JP7587167B2 - 電解質膜支持型還元電極の製造方法 - Google Patents

電解質膜支持型還元電極の製造方法 Download PDF

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Publication number
JP7587167B2
JP7587167B2 JP2022566519A JP2022566519A JP7587167B2 JP 7587167 B2 JP7587167 B2 JP 7587167B2 JP 2022566519 A JP2022566519 A JP 2022566519A JP 2022566519 A JP2022566519 A JP 2022566519A JP 7587167 B2 JP7587167 B2 JP 7587167B2
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Prior art keywords
electrolyte membrane
reduction
electrode
carbon dioxide
reduction electrode
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JP2022566519A
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Japanese (ja)
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JPWO2022118364A1 (https=
Inventor
紗弓 里
裕也 渦巻
晃洋 鴻野
武志 小松
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NTT Inc
NTT Inc USA
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Nippon Telegraph and Telephone Corp
NTT Inc USA
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
    • C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
JP2022566519A 2020-12-01 2020-12-01 電解質膜支持型還元電極の製造方法 Active JP7587167B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/044615 WO2022118364A1 (ja) 2020-12-01 2020-12-01 電解質膜支持型還元電極の製造方法

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JPWO2022118364A1 JPWO2022118364A1 (https=) 2022-06-09
JP7587167B2 true JP7587167B2 (ja) 2024-11-20

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WO (1) WO2022118364A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004197215A (ja) 2002-08-23 2004-07-15 Eamex Co メッキによる電極形成方法、積層体及びこの積層体を用いた装置
JP2008223118A (ja) 2007-03-15 2008-09-25 Mitsubishi Electric Corp 固体高分子電解質膜、その製造方法、および電気分解素子
WO2020121556A1 (ja) 2018-12-10 2020-06-18 日本電信電話株式会社 二酸化炭素の気相還元装置及び二酸化炭素の気相還元方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS425014B1 (https=) * 1962-09-20 1967-03-01
JPS5538934A (en) * 1978-09-07 1980-03-18 Agency Of Ind Science & Technol Production of ion exchange membrane-catalyst electrode bonded material
JPS58185790A (ja) * 1982-04-20 1983-10-29 Hitachi Zosen Corp イオン交換膜における電極の形成方法
KR20170138813A (ko) * 2016-06-08 2017-12-18 (주)엘켐텍 광수전해 수소 발생용 막전극접합체 및 그 제조방법과 이를 구비한 광수전해 셀

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004197215A (ja) 2002-08-23 2004-07-15 Eamex Co メッキによる電極形成方法、積層体及びこの積層体を用いた装置
JP2008223118A (ja) 2007-03-15 2008-09-25 Mitsubishi Electric Corp 固体高分子電解質膜、その製造方法、および電気分解素子
WO2020121556A1 (ja) 2018-12-10 2020-06-18 日本電信電話株式会社 二酸化炭素の気相還元装置及び二酸化炭素の気相還元方法

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JPWO2022118364A1 (https=) 2022-06-09

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