KR20220106701A - 수지 조성물, 수지 페이스트, 경화물, 반도체 칩 패키지 및 반도체 장치 - Google Patents

수지 조성물, 수지 페이스트, 경화물, 반도체 칩 패키지 및 반도체 장치 Download PDF

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Publication number
KR20220106701A
KR20220106701A KR1020220008136A KR20220008136A KR20220106701A KR 20220106701 A KR20220106701 A KR 20220106701A KR 1020220008136 A KR1020220008136 A KR 1020220008136A KR 20220008136 A KR20220008136 A KR 20220008136A KR 20220106701 A KR20220106701 A KR 20220106701A
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KR
South Korea
Prior art keywords
resin composition
resin
epoxy resin
mass
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220008136A
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English (en)
Korean (ko)
Inventor
히로유키 사카우치
미노루 사사키
야스아키 와키사카
Original Assignee
아지노모토 가부시키가이샤
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Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20220106701A publication Critical patent/KR20220106701A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020220008136A 2021-01-22 2022-01-19 수지 조성물, 수지 페이스트, 경화물, 반도체 칩 패키지 및 반도체 장치 Pending KR20220106701A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021009158A JP7631828B2 (ja) 2021-01-22 2021-01-22 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置
JPJP-P-2021-009158 2021-01-22

Publications (1)

Publication Number Publication Date
KR20220106701A true KR20220106701A (ko) 2022-07-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220008136A Pending KR20220106701A (ko) 2021-01-22 2022-01-19 수지 조성물, 수지 페이스트, 경화물, 반도체 칩 패키지 및 반도체 장치

Country Status (3)

Country Link
JP (2) JP7631828B2 (https=)
KR (1) KR20220106701A (https=)
CN (1) CN114773780A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260006910A (ko) 2024-07-05 2026-01-13 한화이센셜 주식회사 열경화성 절연수지 및 이를 이용한 절연필름

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024100934A1 (https=) * 2022-11-10 2024-05-16
JP2024074518A (ja) * 2022-11-21 2024-05-31 旭化成株式会社 エポキシ樹脂組成物
CN115923033B (zh) * 2022-12-20 2026-04-14 四川汇源塑料光纤有限公司 一种光纤接收器件的注塑模具及生产方法
JP7772029B2 (ja) 2023-06-06 2025-11-18 味の素株式会社 樹脂組成物
CN117106398B (zh) * 2023-08-22 2024-04-16 湖北三选科技有限公司 一种印刷用液态模封胶、芯片及其制备方法
JP7852657B2 (ja) * 2024-02-01 2026-04-28 味の素株式会社 樹脂組成物
WO2025203722A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法
JP7606797B1 (ja) * 2024-03-26 2024-12-26 ナミックス株式会社 液状コンプレッションモールド材、電子部品、半導体装置および電子部品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料

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JP3043838B2 (ja) * 1991-06-05 2000-05-22 日本ユニカー株式会社 シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物
JPH10195179A (ja) * 1997-01-08 1998-07-28 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4538882B2 (ja) 2000-02-22 2010-09-08 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
BR112016012775B1 (pt) * 2013-12-18 2021-03-02 Dow Global Technologies Llc processo para formar um polímero e polímero
US9711378B2 (en) 2014-01-08 2017-07-18 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
US10287387B2 (en) * 2014-09-11 2019-05-14 Kaneka Corporation Epoxy resin composition for casting
TWI737649B (zh) 2015-12-25 2021-09-01 日商味之素股份有限公司 樹脂組成物
JP2018083893A (ja) * 2016-11-24 2018-05-31 日立化成株式会社 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法
JP7066975B2 (ja) 2017-03-10 2022-05-16 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
EP3620481B1 (en) 2017-05-31 2024-03-27 Resonac Corporation Liquid resin composition for sealing and electronic component apparatus
JP7424743B2 (ja) 2018-09-04 2024-01-30 味の素株式会社 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260006910A (ko) 2024-07-05 2026-01-13 한화이센셜 주식회사 열경화성 절연수지 및 이를 이용한 절연필름

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JP7631828B2 (ja) 2025-02-19
CN114773780A (zh) 2022-07-22
JP2025029091A (ja) 2025-03-05
JP2022113053A (ja) 2022-08-03
TW202244158A (zh) 2022-11-16

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