JP7626252B2 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
JP7626252B2
JP7626252B2 JP2023573870A JP2023573870A JP7626252B2 JP 7626252 B2 JP7626252 B2 JP 7626252B2 JP 2023573870 A JP2023573870 A JP 2023573870A JP 2023573870 A JP2023573870 A JP 2023573870A JP 7626252 B2 JP7626252 B2 JP 7626252B2
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JP
Japan
Prior art keywords
conductor
interlayer connection
region
layer
insulator layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023573870A
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English (en)
Japanese (ja)
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JPWO2023135931A1 (https=
JPWO2023135931A5 (https=
Inventor
恒亮 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2023135931A1 publication Critical patent/JPWO2023135931A1/ja
Publication of JPWO2023135931A5 publication Critical patent/JPWO2023135931A5/ja
Application granted granted Critical
Publication of JP7626252B2 publication Critical patent/JP7626252B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023573870A 2022-01-13 2022-11-17 多層基板 Active JP7626252B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003656 2022-01-13
JP2022003656 2022-01-13
PCT/JP2022/042723 WO2023135931A1 (ja) 2022-01-13 2022-11-17 多層基板

Publications (3)

Publication Number Publication Date
JPWO2023135931A1 JPWO2023135931A1 (https=) 2023-07-20
JPWO2023135931A5 JPWO2023135931A5 (https=) 2024-07-09
JP7626252B2 true JP7626252B2 (ja) 2025-02-04

Family

ID=87278911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573870A Active JP7626252B2 (ja) 2022-01-13 2022-11-17 多層基板

Country Status (4)

Country Link
US (1) US20240292535A1 (https=)
JP (1) JP7626252B2 (https=)
CN (1) CN221807328U (https=)
WO (1) WO2023135931A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120881855A (zh) * 2024-04-30 2025-10-31 株式会社村田制作所 多层基板和多层基板的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058938A1 (ja) 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
WO2012147484A1 (ja) 2011-04-26 2012-11-01 株式会社村田製作所 リジッドフレキシブル基板およびその製造方法
WO2015015975A1 (ja) 2013-07-30 2015-02-05 株式会社村田製作所 多層基板および多層基板の製造方法
WO2017199824A1 (ja) 2016-05-18 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5800301B2 (ja) * 2009-09-14 2015-10-28 日本碍子株式会社 銅合金箔、それを用いたフレキシブルプリント基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011058938A1 (ja) 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
WO2012147484A1 (ja) 2011-04-26 2012-11-01 株式会社村田製作所 リジッドフレキシブル基板およびその製造方法
WO2015015975A1 (ja) 2013-07-30 2015-02-05 株式会社村田製作所 多層基板および多層基板の製造方法
WO2017199824A1 (ja) 2016-05-18 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Also Published As

Publication number Publication date
WO2023135931A1 (ja) 2023-07-20
JPWO2023135931A1 (https=) 2023-07-20
CN221807328U (zh) 2024-10-01
US20240292535A1 (en) 2024-08-29

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