JP7581616B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7581616B2
JP7581616B2 JP2021554293A JP2021554293A JP7581616B2 JP 7581616 B2 JP7581616 B2 JP 7581616B2 JP 2021554293 A JP2021554293 A JP 2021554293A JP 2021554293 A JP2021554293 A JP 2021554293A JP 7581616 B2 JP7581616 B2 JP 7581616B2
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component
resin composition
group
acid
composition according
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Japanese (ja)
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JPWO2021085103A1 (cg-RX-API-DMAC7.html
Inventor
卓宏 橋本
哲徳 曽我
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ThreeBond Co Ltd
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ThreeBond Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/309—Sulfur containing acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/329—Phosphorus containing acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021554293A 2019-10-30 2020-10-12 樹脂組成物 Active JP7581616B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019197901 2019-10-30
JP2019197901 2019-10-30
PCT/JP2020/038514 WO2021085103A1 (ja) 2019-10-30 2020-10-12 樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2021085103A1 JPWO2021085103A1 (cg-RX-API-DMAC7.html) 2021-05-06
JP7581616B2 true JP7581616B2 (ja) 2024-11-13

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ID=75715138

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JP2021554293A Active JP7581616B2 (ja) 2019-10-30 2020-10-12 樹脂組成物

Country Status (6)

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US (1) US20220396650A1 (cg-RX-API-DMAC7.html)
EP (1) EP4053205A4 (cg-RX-API-DMAC7.html)
JP (1) JP7581616B2 (cg-RX-API-DMAC7.html)
KR (1) KR20220093114A (cg-RX-API-DMAC7.html)
CN (1) CN114630870B (cg-RX-API-DMAC7.html)
WO (1) WO2021085103A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230383083A1 (en) * 2020-10-01 2023-11-30 Cabot Corporation Flexible Polyurethane Foam and Formulation Thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006028311A (ja) 2004-07-14 2006-02-02 Shin Etsu Chem Co Ltd 耐熱性に優れるシリコーン粘着剤組成物および製造方法
JP2008284408A (ja) 2007-05-15 2008-11-27 Asahi Kasei Chemicals Corp 防汚層の形成方法
JP2013023683A (ja) 2011-07-26 2013-02-04 Nicca Chemical Co Ltd コーティング組成物およびコーティング膜付き物品
WO2018163333A1 (ja) 2017-03-08 2018-09-13 三菱電機株式会社 無線通信装置および無線通信方法

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US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US4477607A (en) * 1983-08-31 1984-10-16 Loctite Corporation Thixotropic cyanoacrylate compositions
JPH0694548B2 (ja) * 1985-07-19 1994-11-24 高圧ガス工業株式会社 α―シアノアクリレート接着剤組成物
JPS62143908A (ja) * 1985-12-19 1987-06-27 Toagosei Chem Ind Co Ltd 光硬化型組成物
JP4040352B2 (ja) * 2002-04-23 2008-01-30 コニシ株式会社 硬化性樹脂組成物
JP2003327833A (ja) * 2002-05-07 2003-11-19 Shin Etsu Chem Co Ltd 自己接着性オルガノポリシロキサン組成物
WO2007123167A1 (ja) * 2006-04-20 2007-11-01 Kaneka Corporation 硬化性組成物
JP4806775B2 (ja) * 2007-05-16 2011-11-02 株式会社ソフイア 遊技機
JP5857746B2 (ja) * 2009-12-22 2016-02-10 三菱化学株式会社 半導体発光装置用樹脂成形体用材料
WO2013106193A1 (en) * 2011-12-29 2013-07-18 3M Innovative Properties Company Curable polysiloxane composition
JP6000667B2 (ja) * 2012-06-07 2016-10-05 コニシ株式会社 硬化性樹脂組成物
JP2014114434A (ja) * 2012-11-14 2014-06-26 Kaneka Corp 硬化性組成物
US20150299543A1 (en) * 2012-12-07 2015-10-22 Dow Corning Toray Co., Ltd. Curable Silicone Composition And Optical Semiconductor Device
JP2014221892A (ja) * 2013-05-14 2014-11-27 株式会社カネカ 表示パネル用接着剤及びそれを用いた表示パネル又は表示パネルの製造方法
JP6338327B2 (ja) 2013-06-27 2018-06-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
WO2016043082A1 (ja) * 2014-09-17 2016-03-24 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
WO2016163333A1 (ja) * 2015-04-08 2016-10-13 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 電気・電子部品用樹脂組成物
CN111423686A (zh) * 2015-10-02 2020-07-17 株式会社钟化 固化性组合物
JP6938840B2 (ja) * 2016-06-28 2021-09-22 株式会社スリーボンド 硬化性樹脂組成物、燃料電池およびシール方法
JP7045693B2 (ja) * 2017-05-19 2022-04-01 オート化学工業株式会社 硬化性組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006028311A (ja) 2004-07-14 2006-02-02 Shin Etsu Chem Co Ltd 耐熱性に優れるシリコーン粘着剤組成物および製造方法
JP2008284408A (ja) 2007-05-15 2008-11-27 Asahi Kasei Chemicals Corp 防汚層の形成方法
JP2013023683A (ja) 2011-07-26 2013-02-04 Nicca Chemical Co Ltd コーティング組成物およびコーティング膜付き物品
WO2018163333A1 (ja) 2017-03-08 2018-09-13 三菱電機株式会社 無線通信装置および無線通信方法

Also Published As

Publication number Publication date
EP4053205A1 (en) 2022-09-07
CN114630870B (zh) 2023-09-15
JPWO2021085103A1 (cg-RX-API-DMAC7.html) 2021-05-06
KR20220093114A (ko) 2022-07-05
EP4053205A4 (en) 2023-11-08
CN114630870A (zh) 2022-06-14
WO2021085103A1 (ja) 2021-05-06
US20220396650A1 (en) 2022-12-15

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