JPWO2023135931A1 - - Google Patents

Info

Publication number
JPWO2023135931A1
JPWO2023135931A1 JP2023573870A JP2023573870A JPWO2023135931A1 JP WO2023135931 A1 JPWO2023135931 A1 JP WO2023135931A1 JP 2023573870 A JP2023573870 A JP 2023573870A JP 2023573870 A JP2023573870 A JP 2023573870A JP WO2023135931 A1 JPWO2023135931 A1 JP WO2023135931A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023573870A
Other languages
Japanese (ja)
Other versions
JPWO2023135931A5 (https=
JP7626252B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023135931A1 publication Critical patent/JPWO2023135931A1/ja
Publication of JPWO2023135931A5 publication Critical patent/JPWO2023135931A5/ja
Application granted granted Critical
Publication of JP7626252B2 publication Critical patent/JP7626252B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023573870A 2022-01-13 2022-11-17 多層基板 Active JP7626252B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022003656 2022-01-13
JP2022003656 2022-01-13
PCT/JP2022/042723 WO2023135931A1 (ja) 2022-01-13 2022-11-17 多層基板

Publications (3)

Publication Number Publication Date
JPWO2023135931A1 true JPWO2023135931A1 (https=) 2023-07-20
JPWO2023135931A5 JPWO2023135931A5 (https=) 2024-07-09
JP7626252B2 JP7626252B2 (ja) 2025-02-04

Family

ID=87278911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573870A Active JP7626252B2 (ja) 2022-01-13 2022-11-17 多層基板

Country Status (4)

Country Link
US (1) US20240292535A1 (https=)
JP (1) JP7626252B2 (https=)
CN (1) CN221807328U (https=)
WO (1) WO2023135931A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120881855A (zh) * 2024-04-30 2025-10-31 株式会社村田制作所 多层基板和多层基板的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5800301B2 (ja) * 2009-09-14 2015-10-28 日本碍子株式会社 銅合金箔、それを用いたフレキシブルプリント基板
WO2011058938A1 (ja) * 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
CN106332474B (zh) * 2011-04-26 2020-08-14 株式会社村田制作所 刚性柔性基板及其制造方法
CN205093052U (zh) * 2013-07-30 2016-03-16 株式会社村田制作所 多层基板
CN209462743U (zh) * 2016-05-18 2019-10-01 株式会社村田制作所 多层基板以及电子设备

Also Published As

Publication number Publication date
WO2023135931A1 (ja) 2023-07-20
JP7626252B2 (ja) 2025-02-04
CN221807328U (zh) 2024-10-01
US20240292535A1 (en) 2024-08-29

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