828B2 (ja) 2025-02-19
TW202244158A (zh) 2022-11-16
JP2025029091A (ja) 2025-03-05

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